JPH0527968B2 - - Google Patents
Info
- Publication number
- JPH0527968B2 JPH0527968B2 JP60012014A JP1201485A JPH0527968B2 JP H0527968 B2 JPH0527968 B2 JP H0527968B2 JP 60012014 A JP60012014 A JP 60012014A JP 1201485 A JP1201485 A JP 1201485A JP H0527968 B2 JPH0527968 B2 JP H0527968B2
- Authority
- JP
- Japan
- Prior art keywords
- etched
- etching
- controlling
- temperature
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1201485A JPS61171135A (ja) | 1985-01-24 | 1985-01-24 | プラズマエッチング装置の制御方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1201485A JPS61171135A (ja) | 1985-01-24 | 1985-01-24 | プラズマエッチング装置の制御方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61171135A JPS61171135A (ja) | 1986-08-01 |
| JPH0527968B2 true JPH0527968B2 (cg-RX-API-DMAC7.html) | 1993-04-22 |
Family
ID=11793736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1201485A Granted JPS61171135A (ja) | 1985-01-24 | 1985-01-24 | プラズマエッチング装置の制御方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171135A (cg-RX-API-DMAC7.html) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118636A (en) * | 1979-03-08 | 1980-09-11 | Toshiba Corp | Gas etching method and device |
| JPS5776846A (en) * | 1980-10-31 | 1982-05-14 | Fujitsu Ltd | Surface treating method for semiconductor |
| JPS5853833A (ja) * | 1981-09-26 | 1983-03-30 | Toshiba Corp | プラズマエツチング装置 |
| JPS5932122A (ja) * | 1982-08-16 | 1984-02-21 | Hitachi Ltd | 表面改質装置 |
-
1985
- 1985-01-24 JP JP1201485A patent/JPS61171135A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61171135A (ja) | 1986-08-01 |
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