TW208089B - - Google Patents
Info
- Publication number
- TW208089B TW208089B TW081108834A TW81108834A TW208089B TW 208089 B TW208089 B TW 208089B TW 081108834 A TW081108834 A TW 081108834A TW 81108834 A TW81108834 A TW 81108834A TW 208089 B TW208089 B TW 208089B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
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- H10P14/60—
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/36—Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73869991A | 1991-07-31 | 1991-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW208089B true TW208089B (enExample) | 1993-06-21 |
Family
ID=24969116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW081108834A TW208089B (enExample) | 1991-07-31 | 1992-11-05 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5387497A (enExample) |
| EP (1) | EP0525721B1 (enExample) |
| JP (1) | JPH05206005A (enExample) |
| KR (1) | KR100329716B1 (enExample) |
| DE (1) | DE69208769T2 (enExample) |
| TW (1) | TW208089B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60006150T2 (de) | 1999-11-23 | 2004-07-22 | Moltech Corp., Tucson | Lithiumanoden für elektrochemische zellen |
| WO2010086850A2 (en) | 2009-01-29 | 2010-08-05 | Digiflex Ltd. | Process for producing a photomask on a photopolymeric surface |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3647447A (en) * | 1969-03-03 | 1972-03-07 | Eastman Kodak Co | Dyed photoresist compositions |
| JPS5542890A (en) * | 1978-09-22 | 1980-03-26 | Fuji Photo Film Co Ltd | Desensitizing solution for lithographic printing |
| GB8427149D0 (en) * | 1984-10-26 | 1984-12-05 | Ucb Sa | Resist materials |
| US4810601A (en) * | 1984-12-07 | 1989-03-07 | International Business Machines Corporation | Top imaged resists |
| JPS61234035A (ja) * | 1985-03-29 | 1986-10-18 | Fujitsu Ltd | 遠紫外線照射ドライ現像方法 |
| US4613398A (en) * | 1985-06-06 | 1986-09-23 | International Business Machines Corporation | Formation of etch-resistant resists through preferential permeation |
| NL8700421A (nl) * | 1987-02-20 | 1988-09-16 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
| JPH01284851A (ja) * | 1988-05-12 | 1989-11-16 | Rohm Co Ltd | フォトレジスト膜形成方法 |
| US5015559A (en) * | 1988-07-26 | 1991-05-14 | Matsushita Electric Industrial Co., Ltd. | Process for forming a fine resist pattern |
| US5079131A (en) * | 1988-08-29 | 1992-01-07 | Shipley Company Inc. | Method of forming positive images through organometallic treatment of negative acid hardening cross-linked photoresist formulations |
| US5094936A (en) * | 1988-09-16 | 1992-03-10 | Texas Instruments Incorporated | High pressure photoresist silylation process and apparatus |
| US5015556A (en) * | 1990-07-26 | 1991-05-14 | Minnesota Mining And Manufacturing Company | Flexographic printing plate process |
-
1992
- 1992-07-28 DE DE69208769T patent/DE69208769T2/de not_active Expired - Fee Related
- 1992-07-28 EP EP92112858A patent/EP0525721B1/en not_active Expired - Lifetime
- 1992-07-30 KR KR1019920013673A patent/KR100329716B1/ko not_active Expired - Fee Related
- 1992-07-31 JP JP4205116A patent/JPH05206005A/ja active Pending
- 1992-11-05 TW TW081108834A patent/TW208089B/zh active
-
1994
- 1994-01-04 US US08/177,634 patent/US5387497A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR930003288A (ko) | 1993-02-24 |
| EP0525721B1 (en) | 1996-03-06 |
| US5387497A (en) | 1995-02-07 |
| DE69208769T2 (de) | 1996-07-18 |
| DE69208769D1 (de) | 1996-04-11 |
| EP0525721A1 (en) | 1993-02-03 |
| JPH05206005A (ja) | 1993-08-13 |
| KR100329716B1 (ko) | 2002-06-24 |