JPH0526762Y2 - - Google Patents

Info

Publication number
JPH0526762Y2
JPH0526762Y2 JP1987184090U JP18409087U JPH0526762Y2 JP H0526762 Y2 JPH0526762 Y2 JP H0526762Y2 JP 1987184090 U JP1987184090 U JP 1987184090U JP 18409087 U JP18409087 U JP 18409087U JP H0526762 Y2 JPH0526762 Y2 JP H0526762Y2
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
recess
element mounting
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987184090U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0187555U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987184090U priority Critical patent/JPH0526762Y2/ja
Publication of JPH0187555U publication Critical patent/JPH0187555U/ja
Application granted granted Critical
Publication of JPH0526762Y2 publication Critical patent/JPH0526762Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987184090U 1987-12-01 1987-12-01 Expired - Lifetime JPH0526762Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987184090U JPH0526762Y2 (enExample) 1987-12-01 1987-12-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987184090U JPH0526762Y2 (enExample) 1987-12-01 1987-12-01

Publications (2)

Publication Number Publication Date
JPH0187555U JPH0187555U (enExample) 1989-06-09
JPH0526762Y2 true JPH0526762Y2 (enExample) 1993-07-07

Family

ID=31475475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987184090U Expired - Lifetime JPH0526762Y2 (enExample) 1987-12-01 1987-12-01

Country Status (1)

Country Link
JP (1) JPH0526762Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9335073B2 (en) 2008-02-01 2016-05-10 Gentherm Incorporated Climate controlled seating assembly with sensors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9335073B2 (en) 2008-02-01 2016-05-10 Gentherm Incorporated Climate controlled seating assembly with sensors

Also Published As

Publication number Publication date
JPH0187555U (enExample) 1989-06-09

Similar Documents

Publication Publication Date Title
JP2001015668A (ja) 樹脂封止型半導体パッケージ
JPH0498864A (ja) 樹脂封止型半導体装置
JPH0526762Y2 (enExample)
JPH01161736A (ja) 半導体装置用パッケージ
JPH01241831A (ja) 半導体集積回路装置の樹脂封止方法
JPH01257361A (ja) 樹脂封止型半導体装置
JPS63283053A (ja) 半導体装置のリ−ドフレ−ム
JPH0233961A (ja) リードフレーム
KR200331874Y1 (ko) 반도체의다핀형태패키지
JP2531088B2 (ja) 半導体装置およびその製造方法
JPH03129840A (ja) 樹脂封止型半導体装置
JPH04317363A (ja) ダイパッドレス樹脂封止型半導体装置とその製造方法
JPS61240644A (ja) 半導体装置
JP2527803Y2 (ja) 樹脂封止型電子部品用リードフレーム
JP3833832B2 (ja) 樹脂封止型半導体装置の製造方法
JPH0220047A (ja) 樹脂封止型半導体装置
JPS6315455A (ja) 半導体装置用リ−ドフレ−ム
KR200151801Y1 (ko) 그라운드 본딩용 패드 바와 관통공을 갖는 리드 프레임
JPH02139954A (ja) リードフレーム及びこれを用いた樹脂封止型半導体装置
KR19980085416A (ko) 홈을 갖는 리드 프레임
JPH0697357A (ja) リードフレームとこれを用いた半導体装置の製造方法
JPH0462942A (ja) 半導体装置
JPH04167552A (ja) 樹脂封止型半導体装置
JPS62128164A (ja) 半導体装置のリ−ドフレ−ム
JPH02106047A (ja) 半導体装置