KR880010475A - 웨이퍼 운반장치 - Google Patents

웨이퍼 운반장치 Download PDF

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Publication number
KR880010475A
KR880010475A KR1019880001178A KR880001178A KR880010475A KR 880010475 A KR880010475 A KR 880010475A KR 1019880001178 A KR1019880001178 A KR 1019880001178A KR 880001178 A KR880001178 A KR 880001178A KR 880010475 A KR880010475 A KR 880010475A
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KR
South Korea
Prior art keywords
plane
support arm
wafer
semiconductor wafer
wafer support
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Application number
KR1019880001178A
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English (en)
Other versions
KR970000967B1 (ko
Inventor
바이에르즈 윌리암
코체르스퍼저 피터
Original Assignee
씨. 웬델 버저, 제이알
퍼킨-엘머 코퍼레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 씨. 웬델 버저, 제이알, 퍼킨-엘머 코퍼레이션 filed Critical 씨. 웬델 버저, 제이알
Publication of KR880010475A publication Critical patent/KR880010475A/ko
Application granted granted Critical
Publication of KR970000967B1 publication Critical patent/KR970000967B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)

Abstract

내용 없음

Description

웨이퍼 운반장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 장치의 작동원리를 예시하는 개략도.
제2도는 실제 장치의 평면도.
제3도는 제2 장치의 내부 구조를 예시하기 위하여 이 장치의 부품들이 분해된 제2도 장치의 좌단면도.

Claims (13)

  1. 베이스 부재 상기 베이스 부재상에 설치된 제1구동장치, 상기 구동장치에 의해 제1위치와 제2위치사이에서 회전하기 위하여 상기 구동장치에 연결된 운반부재. 상기 운반부재로 지지되고 제1평면과 제2평면사이에서 상기 운반부재와 함께 회전가능한 웨이퍼 지지암 및 최초 위치와 최종위치가 상기 운반부재에관하여 동일한 상기 최초위치로부터 상기 제1평면의 중간 위치로까지로 그리고 상기 중간 위치로부터 상기제2 평면의 상기 최종위치까지로 상기 웨이퍼 지지암을 회전하기위하여 상기 운반부재로 지지된 제2구동장치를 포함하는 제1평면의 미리 설정된 최초위치로부터 제2평면의 미리 설정된 최종위치까지로 반도체 웨이퍼를 운반하는 장치.
  2. 제1항에 있어서, 상기 베이스부재에 부착된 지지부재를 더욱 포함하여, 상기 베이스 부재가 상기 최초위치를 설정하기 위한 제1리미트 멈추개를 포함하며, 상기 지지부재는 상기 최종위치를 설정하기 위한 제2리미트 멈추개를 포함하고, 상기 웨이퍼 지지암은 상기 제 1리미트 멈추개와 상기 제2리미트 멈추개중 어느 하나와 결함 가능한 최소한 하나의 제3리미트 멈추개를 포함하는 장치.
  3. 제2항에 있어서, 상기 최소한 하나의 제3리미트 멈추개가 하나의 볼 또는 오목 원추체를 포함하고 각각의 상기 제1 및 제2리미트 멈추개들이 상기 볼 또는 오목 원추체의 나머지를 포함하는 장치.
  4. 제1항에 있어서, 상기 제1구동장치가 모터와 기어 열을 포함하는 장치.
  5. 제4항에 있어서, 상기 제2구동장치가 모터와 기어 열을 포함하는 장치.
  6. 제1항에 있어서, 상기 제1평면과 제2평면이 수직인 장치.
  7. 제1항에 있어서, 상기 웨이퍼 지지암이 상기 반도체 웨이퍼를 고정시키기 위한 진공 홈을 정하는 장치.
  8. 제3항에 있어서, 각각의 상기 제1구동장치와 제2구동장치가 모터가 기어 열을 포함하는 장치.
  9. 제8항에 있어서, 상기 제1평면과 제2평면이 수직인 장치.
  10. 제9항에 있어서, 상기 웨이퍼 지지암이 상기 반도체 웨이퍼를 고정시키기 위한 진공 홈을 정하는 장치.
  11. 지지부, 상기 지지부에 회전가능하게 부착된 운반부재, 제1평면에 평행한 축에 관하여 상기 운반부재를 회전시키기위하여 상기 지지부에 부착된 장치. 상기 운반부재에 회전 가능하게 부착된 웨이퍼 지지암.상기 웨이퍼 지지암을 회전시키기 위하여 상기 운반부재에 부착되어 상기 운반부재와 함께 이동할 수 있는장치. 상기 지지부에 관한 상기 웨이퍼 지지암을 제1평면에 정확하게 위치시키기 위하여 상기 지지부와 상기 웨이퍼 지지암과 관련된 제1장치 및 상기 지지부에 관한 상기 웨이퍼 지지암을 제2평면에 정확하게 위치시키기위하여 상기 지지부와 상기 웨이퍼 지지암과 관련된 제2장치를 포함하는 제1평면의 미리 결정된 제1위치로 부토 제2평면의 미리 결정된 제2위치로 반도체 웨이퍼를 운반하는 장치.
  12. 제11항에 있어서, 정확하게 위치시키기위한 상기 제1장치와 제2장치가 접합 볼들과 오목 원추체들을 포함하는 반도체 웨이퍼 운반장치.
  13. 반도체 웨이퍼를 제1평면의 최소위치에 위치시키는 단계. 제1평면에 수직인 제1축에 관하여 반도체 웨이퍼를 제1중간위치로 회전시키는 단계. 제1평면과 제2평면에 평행한 제2축에 관하여 반도체 웨이퍼를 제2평면의 제2중간위치로 회전시키는 단계. 제2평면에 수직인 제3축에 관하여 반도체 웨이퍼를 최초위치로 회전시키는 단계를 포함하는 제1평면의 최초위치로부터 제1평면에 수직인 제2평면의 최종위치로 반도체 웨이퍼를 운반하는 방법.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880001178A 1987-02-09 1988-02-09 웨이퍼 운반 장치 KR970000967B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US012,537 1987-02-09
US07/012,537 US4778332A (en) 1987-02-09 1987-02-09 Wafer flip apparatus
US012537 1996-02-29

Publications (2)

Publication Number Publication Date
KR880010475A true KR880010475A (ko) 1988-10-10
KR970000967B1 KR970000967B1 (ko) 1997-01-21

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ID=21755435

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880001178A KR970000967B1 (ko) 1987-02-09 1988-02-09 웨이퍼 운반 장치

Country Status (6)

Country Link
US (1) US4778332A (ko)
EP (1) EP0278460B1 (ko)
JP (1) JP2550130B2 (ko)
KR (1) KR970000967B1 (ko)
CA (1) CA1278879C (ko)
DE (1) DE3852770T2 (ko)

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Also Published As

Publication number Publication date
EP0278460A3 (en) 1990-07-18
EP0278460B1 (en) 1995-01-18
JPS6419741A (en) 1989-01-23
KR970000967B1 (ko) 1997-01-21
CA1278879C (en) 1991-01-08
DE3852770D1 (de) 1995-03-02
EP0278460A2 (en) 1988-08-17
JP2550130B2 (ja) 1996-11-06
US4778332A (en) 1988-10-18
DE3852770T2 (de) 1995-05-18

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