JPH0475605B2 - - Google Patents
Info
- Publication number
- JPH0475605B2 JPH0475605B2 JP60031618A JP3161885A JPH0475605B2 JP H0475605 B2 JPH0475605 B2 JP H0475605B2 JP 60031618 A JP60031618 A JP 60031618A JP 3161885 A JP3161885 A JP 3161885A JP H0475605 B2 JPH0475605 B2 JP H0475605B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- manufacturing
- substrate
- insulating resist
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- 230000000873 masking effect Effects 0.000 claims description 4
- 239000011800 void material Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 34
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 15
- 229910052737 gold Inorganic materials 0.000 description 15
- 239000010931 gold Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は平滑スイツチ基板を比較的安い製造原
価で製造することのできる平滑スイツチ基板の製
造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method for manufacturing a smooth switch board, which allows the smooth switch board to be manufactured at a relatively low manufacturing cost.
従来、この種の平滑スイツチ基板としてフラツ
シユ基板というものが市販されている。第２図ａ
〜ｃはこのフラツシユ基板の製造方法を示す説明
図である。この市販のフラツシユ基板は、第２図
ａに示すように、基板１上に例えば銅箔２を形成
したものを第２図ｂに示すようにエツチングし、
さらに銅箔２部分に貴金属のメツキ３をほどこ
し、矢印４で示すようにプレス等によつてメツキ
３および銅箔２を基板１方向に押圧し、第２図ｃ
に示すように、メツキ３および銅箔２を基板１内
に埋込んで作製されたものである。このフラツシ
ユ基板は、基板１の表面に露呈するメツキ３に集
電子５が接触することにより、所望のスイツチオ
ン動作をおこなうことができる。
Conventionally, a flat board is commercially available as this type of smooth switch board. Figure 2a
-c are explanatory diagrams showing a method of manufacturing this flash substrate. This commercially available flash board is made by forming, for example, a copper foil 2 on a board 1 as shown in FIG. 2a, and etching it as shown in FIG. 2b.
Furthermore, plating 3 of precious metal is applied to the copper foil 2 portion, and as shown by arrow 4, the plating 3 and the copper foil 2 are pressed in the direction of the board 1 using a press or the like, as shown in Fig. 2c.
As shown in FIG. 2, the plating 3 and the copper foil 2 are embedded in the substrate 1. This flash substrate can perform a desired switch-on operation by bringing the current collector 5 into contact with the plating 3 exposed on the surface of the substrate 1.
しかし、このように構成されるフラツシユ基板
は、プレス等による押圧力によつてメツキ３、銅
箔２を基板１内に埋込んであるので、使用中にメ
ツキ３部分が基板１上に浮上がつて来ることがあ
り、それ故、安定したスイツチ特性を得難い不具
合がある。 However, in the flash board constructed in this way, the plating 3 and the copper foil 2 are embedded in the board 1 by the pressing force of a press or the like, so the plating 3 part may float onto the board 1 during use. Therefore, there is a problem in that it is difficult to obtain stable switch characteristics.
第３図ａ〜ｆは上記のようにして作製されるフ
ラツシユ基板における不具合に鑑みて提案された
従来の平滑スイツチ基板の製造方法を示す説明図
である。この平滑スイツチ基板は、第３図ａに示
すように、導電性を有する仮基板１０の上に絶縁
性レジスト１１でマスキングすることにより所望
のパターンからなる露出部１２を形成させ、次い
で第３図ｂに示すように、露出部１２に３層の電
気メツキ例えば金メツキ１３、剛性を有する金属
であるニツケルを用いたニツケルメツキ１４、銅
メツキ１５をこの順にほどこし、次いで第３図ｃ
に示すように、絶縁性レジスト１１を除去してメ
ツキ部分を露呈させ、次いで第３図ｄに示すよう
に、メツキ部分の周囲にコーテイング剤１６を設
けた後、コーテイング剤１６とベース基板１７と
を接着剤１８によつて接着させ、これによつてメ
ツキ部分をベース基板１７に接着転写させ、次い
で第３図ｅに示すように上下を反転させ、次いで
例えばエツチング液によつて仮基板１０を除去
し、第３図ｆに示すように表面に金メツキ１３が
露呈するように作製したものである。 FIGS. 3a to 3f are explanatory diagrams showing a conventional method of manufacturing a smooth switch board, which was proposed in view of the problems with the flash board manufactured as described above. As shown in FIG. 3a, this smooth switch board is manufactured by masking an electrically conductive temporary substrate 10 with an insulating resist 11 to form an exposed portion 12 in a desired pattern. As shown in Fig. 3b, three layers of electroplating, such as gold plating 13, nickel plating 14 using nickel, which is a rigid metal, and copper plating 15 are applied in this order to the exposed portion 12, and then, as shown in Fig. 3c,
As shown in FIG. 3, the insulating resist 11 is removed to expose the plating area, and then, as shown in FIG. is adhered with adhesive 18, thereby adhering and transferring the plating portion to the base substrate 17, and then turned upside down as shown in FIG. It was removed so that the gold plating 13 was exposed on the surface as shown in FIG. 3f.
このように構成したものにあつては、コーテイ
ング剤１６および接着剤１８によつてベース基板
１７に押圧力を与えることなくメツキ部分を接着
転写させるようにしてあることから、使用中に金
メツキ１３部分が浮上がることはない。しかし、
この従来の製造方法にあつては３層の電気メツキ
を要することから工程数が多く、製造工数がかか
り、それ故、製造原価が高くなり、また金メツキ
１３上にニツケルメツキ１４、銅メツキ１５をほ
どこすようにしてあることから、ニツケルメツキ
１４、銅メツキ１５が金メツキ１３の周縁にまわ
り込みやすく、したがつて金メツキ１３の位置精
度すなわち形成精度が低下しやすく、スイツチ特
性の向上を見込み難い。 With this configuration, since the coating agent 16 and the adhesive 18 allow the plating portion to be adhesively transferred without applying any pressing force to the base substrate 17, the gold plating portion 13 is transferred during use. No parts will come up. but,
This conventional manufacturing method requires three layers of electroplating, which requires a large number of steps and manufacturing man-hours, resulting in high manufacturing costs. Since the nickel plating 14 and the copper plating 15 tend to wrap around the periphery of the gold plating 13, the positional accuracy, that is, the formation accuracy of the gold plating 13 tends to decrease, and it is difficult to expect the switch characteristics to improve. .
本発明は上記した従来技術における実状に鑑み
てなされたもので、その目的は、工程数を抑制で
き、高い形成精度を得ることができる平滑スイツ
チ基板の製造方法を提供することにある。
The present invention has been made in view of the above-mentioned actual state of the prior art, and its purpose is to provide a method for manufacturing a smooth switch substrate that can reduce the number of steps and achieve high formation accuracy.
この目的を達成するために本発明は、導電性を
有する仮基板に、絶縁性レジストでマスキングす
ることにより所望のパターンからなる露出部を形
成し、この露出部の絶縁性レジストでかこまれた
空隙内に該絶縁性レジスト面よりも低い接点電極
となる電気メツキ層を形成した後、この電気メツ
キ層上の残余の空隙に導電ペーストよりなる補強
部を形成し、その後この電気メツキ部分および補
強部を他の基板に接着転写し、次いで上記仮基板
を除去する。
In order to achieve this object, the present invention forms an exposed part consisting of a desired pattern by masking an electrically conductive temporary substrate with an insulating resist, and a void surrounded by the insulating resist in the exposed part. After forming an electroplated layer that becomes a contact electrode lower than the insulating resist surface, a reinforcing part made of conductive paste is formed in the remaining gap on this electroplated layer, and then this electroplated part and the reinforcing part is adhesively transferred to another substrate, and then the temporary substrate is removed.
以下、本発明の平滑スイツチ基板の製造方法を
図に基づいて説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a smooth switch board according to the present invention will be explained below with reference to the drawings.
第１図ａ〜ｆは本発明の平滑スイツチ基板の製
造方法の一実施例を示す説明図である。この実施
例にあつては、第１図ａに示すように、鉄板ある
いは銅板等の導電性を有する仮基板２０の上に絶
縁性レジスト２１でマスキングすることにより所
望のパターンからなる露出部２２を形成させる。
次いで、第１図ｂに示すように、露出部２２の絶
縁性レジスト２１でかこまれた空隙内に該絶縁性
レジスト２１面よりも低い接点電極となる電気メ
ツキ層を形成する。すなわち、露出部２２に厚さ
１〜3μmの貴金属電気メツキ、例えば金メツキ２
３をほどこす。次いで第１図ｃに示すように、金
メツキ２３上の残余の空隙を形成する露出部２２
に導電ペーストよりなる補強部、例えば銀ペース
トあるいはカーボンペースト等を印刷法等によつ
て形成してなる補強部２４を設ける。次いで第１
図ｄに示すように絶縁性レジスト２１を除去し、
第１図ｅに示すように、上下を反転させてこれら
の金メツキ２３、補強部２４および仮基板２０を
接着剤２５によつてベース基板２６に接着させ
て、金メツキ２３および補強部２４をベース基板
２６に転写させ、次いで例えばエツチング液によ
つて仮基板２０を除去し、第１図ｆに示すように
表面に金メツキ２３が露呈するように作製したも
のである。なお、第１図ｆに示す２７は金メツキ
２３部分に接触可能な集電子を示している。 FIGS. 1a to 1f are explanatory diagrams showing an embodiment of the method for manufacturing a smooth switch board of the present invention. In this embodiment, as shown in FIG. 1a, an exposed portion 22 having a desired pattern is formed by masking an electrically conductive temporary substrate 20 such as an iron plate or a copper plate with an insulating resist 21. Let it form.
Next, as shown in FIG. 1B, an electroplated layer that will serve as a contact electrode is formed in the gap surrounded by the insulating resist 21 in the exposed portion 22, which is lower than the surface of the insulating resist 21. That is, the exposed portion 22 is coated with noble metal electroplating with a thickness of 1 to 3 μm, for example, gold plating 2.
Apply 3. Then, as shown in FIG.
A reinforcing part 24 made of conductive paste, for example, silver paste or carbon paste, is formed by a printing method or the like. Then the first
As shown in Figure d, the insulating resist 21 is removed,
As shown in FIG. 1e, the gold plating 23, the reinforcing part 24 and the temporary board 20 are bonded to the base board 26 with the adhesive 25 by turning them upside down and attaching the gold plating 23 and the reinforcing part 24. The temporary substrate 20 is transferred onto a base substrate 26, and then the temporary substrate 20 is removed using, for example, an etching solution, so that the gold plating 23 is exposed on the surface as shown in FIG. 1F. Note that 27 shown in FIG. 1f indicates a current collector that can come into contact with the gold plating 23 portion.
このように作製される平滑スイツチ基板にあつ
ては、ベース基板２６の表面に露呈する金メツキ
２３に集電子２７が接触することにより、所望の
スイツチオン動作をおこなうことができる。 In the smooth switch substrate manufactured in this manner, the desired switch-on operation can be performed by bringing the current collector 27 into contact with the gold plating 23 exposed on the surface of the base substrate 26.
このようにして平滑スイツチ基板を製造する製
造方法にあつては、３層のメツキ工程の代りに金
メツキ２３のみをほどこす単に１つのメツキ工程
と補強部２４とを形成するだけであることから工
程数を少なくすることができる。 In the manufacturing method for manufacturing a smooth switch board in this manner, only one plating process is performed in which only gold plating 23 is applied instead of a three-layer plating process, and the reinforcing portion 24 is formed. The number of steps can be reduced.
また、電気メツキは金メツキ２３をほどこすだ
けであるので他の金属メツキの周縁へのまわり込
みを生じるおそれがなく、したがつて高い位置精
度すなわち形成精度を得ることができる。 Further, since electroplating only applies the gold plating 23, there is no risk of other metal plating wrapping around the periphery, and therefore high positional accuracy, that is, formation accuracy can be obtained.
なお、上記実施例では第１図ｄに示すように絶
縁性レジスト２１を除去して接着剤２５によつて
ベース基板２６に転写させるようにしてあるが、
絶縁性レジスト２１を除去することなく、ベース
基板２６に転写させるようにしてもよい。 In the above embodiment, as shown in FIG. 1d, the insulating resist 21 is removed and transferred to the base substrate 26 using the adhesive 25.
The insulating resist 21 may be transferred onto the base substrate 26 without being removed.
また、上記実施例では貴金属電気メツキとして
金メツキ２３を挙げたがパラジウムメツキ等であ
つてもよい。 Further, in the above embodiment, gold plating 23 is used as the noble metal electroplating, but palladium plating or the like may also be used.
また、上記実施例では仮基板２０をエツチング
液によつて除去したが、このようなエツチング液
を用いず、仮基板２０を引きはがしながら除去す
るように構成してもよい。 Further, in the above embodiment, the temporary substrate 20 was removed using an etching solution, but the temporary substrate 20 may be removed while being peeled off without using such an etching solution.
本発明の平滑スイツチ基板の製造方法は以上の
ように構成してあることから、従来に比べて工程
数を抑制でき、したがつて製造工数が少なく製造
原価を易くすることができる。また高い形成精度
すなわち位置精度を得ることができ、スイツチ特
性を向上させることができる効果もある。
Since the method for manufacturing a smooth switch board of the present invention is configured as described above, the number of steps can be suppressed compared to the conventional method, and therefore, the number of manufacturing steps can be reduced and manufacturing costs can be reduced. Further, high formation accuracy, that is, positional accuracy can be obtained, and there is also an effect that switch characteristics can be improved.
また特に、下記に列挙する効果を奏する。 In particular, the effects listed below are achieved.
(1) 電気メツキ層の上方の残余の空隙に導電ペー
スト層を形成するので、パターンに合わせた補
強部を容易に、かつ正確に形成することができ
る。(1) Since the conductive paste layer is formed in the remaining gap above the electroplated layer, the reinforcing portion matching the pattern can be easily and accurately formed.
(2) こうして形成された補強部は、残余の空隙に
形成されるので、銀ペーストなどの部材を補強
に必要な最小限にとどめることができ、製作費
を安くすることができる。(2) Since the reinforcing portion thus formed is formed in the remaining void, members such as silver paste can be kept to the minimum required for reinforcement, and manufacturing costs can be reduced.
(3) この補強部は、メツキ形成ではないので、導
電層がメツキ層の周縁にまわり込むことがな
く、高精度の平滑スイツチパターンを得ること
ができる。(3) Since this reinforcing portion is not formed by plating, the conductive layer does not wrap around the periphery of the plating layer, and a highly accurate and smooth switch pattern can be obtained.
(4) 導電ペーストよりなる補強部は、電気メツキ
層上の空隙に形成されるので、空隙から外部に
あふれ出て隣接する他の補強部と導通するおそ
れもない。特にこのことは、接点ピツチがせま
い微細パターンでの接点間のシヨーテイングを
防ぐ手段として有効である。(4) Since the reinforcing portion made of conductive paste is formed in the gap above the electroplated layer, there is no risk of overflowing from the gap to the outside and conduction with other adjacent reinforcing portions. This is particularly effective as a means for preventing shortening between contacts in a fine pattern with a narrow contact pitch.
第１図ａ〜ｆは本発明の平滑スイツチ基板の製
造方法の一実施例を示す説明図、第２図ａ〜ｃは
従来のフラツシユ基板の製造方法を示す説明図、
第３図ａ〜ｆは従来の平滑スイツチ基板の製造方
法を示す説明図である。
２０……仮基板、２１……絶縁性レジスト、２
２……露出部、２３……金メツキ、２４……補強
部、２５……接着剤、２６……ベース基板。
1A to 1F are explanatory diagrams showing an embodiment of the method for manufacturing a smooth switch board of the present invention, and FIGS. 2A to 2C are explanatory diagrams showing a conventional method for manufacturing a flat board,
FIGS. 3a to 3f are explanatory diagrams showing a conventional method of manufacturing a smooth switch board. 20... Temporary substrate, 21... Insulating resist, 2
2...Exposed part, 23...Gold plating, 24...Reinforcement part, 25...Adhesive, 26...Base board.
Claims (1)
マスキングすることにより所望のパターンからな
る露出部を形成し、この露出部の絶縁性レジスト
でかこまれた空隙内に該絶縁性レジスト面よりも
低い接点電極となる電気メツキ層を形成した後、
この電気メツキ層上の残余の空隙に導電ペースト
よりなる補強部を形成し、その後この電気メツキ
部分および補強部を他の基板に接着転写し、次い
で上記仮基板を除去することを特徴とする平滑ス
イツチ基板の製造方法。1. Form an exposed part consisting of a desired pattern on a temporary conductive substrate by masking it with an insulating resist, and in the void surrounded by the insulating resist in this exposed part, a layer lower than the surface of the insulating resist is formed. After forming the electroplated layer that will become the contact electrode,
A reinforcing portion made of conductive paste is formed in the remaining gap on the electroplated layer, and then the electroplated portion and the reinforcing portion are adhesively transferred to another substrate, and then the temporary substrate is removed. A method of manufacturing a switch board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3161885A JPS61193315A (en) | 1985-02-21 | 1985-02-21 | Manufacture of smoothing switch substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3161885A JPS61193315A (en) | 1985-02-21 | 1985-02-21 | Manufacture of smoothing switch substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61193315A JPS61193315A (en) | 1986-08-27 |
| JPH0475605B2 true JPH0475605B2 (en) | 1992-12-01 |
Family
ID=12336199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3161885A Granted JPS61193315A (en) | 1985-02-21 | 1985-02-21 | Manufacture of smoothing switch substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61193315A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2642663B2 (en) * | 1988-03-10 | 1997-08-20 | ヤマハ発動機株式会社 | Plating type thermocouple |
| JPH03151259A (en) * | 1989-11-09 | 1991-06-27 | Sekisui Chem Co Ltd | Laminated sheet |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5539093A (en) * | 1978-09-12 | 1980-03-18 | Junghans Gmbh Geb | Contact device for battery driven apparatus |
| JPS5643642A (en) * | 1979-09-19 | 1981-04-22 | Toray Ind Inc | Lithographic original plate nonrequiring damping water |
| JPS5646205A (en) * | 1979-09-20 | 1981-04-27 | Fujitsu Ltd | Optical fiber coupler and its manufacture |
-
1985
- 1985-02-21 JP JP3161885A patent/JPS61193315A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5539093A (en) * | 1978-09-12 | 1980-03-18 | Junghans Gmbh Geb | Contact device for battery driven apparatus |
| JPS5643642A (en) * | 1979-09-19 | 1981-04-22 | Toray Ind Inc | Lithographic original plate nonrequiring damping water |
| JPS5646205A (en) * | 1979-09-20 | 1981-04-27 | Fujitsu Ltd | Optical fiber coupler and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61193315A (en) | 1986-08-27 |
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