JPH05206005A - パターン化構造物の形成方法 - Google Patents
パターン化構造物の形成方法Info
- Publication number
- JPH05206005A JPH05206005A JP4205116A JP20511692A JPH05206005A JP H05206005 A JPH05206005 A JP H05206005A JP 4205116 A JP4205116 A JP 4205116A JP 20511692 A JP20511692 A JP 20511692A JP H05206005 A JPH05206005 A JP H05206005A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- cross
- region
- thickness
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/36—Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73869991A | 1991-07-31 | 1991-07-31 | |
| US738699 | 1991-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05206005A true JPH05206005A (ja) | 1993-08-13 |
Family
ID=24969116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4205116A Pending JPH05206005A (ja) | 1991-07-31 | 1992-07-31 | パターン化構造物の形成方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5387497A (enExample) |
| EP (1) | EP0525721B1 (enExample) |
| JP (1) | JPH05206005A (enExample) |
| KR (1) | KR100329716B1 (enExample) |
| DE (1) | DE69208769T2 (enExample) |
| TW (1) | TW208089B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100779162B1 (ko) | 1999-11-23 | 2007-11-27 | 시온 파워 코퍼레이션 | 전기화학 전지를 위한 리튬 애노드 |
| US9513551B2 (en) | 2009-01-29 | 2016-12-06 | Digiflex Ltd. | Process for producing a photomask on a photopolymeric surface |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3647447A (en) * | 1969-03-03 | 1972-03-07 | Eastman Kodak Co | Dyed photoresist compositions |
| JPS5542890A (en) * | 1978-09-22 | 1980-03-26 | Fuji Photo Film Co Ltd | Desensitizing solution for lithographic printing |
| GB8427149D0 (en) * | 1984-10-26 | 1984-12-05 | Ucb Sa | Resist materials |
| US4810601A (en) * | 1984-12-07 | 1989-03-07 | International Business Machines Corporation | Top imaged resists |
| JPS61234035A (ja) * | 1985-03-29 | 1986-10-18 | Fujitsu Ltd | 遠紫外線照射ドライ現像方法 |
| US4613398A (en) * | 1985-06-06 | 1986-09-23 | International Business Machines Corporation | Formation of etch-resistant resists through preferential permeation |
| NL8700421A (nl) * | 1987-02-20 | 1988-09-16 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
| JPH01284851A (ja) * | 1988-05-12 | 1989-11-16 | Rohm Co Ltd | フォトレジスト膜形成方法 |
| US5015559A (en) * | 1988-07-26 | 1991-05-14 | Matsushita Electric Industrial Co., Ltd. | Process for forming a fine resist pattern |
| US5079131A (en) * | 1988-08-29 | 1992-01-07 | Shipley Company Inc. | Method of forming positive images through organometallic treatment of negative acid hardening cross-linked photoresist formulations |
| US5094936A (en) * | 1988-09-16 | 1992-03-10 | Texas Instruments Incorporated | High pressure photoresist silylation process and apparatus |
| US5015556A (en) * | 1990-07-26 | 1991-05-14 | Minnesota Mining And Manufacturing Company | Flexographic printing plate process |
-
1992
- 1992-07-28 EP EP92112858A patent/EP0525721B1/en not_active Expired - Lifetime
- 1992-07-28 DE DE69208769T patent/DE69208769T2/de not_active Expired - Fee Related
- 1992-07-30 KR KR1019920013673A patent/KR100329716B1/ko not_active Expired - Fee Related
- 1992-07-31 JP JP4205116A patent/JPH05206005A/ja active Pending
- 1992-11-05 TW TW081108834A patent/TW208089B/zh active
-
1994
- 1994-01-04 US US08/177,634 patent/US5387497A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69208769D1 (de) | 1996-04-11 |
| EP0525721A1 (en) | 1993-02-03 |
| TW208089B (enExample) | 1993-06-21 |
| KR100329716B1 (ko) | 2002-06-24 |
| US5387497A (en) | 1995-02-07 |
| DE69208769T2 (de) | 1996-07-18 |
| KR930003288A (ko) | 1993-02-24 |
| EP0525721B1 (en) | 1996-03-06 |
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