JPH0481862B2 - - Google Patents

Info

Publication number
JPH0481862B2
JPH0481862B2 JP59094077A JP9407784A JPH0481862B2 JP H0481862 B2 JPH0481862 B2 JP H0481862B2 JP 59094077 A JP59094077 A JP 59094077A JP 9407784 A JP9407784 A JP 9407784A JP H0481862 B2 JPH0481862 B2 JP H0481862B2
Authority
JP
Japan
Prior art keywords
plating
package
nickel
electroless nickel
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59094077A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60236251A (ja
Inventor
Toshihisa Yoda
Hiroo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP59094077A priority Critical patent/JPS60236251A/ja
Publication of JPS60236251A publication Critical patent/JPS60236251A/ja
Publication of JPH0481862B2 publication Critical patent/JPH0481862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemically Coating (AREA)
JP59094077A 1984-05-10 1984-05-10 半導体装置用パツケ−ジ Granted JPS60236251A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59094077A JPS60236251A (ja) 1984-05-10 1984-05-10 半導体装置用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59094077A JPS60236251A (ja) 1984-05-10 1984-05-10 半導体装置用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS60236251A JPS60236251A (ja) 1985-11-25
JPH0481862B2 true JPH0481862B2 (cs) 1992-12-25

Family

ID=14100425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59094077A Granted JPS60236251A (ja) 1984-05-10 1984-05-10 半導体装置用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS60236251A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6487940B2 (ja) * 2014-11-27 2019-03-20 国立研究開発法人産業技術総合研究所 半導体パッケージ及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5149578A (ja) * 1974-10-25 1976-04-28 Hitachi Ltd Kinzokujokihodento
JPS5258467A (en) * 1975-11-10 1977-05-13 Shinko Electric Ind Co Electronic parts package
JPS5992598A (ja) * 1982-11-18 1984-05-28 鳴海製陶株式会社 電子部品搭載用セラミック基体

Also Published As

Publication number Publication date
JPS60236251A (ja) 1985-11-25

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term