JPH0510840B2 - - Google Patents
Info
- Publication number
- JPH0510840B2 JPH0510840B2 JP59243972A JP24397284A JPH0510840B2 JP H0510840 B2 JPH0510840 B2 JP H0510840B2 JP 59243972 A JP59243972 A JP 59243972A JP 24397284 A JP24397284 A JP 24397284A JP H0510840 B2 JPH0510840 B2 JP H0510840B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- printed wiring
- multilayer printed
- wiring board
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24397284A JPS61121496A (ja) | 1984-11-19 | 1984-11-19 | 多層印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24397284A JPS61121496A (ja) | 1984-11-19 | 1984-11-19 | 多層印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61121496A JPS61121496A (ja) | 1986-06-09 |
| JPH0510840B2 true JPH0510840B2 (enrdf_load_stackoverflow) | 1993-02-10 |
Family
ID=17111787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24397284A Granted JPS61121496A (ja) | 1984-11-19 | 1984-11-19 | 多層印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121496A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH073912B2 (ja) * | 1985-08-12 | 1995-01-18 | 松下電工株式会社 | 多層プリント配線板 |
| JPS63264341A (ja) * | 1987-04-21 | 1988-11-01 | Toshiba Chem Corp | 多層銅張積層板 |
| JPH01321693A (ja) * | 1988-06-23 | 1989-12-27 | Nec Corp | 多層印刷配線板 |
| JP4570225B2 (ja) * | 2000-09-28 | 2010-10-27 | 京セラ株式会社 | 金属箔付フィルム及びそれを用いた多層配線基板の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5435832A (en) * | 1977-08-27 | 1979-03-16 | Mitsui Anakonda Dohaku Kk | Method of making highhductile electrolytically treated copper foil |
| JPS56153797A (en) * | 1980-04-28 | 1981-11-27 | Hitachi Chemical Co Ltd | Method of manufacturing multilayer printed circuit board substrate |
| JPS5939096A (ja) * | 1982-08-27 | 1984-03-03 | 松下電器産業株式会社 | 多層印刷配線板の製造方法 |
-
1984
- 1984-11-19 JP JP24397284A patent/JPS61121496A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61121496A (ja) | 1986-06-09 |
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