JPH0523062B2 - - Google Patents
Info
- Publication number
- JPH0523062B2 JPH0523062B2 JP60135930A JP13593085A JPH0523062B2 JP H0523062 B2 JPH0523062 B2 JP H0523062B2 JP 60135930 A JP60135930 A JP 60135930A JP 13593085 A JP13593085 A JP 13593085A JP H0523062 B2 JPH0523062 B2 JP H0523062B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wafer
- silhouette image
- reduced
- detection area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 5
- 230000007547 defect Effects 0.000 claims 1
- 238000005286 illumination Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60135930A JPS61294831A (ja) | 1985-06-24 | 1985-06-24 | ウエハチツプの検出方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60135930A JPS61294831A (ja) | 1985-06-24 | 1985-06-24 | ウエハチツプの検出方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61294831A JPS61294831A (ja) | 1986-12-25 |
JPH0523062B2 true JPH0523062B2 (enrdf_load_stackoverflow) | 1993-03-31 |
Family
ID=15163167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60135930A Granted JPS61294831A (ja) | 1985-06-24 | 1985-06-24 | ウエハチツプの検出方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61294831A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01161485A (ja) * | 1987-12-17 | 1989-06-26 | Nichiden Mach Ltd | 微小ワーク片の認識方法 |
JP2025093624A (ja) * | 2023-12-12 | 2025-06-24 | Towa株式会社 | 検査装置、切断装置、及び、半導体部品の製造方法 |
-
1985
- 1985-06-24 JP JP60135930A patent/JPS61294831A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61294831A (ja) | 1986-12-25 |
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