JPH0475605B2 - - Google Patents
Info
- Publication number
- JPH0475605B2 JPH0475605B2 JP60031618A JP3161885A JPH0475605B2 JP H0475605 B2 JPH0475605 B2 JP H0475605B2 JP 60031618 A JP60031618 A JP 60031618A JP 3161885 A JP3161885 A JP 3161885A JP H0475605 B2 JPH0475605 B2 JP H0475605B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- manufacturing
- substrate
- insulating resist
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- 230000000873 masking effect Effects 0.000 claims description 4
- 239000011800 void material Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 34
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 15
- 229910052737 gold Inorganic materials 0.000 description 15
- 239000010931 gold Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3161885A JPS61193315A (ja) | 1985-02-21 | 1985-02-21 | 平滑スイツチ基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3161885A JPS61193315A (ja) | 1985-02-21 | 1985-02-21 | 平滑スイツチ基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61193315A JPS61193315A (ja) | 1986-08-27 |
| JPH0475605B2 true JPH0475605B2 (fr) | 1992-12-01 |
Family
ID=12336199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3161885A Granted JPS61193315A (ja) | 1985-02-21 | 1985-02-21 | 平滑スイツチ基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61193315A (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2642663B2 (ja) * | 1988-03-10 | 1997-08-20 | ヤマハ発動機株式会社 | めっき型熱電対 |
| JPH03151259A (ja) * | 1989-11-09 | 1991-06-27 | Sekisui Chem Co Ltd | 積層シート |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5539093A (en) * | 1978-09-12 | 1980-03-18 | Junghans Gmbh Geb | Contact device for battery driven apparatus |
| JPS5643642A (en) * | 1979-09-19 | 1981-04-22 | Toray Ind Inc | Lithographic original plate nonrequiring damping water |
| JPS5646205A (en) * | 1979-09-20 | 1981-04-27 | Fujitsu Ltd | Optical fiber coupler and its manufacture |
-
1985
- 1985-02-21 JP JP3161885A patent/JPS61193315A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5539093A (en) * | 1978-09-12 | 1980-03-18 | Junghans Gmbh Geb | Contact device for battery driven apparatus |
| JPS5643642A (en) * | 1979-09-19 | 1981-04-22 | Toray Ind Inc | Lithographic original plate nonrequiring damping water |
| JPS5646205A (en) * | 1979-09-20 | 1981-04-27 | Fujitsu Ltd | Optical fiber coupler and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61193315A (ja) | 1986-08-27 |
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