JPH0511364B2 - - Google Patents

Info

Publication number
JPH0511364B2
JPH0511364B2 JP28433785A JP28433785A JPH0511364B2 JP H0511364 B2 JPH0511364 B2 JP H0511364B2 JP 28433785 A JP28433785 A JP 28433785A JP 28433785 A JP28433785 A JP 28433785A JP H0511364 B2 JPH0511364 B2 JP H0511364B2
Authority
JP
Japan
Prior art keywords
silver powder
epoxy resin
conductive resin
weight
resin paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP28433785A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62145601A (ja
Inventor
Yukihiro Okabe
Masuo Mizuno
Shigenori Yamaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP28433785A priority Critical patent/JPS62145601A/ja
Publication of JPS62145601A publication Critical patent/JPS62145601A/ja
Publication of JPH0511364B2 publication Critical patent/JPH0511364B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP28433785A 1985-12-19 1985-12-19 導電性樹脂ペ−スト Granted JPS62145601A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28433785A JPS62145601A (ja) 1985-12-19 1985-12-19 導電性樹脂ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28433785A JPS62145601A (ja) 1985-12-19 1985-12-19 導電性樹脂ペ−スト

Publications (2)

Publication Number Publication Date
JPS62145601A JPS62145601A (ja) 1987-06-29
JPH0511364B2 true JPH0511364B2 (enExample) 1993-02-15

Family

ID=17677262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28433785A Granted JPS62145601A (ja) 1985-12-19 1985-12-19 導電性樹脂ペ−スト

Country Status (1)

Country Link
JP (1) JPS62145601A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0195170A (ja) * 1987-10-06 1989-04-13 Yamaha Corp 導電性塗料
JPH0611842B2 (ja) * 1987-12-23 1994-02-16 住友ベークライト株式会社 導電性樹脂ペースト
JP2688692B2 (ja) * 1988-06-01 1997-12-10 旭化成工業株式会社 金属粉含有エポキシ樹脂組成物
JP3526183B2 (ja) * 1997-09-18 2004-05-10 住友ベークライト株式会社 導電性樹脂ペースト及びこれを用いて製造された半導体装置
JP2000239627A (ja) * 1999-02-25 2000-09-05 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JP2000265144A (ja) * 1999-03-16 2000-09-26 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JP3858902B2 (ja) 2004-03-03 2006-12-20 住友電気工業株式会社 導電性銀ペーストおよびその製造方法
JP4665532B2 (ja) * 2005-01-27 2011-04-06 住友ベークライト株式会社 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP5023583B2 (ja) * 2006-07-07 2012-09-12 富士電機株式会社 ソルダーペースト組成物及びそれを用いたプリント配線基板への電子部品実装方法
EP2431438B1 (en) * 2010-09-20 2012-11-28 Henkel AG & Co. KGaA Electrically conductive adhesives
JP6062974B2 (ja) * 2014-02-24 2017-01-18 三ツ星ベルト株式会社 導電性組成物
US10995245B2 (en) 2016-08-10 2021-05-04 Threebond Co., Ltd. Epoxy resin composition and electro-conductive adhesive containing the same

Also Published As

Publication number Publication date
JPS62145601A (ja) 1987-06-29

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