JPH0476210B2 - - Google Patents

Info

Publication number
JPH0476210B2
JPH0476210B2 JP60007816A JP781685A JPH0476210B2 JP H0476210 B2 JPH0476210 B2 JP H0476210B2 JP 60007816 A JP60007816 A JP 60007816A JP 781685 A JP781685 A JP 781685A JP H0476210 B2 JPH0476210 B2 JP H0476210B2
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit board
metal substrates
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60007816A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61166148A (ja
Inventor
Yoshio Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP60007816A priority Critical patent/JPS61166148A/ja
Publication of JPS61166148A publication Critical patent/JPS61166148A/ja
Publication of JPH0476210B2 publication Critical patent/JPH0476210B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
JP60007816A 1985-01-18 1985-01-18 多層混成集積回路装置 Granted JPS61166148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60007816A JPS61166148A (ja) 1985-01-18 1985-01-18 多層混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60007816A JPS61166148A (ja) 1985-01-18 1985-01-18 多層混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS61166148A JPS61166148A (ja) 1986-07-26
JPH0476210B2 true JPH0476210B2 (index.php) 1992-12-03

Family

ID=11676118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60007816A Granted JPS61166148A (ja) 1985-01-18 1985-01-18 多層混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS61166148A (index.php)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729670Y2 (ja) * 1988-10-19 1995-07-05 ティーディーケイ株式会社 電源装置
WO2019012677A1 (ja) * 2017-07-14 2019-01-17 新電元工業株式会社 電子モジュール
WO2019012678A1 (ja) 2017-07-14 2019-01-17 新電元工業株式会社 電子モジュール

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331409Y2 (index.php) * 1981-06-03 1988-08-22

Also Published As

Publication number Publication date
JPS61166148A (ja) 1986-07-26

Similar Documents

Publication Publication Date Title
US5631497A (en) Film carrier tape and laminated multi-chip semiconductor device incorporating the same
US6205654B1 (en) Method of manufacturing a surface mount package
JP3176307B2 (ja) 集積回路装置の実装構造およびその製造方法
US20050139980A1 (en) High density integrated circuit module
US6504244B2 (en) Semiconductor device and semiconductor module using the same
CA1037615A (en) Functional package for complex electronic systems and method of fabrication
KR0133493B1 (ko) 메탈코어타입 다층 리드프레임
JPH0529537A (ja) 半導体モジユール構造
JPH0476210B2 (index.php)
JPH0888471A (ja) 多層印刷配線基板装置及びその製造方法
JPH0558597B2 (index.php)
JPS61166147A (ja) 多層混成集積回路装置
JPS58159361A (ja) 多層混成集積回路装置
JPH02164096A (ja) 多層電子回路基板とその製造方法
JP2942790B2 (ja) 半導体素子用多層リードフレーム
JP2847319B2 (ja) 電子部品搭載用多層ボンディング基板
JP2766361B2 (ja) 半導体装置
JPH0442937Y2 (index.php)
JPH0519974Y2 (index.php)
JPS6366959A (ja) 多重リ−ドフレ−ム
JP2700257B2 (ja) 配線基板付きリードフレームとその製造方法
JPH02110990A (ja) 混成集積回路
JPS6233342Y2 (index.php)
JP4578220B2 (ja) 半導体装置
JP2525353Y2 (ja) 半導体装置用回路基板