JPH0520903B2 - - Google Patents
Info
- Publication number
- JPH0520903B2 JPH0520903B2 JP59037845A JP3784584A JPH0520903B2 JP H0520903 B2 JPH0520903 B2 JP H0520903B2 JP 59037845 A JP59037845 A JP 59037845A JP 3784584 A JP3784584 A JP 3784584A JP H0520903 B2 JPH0520903 B2 JP H0520903B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- sealing
- glass
- cap
- sealing glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W76/60—
-
- H10W70/682—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59037845A JPS60182748A (ja) | 1984-02-29 | 1984-02-29 | 半導体装置のパツケ−ジおよびその組立方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59037845A JPS60182748A (ja) | 1984-02-29 | 1984-02-29 | 半導体装置のパツケ−ジおよびその組立方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60182748A JPS60182748A (ja) | 1985-09-18 |
| JPH0520903B2 true JPH0520903B2 (cg-RX-API-DMAC10.html) | 1993-03-22 |
Family
ID=12508868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59037845A Granted JPS60182748A (ja) | 1984-02-29 | 1984-02-29 | 半導体装置のパツケ−ジおよびその組立方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60182748A (cg-RX-API-DMAC10.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62128155A (ja) * | 1985-11-29 | 1987-06-10 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH02127039U (cg-RX-API-DMAC10.html) * | 1989-03-29 | 1990-10-19 | ||
| JPH02303052A (ja) * | 1989-05-17 | 1990-12-17 | Sumitomo Special Metals Co Ltd | 半導体パッケージ |
| JPH0756886B2 (ja) * | 1989-05-17 | 1995-06-14 | 住友特殊金属株式会社 | 半導体パッケージの製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036695B2 (cg-RX-API-DMAC10.html) * | 1971-09-07 | 1975-11-27 | ||
| JPS58138353U (ja) * | 1982-03-12 | 1983-09-17 | 京セラ株式会社 | 半導体パツケ−ジ |
| JPS5936947A (ja) * | 1982-08-25 | 1984-02-29 | Mitsubishi Electric Corp | 半導体装置 |
| JPS5936947U (ja) * | 1982-09-02 | 1984-03-08 | 株式会社クボタ | コンバイン |
-
1984
- 1984-02-29 JP JP59037845A patent/JPS60182748A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60182748A (ja) | 1985-09-18 |
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