JPH05218232A - ジャックタイプｉｃパッケージ - Google Patents

ジャックタイプｉｃパッケージ

Info

Publication number
JPH05218232A
JPH05218232A JP4302041A JP30204192A JPH05218232A JP H05218232 A JPH05218232 A JP H05218232A JP 4302041 A JP4302041 A JP 4302041A JP 30204192 A JP30204192 A JP 30204192A JP H05218232 A JPH05218232 A JP H05218232A
Authority
JP
Japan
Prior art keywords
package
jack
semiconductor chip
conductive
jack housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4302041A
Other languages
English (en)
Japanese (ja)
Inventor
Seung Dae Back
承大 白
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Goldstar Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goldstar Electron Co Ltd filed Critical Goldstar Electron Co Ltd
Publication of JPH05218232A publication Critical patent/JPH05218232A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W70/688—
    • H10W74/016—
    • H10W74/111—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP4302041A 1991-11-14 1992-11-12 ジャックタイプｉｃパッケージ Pending JPH05218232A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019910020242A KR940005712B1 (ko) 1991-11-14 1991-11-14 잭 타입 아이씨 패키지(jack-type ic package)
KR20242 1991-11-14

Publications (1)

Publication Number Publication Date
JPH05218232A true JPH05218232A (ja) 1993-08-27

Family

ID=19322814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4302041A Pending JPH05218232A (ja) 1991-11-14 1992-11-12 ジャックタイプｉｃパッケージ

Country Status (5)

Country Link
US (1) US5365404A (cg-RX-API-DMAC10.html)
JP (1) JPH05218232A (cg-RX-API-DMAC10.html)
KR (1) KR940005712B1 (cg-RX-API-DMAC10.html)
DE (1) DE4237267C2 (cg-RX-API-DMAC10.html)
TW (1) TW253984B (cg-RX-API-DMAC10.html)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340266A (en) * 1978-05-22 1982-07-20 Minnesota Mining And Manufacturing Company Connector system
US4331371A (en) * 1979-03-09 1982-05-25 Japan Aviation Electronics Industry, Ltd. Electrical connector
FR2554980B1 (fr) * 1983-11-10 1986-01-17 Socapex Connecteur a force d'insertion nulle pour support rectangulaire de circuit et pince de fermeture pour un tel connecteur
US4783695A (en) * 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
JPS63253653A (ja) * 1987-04-10 1988-10-20 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
US5180976A (en) * 1987-04-17 1993-01-19 Everett/Charles Contact Products, Inc. Integrated circuit carrier having built-in circuit verification
JPH0777255B2 (ja) * 1988-07-26 1995-08-16 松下電工株式会社 ピングリッドアレイおよび半導体素子塔載方法
US4936783A (en) * 1988-12-21 1990-06-26 Minnesota Mining And Manufacturing Company Electronic socket for IC quad pack
US4912547A (en) * 1989-01-30 1990-03-27 International Business Machines Corporation Tape bonded semiconductor device

Also Published As

Publication number Publication date
TW253984B (cg-RX-API-DMAC10.html) 1995-08-11
DE4237267C2 (de) 2000-03-09
US5365404A (en) 1994-11-15
KR940005712B1 (ko) 1994-06-23
DE4237267A1 (en) 1993-05-19
KR930011138A (ko) 1993-06-23

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Legal Events

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Effective date: 20010821