JPH0518478B2 - - Google Patents
Info
- Publication number
- JPH0518478B2 JPH0518478B2 JP61151721A JP15172186A JPH0518478B2 JP H0518478 B2 JPH0518478 B2 JP H0518478B2 JP 61151721 A JP61151721 A JP 61151721A JP 15172186 A JP15172186 A JP 15172186A JP H0518478 B2 JPH0518478 B2 JP H0518478B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- holes
- printed circuit
- laser
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims description 26
- 238000005553 drilling Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15172186A JPS639194A (ja) | 1986-06-30 | 1986-06-30 | 多層プリント回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15172186A JPS639194A (ja) | 1986-06-30 | 1986-06-30 | 多層プリント回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS639194A JPS639194A (ja) | 1988-01-14 |
| JPH0518478B2 true JPH0518478B2 (US20020167097A1-20021114-C00005.png) | 1993-03-12 |
Family
ID=15524831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15172186A Granted JPS639194A (ja) | 1986-06-30 | 1986-06-30 | 多層プリント回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS639194A (US20020167097A1-20021114-C00005.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2516142B2 (ja) * | 1992-04-01 | 1996-07-10 | 株式会社エイト工業 | 多層基板およびその製造方法 |
| US5316803A (en) * | 1992-12-10 | 1994-05-31 | International Business Machines Corporation | Method for forming electrical interconnections in laminated vias |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4945359A (US20020167097A1-20021114-C00005.png) * | 1972-09-08 | 1974-04-30 | ||
| JPS4978171A (US20020167097A1-20021114-C00005.png) * | 1972-12-06 | 1974-07-27 | ||
| JPS5254172A (en) * | 1975-10-28 | 1977-05-02 | Siemens Ag | Method of producing microminiature multiilayer wiring |
| JPS5864097A (ja) * | 1981-10-14 | 1983-04-16 | 株式会社日立製作所 | 多層印刷回路板の製造方法 |
| JPS61214497A (ja) * | 1985-03-18 | 1986-09-24 | シャープ株式会社 | プリント配線板の製造方法 |
-
1986
- 1986-06-30 JP JP15172186A patent/JPS639194A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4945359A (US20020167097A1-20021114-C00005.png) * | 1972-09-08 | 1974-04-30 | ||
| JPS4978171A (US20020167097A1-20021114-C00005.png) * | 1972-12-06 | 1974-07-27 | ||
| JPS5254172A (en) * | 1975-10-28 | 1977-05-02 | Siemens Ag | Method of producing microminiature multiilayer wiring |
| JPS5864097A (ja) * | 1981-10-14 | 1983-04-16 | 株式会社日立製作所 | 多層印刷回路板の製造方法 |
| JPS61214497A (ja) * | 1985-03-18 | 1986-09-24 | シャープ株式会社 | プリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS639194A (ja) | 1988-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |