JPS62145601A - 導電性樹脂ペ−スト - Google Patents

導電性樹脂ペ−スト

Info

Publication number
JPS62145601A
JPS62145601A JP28433785A JP28433785A JPS62145601A JP S62145601 A JPS62145601 A JP S62145601A JP 28433785 A JP28433785 A JP 28433785A JP 28433785 A JP28433785 A JP 28433785A JP S62145601 A JPS62145601 A JP S62145601A
Authority
JP
Japan
Prior art keywords
silver powder
conductive resin
resin paste
resin
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28433785A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0511364B2 (enExample
Inventor
岡部　幸博
水野　増雄
重徳 山岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP28433785A priority Critical patent/JPS62145601A/ja
Publication of JPS62145601A publication Critical patent/JPS62145601A/ja
Publication of JPH0511364B2 publication Critical patent/JPH0511364B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
JP28433785A 1985-12-19 1985-12-19 導電性樹脂ペ−スト Granted JPS62145601A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28433785A JPS62145601A (ja) 1985-12-19 1985-12-19 導電性樹脂ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28433785A JPS62145601A (ja) 1985-12-19 1985-12-19 導電性樹脂ペ−スト

Publications (2)

Publication Number Publication Date
JPS62145601A true JPS62145601A (ja) 1987-06-29
JPH0511364B2 JPH0511364B2 (enExample) 1993-02-15

Family

ID=17677262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28433785A Granted JPS62145601A (ja) 1985-12-19 1985-12-19 導電性樹脂ペ−スト

Country Status (1)

Country Link
JP (1) JPS62145601A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0195170A (ja) * 1987-10-06 1989-04-13 Yamaha Corp 導電性塗料
JPH01165654A (ja) * 1987-12-23 1989-06-29 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト
JPH01304150A (ja) * 1988-06-01 1989-12-07 Asahi Chem Ind Co Ltd 金属粉含有エポキシ樹脂組成物
JPH1192739A (ja) * 1997-09-18 1999-04-06 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いて製造された半導体装置
JP2000239627A (ja) * 1999-02-25 2000-09-05 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JP2000265144A (ja) * 1999-03-16 2000-09-26 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JP2006206730A (ja) * 2005-01-27 2006-08-10 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
US7198736B2 (en) 2004-03-03 2007-04-03 Sumitomo Electric Industries, Ltd. Conductive silver paste and conductive film formed using the same
JP2008012576A (ja) * 2006-07-07 2008-01-24 Fuji Electric Holdings Co Ltd ソルダーペースト組成物及びそれを用いたプリント配線基板への電子部品実装方法
JP2013541611A (ja) * 2010-09-20 2013-11-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 導電性接着剤
WO2015125692A1 (ja) * 2014-02-24 2015-08-27 三ツ星ベルト株式会社 導電性組成物および導電性成形体
US10995245B2 (en) 2016-08-10 2021-05-04 Threebond Co., Ltd. Epoxy resin composition and electro-conductive adhesive containing the same

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0195170A (ja) * 1987-10-06 1989-04-13 Yamaha Corp 導電性塗料
JPH01165654A (ja) * 1987-12-23 1989-06-29 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト
JPH01304150A (ja) * 1988-06-01 1989-12-07 Asahi Chem Ind Co Ltd 金属粉含有エポキシ樹脂組成物
JPH1192739A (ja) * 1997-09-18 1999-04-06 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いて製造された半導体装置
JP2000239627A (ja) * 1999-02-25 2000-09-05 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JP2000265144A (ja) * 1999-03-16 2000-09-26 Sumitomo Bakelite Co Ltd ダイアタッチペースト
US7198736B2 (en) 2004-03-03 2007-04-03 Sumitomo Electric Industries, Ltd. Conductive silver paste and conductive film formed using the same
JP2006206730A (ja) * 2005-01-27 2006-08-10 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2008012576A (ja) * 2006-07-07 2008-01-24 Fuji Electric Holdings Co Ltd ソルダーペースト組成物及びそれを用いたプリント配線基板への電子部品実装方法
JP2013541611A (ja) * 2010-09-20 2013-11-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 導電性接着剤
US9589693B2 (en) 2010-09-20 2017-03-07 Henkel Ag & Co. Kgaa Electrically conductive adhesives
WO2015125692A1 (ja) * 2014-02-24 2015-08-27 三ツ星ベルト株式会社 導電性組成物および導電性成形体
JP2015172183A (ja) * 2014-02-24 2015-10-01 三ツ星ベルト株式会社 導電性組成物
US11242471B2 (en) 2014-02-24 2022-02-08 Mitsuboshi Belting Ltd. Conductive composition and conductive molded article
US10995245B2 (en) 2016-08-10 2021-05-04 Threebond Co., Ltd. Epoxy resin composition and electro-conductive adhesive containing the same

Also Published As

Publication number Publication date
JPH0511364B2 (enExample) 1993-02-15

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