JPH0525655B2 - - Google Patents
Info
- Publication number
- JPH0525655B2 JPH0525655B2 JP18835890A JP18835890A JPH0525655B2 JP H0525655 B2 JPH0525655 B2 JP H0525655B2 JP 18835890 A JP18835890 A JP 18835890A JP 18835890 A JP18835890 A JP 18835890A JP H0525655 B2 JPH0525655 B2 JP H0525655B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- mold
- casing
- cavity
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 37
- 238000001746 injection moulding Methods 0.000 claims description 18
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 5
- 239000011265 semifinished product Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18835890A JPH0381126A (ja) | 1990-07-17 | 1990-07-17 | 集積回路素子ケーシングの射出成形装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18835890A JPH0381126A (ja) | 1990-07-17 | 1990-07-17 | 集積回路素子ケーシングの射出成形装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23172885A Division JPS6290213A (ja) | 1985-10-17 | 1985-10-17 | 集積回路素子ケ−シングの射出成形による成形方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0381126A JPH0381126A (ja) | 1991-04-05 |
JPH0525655B2 true JPH0525655B2 (zh) | 1993-04-13 |
Family
ID=16222227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18835890A Granted JPH0381126A (ja) | 1990-07-17 | 1990-07-17 | 集積回路素子ケーシングの射出成形装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0381126A (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5783134A (en) * | 1994-01-13 | 1998-07-21 | Citizen Watch Co., Ltd. | Method of resin-sealing semiconductor device |
EP0783949A4 (en) * | 1994-09-28 | 1998-07-08 | Meiho Co Ltd | INJECTION MOLDING DEVICE |
DE102006028816B4 (de) * | 2006-06-21 | 2008-05-15 | Hansatronic Gmbh | Verfahren zum getakteten, kontinuierlichen Herstellen von beidseitig umspritzten flexiblen Leiterplatten |
DE102009001373A1 (de) * | 2009-03-06 | 2010-09-09 | Robert Bosch Gmbh | Verfahren zum Einbetten einer elektrischen Baugruppe |
-
1990
- 1990-07-17 JP JP18835890A patent/JPH0381126A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0381126A (ja) | 1991-04-05 |
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