JP2573072B2 - Manufacturing method of electrical connection member - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing an electrical connection member for electrically connecting electrical circuit components.

(Prior art)

As a method of electrically connecting electric circuit components to each other,
Wire bonding method, TAB (Tape Automated Bondin)
g) The method is known. However, in these methods, since the minimum pitch for preventing adjacent connecting portions from contacting each other is relatively large, it is not possible to cope with a case where a small pitch between connecting portions is required. There was a point.

In order to solve such a problem, it is necessary to electrically connect the electric circuit components using an electric connection member having a configuration in which a plurality of conductive members are mutually insulated and held in an insulating holder. It has been proposed (JP-A-63-2222437, JP-A-63-224235, etc.).

FIG. 3 is a schematic diagram showing an electrical connection between electric circuit components using such an electric connection member, in which 31 is an electric connection member, and 32 and 33 are electric circuit components to be connected. Show.
The electrical connection member 31 holds a plurality of rod-shaped conductive members 34 made of a metal or an alloy in a thin plate-shaped holder 35 made of an electrically insulating material by electrically insulating the respective conductive members 34 from each other. The conductive member 34 has bumps 38 at both ends.
And 39 protrude toward the electric circuit components 32 and 33 (FIG. 3 (a)). Then, the connecting portion 36 of the one electric circuit component 32 and the bump 38 of the conductive member 34, and the connecting portion 37 of the other electric circuit component 33 and the bump 39 of the conductive member 34 are respectively connected by, for example, an ultrasonic heating method. Are connected by alloying to electrically connect the electric circuit components 32 and 33 (FIG. 3 (b)).

Meanwhile, one of the present applicants has proposed a method shown in FIG. 4 as a method of manufacturing the electrical connection member 31 (Japanese Patent Application No. 63-133401).

First, a photosensitive resin 35a to be the holder 35 is applied on a base 40 made of a conductive material (FIG. 4A). Next, by exposing and developing a predetermined position in which the conductive member 34 is embedded in a later step, a hole 35b is formed in the photosensitive resin 35a to expose the base 40, and then the temperature is increased to remove the photosensitive resin 35a. It is cured (FIG. 4 (b)). Then, the base 40 near the hole 35b
Is etched to form a recess 41 below the hole 35b (FIG. 4 (c)).

Thereafter, the base 40 is plated with gold or the like, so that the conductive member 34 is filled in the concave portion 41 and the hole 35b, and the bump 39 is formed in the concave portion 41, and the photosensitive resin 35a is formed.
(FIG. 4D).

Then, the electrical connection member 31 is completed by removing the base 40 by metal etching (FIG. 4 (e)).

[Problems to be solved by the invention]

By the way, the bumps 38 and 39 formed on the exposed portions at both ends of the conductive member 34 are connected to the connecting portions of the electric circuit components 32 and 33 on both sides.
It is required to be securely connected to 36,37. What is important is the control of the height of the protrusion of the bump from the photosensitive resin 35a, and it is necessary to be able to cope with the state of the connection portion of the connected electric circuit component.

In the above manufacturing method, the height of the bump 39 can be controlled relatively easily by adjusting the degree of etching of the base 40. However, since the bump 38 is formed so as to be raised on the upper surface of the photosensitive resin 35a by performing a plating process on the conductive member 34, the height of the bump 38 varies. There is a problem that adjacent bumps spread in a direction and short-circuit due to contact with each other.

Apart from this, since the plating process for forming the conductive member 34 itself requires a long time, productivity is reduced, and there is also a problem that the cost may be increased due to the noble metal plating.

The present invention has been made in view of such circumstances, and can easily adjust the protrusion height of the bump of the conductive member,
It is an object of the present invention to provide an improved method for manufacturing an electrical connection member that can significantly improve productivity and reduce costs.

[Means for solving the problem]

According to a first aspect of the present invention, there is provided a method of manufacturing an electrical connection member, comprising: a base material formed by laminating a base and a holder made of an electrically insulating material, from a surface of the holder to the inside of the base. The holes are formed in a predetermined arrangement state, the holes are provided with a conductive member so that one end thereof is exposed from the surface, the base is removed, and the other end of the conductive member is removed from the back surface of the holder. A method for manufacturing an electrical connection member to be exposed, comprising: forming a mask having through holes formed in the same arrangement state as the plurality of holes on a surface of the holding member of the base material having the plurality of holes formed therein. A first step of placing the plurality of holes and the through hole of the mask with a conductive material to form the conductive member, and a second step of removing the mask. It is characterized by having.

In the method for manufacturing an electrical connection member according to a second aspect of the present invention, the base in the first aspect is made of a conductive material, and after the second step, the conductive member protruding from the surface of the holding member is formed. The method is characterized by having a step of plating a conductive material on the end.

In the method for manufacturing an electrical connection member according to a third aspect of the present invention, the conductive material according to the first or second aspect is in the form of a paste, and after the second step, the conductive material in the form of a paste is formed. Characterized by having a step of curing.

[Action]

In the first invention of the present application, a mask having through holes formed in the same arrangement state as the holes on the surface of the holding member in the base material having the plurality of holes formed so that the holes are aligned. It is placed and the holes are filled with a conductive material to form a conductive member. When the mask is also removed, the end of the conductive member protrudes from the surface of the holder to a position where the through hole of the mask is filled with a conductive material, and is formed as a bump.

In the second invention of the present application, after the conductive member is formed by the method of the first invention with the base made of a conductive material and the mask is removed, the conductive material is plated on the bumps on the surface side of the holder of the conductive member. Will be applied. Then, even if the bump height is low, the periphery of the hole is covered by plating,
The conductive member does not sink from the surface of the holder when removing the base.

In the third invention of the present application, the conductive material in the method of the first or second invention is in the form of a paste, and after removing the mask, the conductive material in the paste is cured to form a conductive member. You.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the drawings showing the embodiments.

FIG. 1 is a schematic sectional view showing the manufacturing process of the first and third inventions according to the present invention. 1 (a) to 1 (c) are the same as the above-mentioned conventional method. For example, a copper foil is used as the base 1, and a polyimide resin is applied on the base 1 as the insulating layer 2 serving as the holder, and prebaked. Is prepared as a base material (FIG. 1 (a)). Next, the insulating layer 2 is irradiated with light (exposure) through a photomask on which the arrangement pattern of the conductive members is formed, and development is performed. In this embodiment, by using a negative-type photomask, the polyimide resin remains after development in the portion irradiated with light, and the polyimide resin is removed by development in the portion not irradiated with light. Is formed (FIG. 1 (b)). Thereafter, the temperature is increased to imidize the polyimide resin, and the insulating layer 2 is cured.

Next, the substrate 1 exposed by the hole 3 is etched to form a concave portion 4 communicating with the hole 3 in the substrate 1 (FIG. 1 (c)). The depth of the recess 4 can be adjusted by the progress of the etching, and the protrusion height of the bump formed in the recess 4 in a later step can be adjusted.

Next, a mask 5 using a screen in which holes 5a having the same pattern as the arrangement pattern of the holes 3 of the insulating layer 2 are formed is placed on the insulating layer 2 so that the holes are aligned with each other (first). (D), a conductive paste is printed on the insulating layer 2 and the base 1 by a screen printing method. Here, the screen used for the mask 5 is a mesh screen,
Alternatively, there is a metal screen or the like, and several masks having different thicknesses are prepared for the mask 5 and selectively used to change the height of the conductive paste filled in the holes 5a according to the thickness of the mask. Therefore, the height of protrusion of the conductive paste in the hole 5a, that is, the bump formed on the upper surface of the insulating layer 2 can be controlled.

As the conductive paste, a silver-palladium-based conductor and a silver-platinum-based conductor, gold and silver palladium, a gold-platinum-based conductor, and the like are used, and specifically, a gold paste, a copper paste, a silver paste, a silver palladium paste, and the like are used. Can be

In the screen printing method, the conductive paste is pressed by a moving squeegee,
From 5a, the hole 3 of the insulating layer 2 and the recess 4 of the base 1 are filled. Since the squeegee moves uniformly in contact with the screen surface, it needs solvent resistance and abrasion resistance, and uses polyurethane, polychloroprene, carbon fluoride, or the like as a material.

When the conductive paste is filled up to the upper surface of the screen 5, that is, the required protrusion height, the screen 5 is removed and the level of the conductive paste is adjusted.
By drying in a temperature atmosphere of 5 to 10 minutes, most of the organic agent in the paste is evaporated and hardened. Thus, as shown in FIG. 1 (e), a conductive paste is formed as the conductive member 6, and bumps 61 are formed on the surface of the insulating layer 2.
The bumps 62 are respectively formed in the recesses 4 of the base 1.

Finally, the electrical connection member 10 is manufactured by etching away the base 1 using an etching solution that does not etch the insulating layer 2 and the conductive member 6 (FIG. 1 (f)).

In the above embodiment, the substrate 1 is made of copper, which is a conductive material. However, since it is not necessary to perform a plating process as in the prior art, a non-conductive material may be used instead.

FIG. 2 is a schematic sectional view showing the manufacturing process of the second invention of the present application. First, the manufacturing steps shown in FIGS. 1 (a) to 1 (e) according to the first and third aspects of the present invention are executed to manufacture the structure shown in FIG. 2 (a). Here, the base 1
Is required to be a conductive material.

Next, the base 1 is plated with gold or the like as a common electrode to form bumps 7 on the conductive members 6 (FIG. 2B). Then, the electrical connection member 11 is manufactured by etching away the base 1 (FIG. 2 (c)). The electrical connection member 11 according to this manufacturing method is suitable when it is desired to form the bumps 7 as low as possible. That is, by using a screen 5 as thin as possible, the protruding height of the conductive member 6 shown in FIG. However, in this state,
When the conductive member 6 is removed by etching, the conductive member 6 may be depressed or dropped in the direction in which the base 1 is located, and may cause a poor connection with an electric circuit component. In order to prevent this, bumps are formed by plating a conductive material. In addition, since this plating process is only for forming bumps, it does not require a long time as in the method according to the related art, and even when a noble metal is used as the conductive material, the plating amount is similarly small. As a result, cost increase can be minimized.

〔effect〕

As described above, in the method for manufacturing an electrical connection member according to the present invention, a mask having through holes formed in the same pattern as the arrangement state of the holes formed in the holding body and the base is held so that the holes are aligned. It is placed on a body, and a conductive material such as a conductive paste is filled into the holes and the through holes by a method such as screen printing, and the mask is removed and cured to form a conductive member. This makes it possible to easily form a desired protruding height in accordance with the thickness of the mask on the bumps of the conductive member without using a mask having an arbitrary thickness and without a risk of short-circuiting between the conductive members.

Further, since a conductive member is not formed by plating using a noble metal or the like, it can be manufactured in a short time and at a low cost, so that significant productivity improvement and cost reduction are expected.

Further, even when the conductive member may be depressed from the holder and cause a connection failure, the base is made of a conductive material, and the end of the conductive member is partially plated so that the end of the conductive member is securely held on the holder. The present invention has an excellent effect, for example, it is possible to make a simple connection.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a manufacturing process of the first and third inventions, FIG. 2 is a schematic sectional view showing a manufacturing process of the second invention,
FIG. 3 is a schematic view showing a configuration of an electrical connection member, and FIG. 4 is a schematic cross-sectional view showing a conventional manufacturing process of the electrical connection member. DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Insulating layer, 3 ... Hole, 4 ... Depression, 5
... Mask, 5a ... Hole, 6 ... Conductive member, 7 ... Bump, 10,11 ... Electrical connection member, 61,62 ... Bump

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toyohide Miyazaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Hiroshi Kondo 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inside (72) Inventor Takashi Sakaki ▼ 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Yoichi Tamura 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries Inside (72) Inventor Takahiro Okabayashi 1-3-1 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Kazuo Kondo 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries (72) Inventor Naka ▲ tsuka Yasuo 1-3-1 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Yuichi Ikegami Dai 4-5-33 Kitahama, Chuo-ku, Osaka City, Osaka Prefecture Sumitomo Metal Industries, Ltd.

Claims (3)

(57) [Claims] A plurality of holes extending from a surface of the holder to the inside of the substrate are formed in a predetermined arrangement on a base material formed by laminating a base and a holder made of an electrically insulating material; A method for manufacturing an electrical connection member, comprising: equipping a conductive member such that one end of the hole is exposed from the front surface, removing the base, and exposing the other end of the conductive member from the back surface of the holder. A surface of the holding body of the base material in which the plurality of holes are formed,
A mask having through holes formed in the same arrangement state as the plurality of holes is placed so that the holes are aligned with each other, and the plurality of holes and the through holes of the mask are filled with a conductive material to form the conductive member. A method for manufacturing an electrical connection member, comprising: a first step of forming; and a second step of removing the mask. 2. The method according to claim 1, wherein the base is made of a conductive material, and after the second step, a step of plating a conductive material on an end of the conductive member protruding from the surface of the holder is provided. A method for manufacturing the electrical connection member according to claim 1. 3. The electric device according to claim 1, wherein the conductive material is in the form of a paste, and after the second step, a step of curing the paste-like conductive material is provided. Manufacturing method of a dynamic connection member.