JPH0472793B2 - - Google Patents
Info
- Publication number
- JPH0472793B2 JPH0472793B2 JP62163988A JP16398887A JPH0472793B2 JP H0472793 B2 JPH0472793 B2 JP H0472793B2 JP 62163988 A JP62163988 A JP 62163988A JP 16398887 A JP16398887 A JP 16398887A JP H0472793 B2 JPH0472793 B2 JP H0472793B2
- Authority
- JP
- Japan
- Prior art keywords
- torr
- metal
- vacuum
- reaction
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000000919 ceramic Substances 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000007733 ion plating Methods 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 description 15
- 239000010936 titanium Substances 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 6
- 238000005304 joining Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002905 metal composite material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003746 solid phase reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910021341 titanium silicide Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62163988A JPS649878A (en) | 1987-07-02 | 1987-07-02 | Bonding between silicon nitride ceramics and metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62163988A JPS649878A (en) | 1987-07-02 | 1987-07-02 | Bonding between silicon nitride ceramics and metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS649878A JPS649878A (en) | 1989-01-13 |
| JPH0472793B2 true JPH0472793B2 (fi) | 1992-11-19 |
Family
ID=15784626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62163988A Granted JPS649878A (en) | 1987-07-02 | 1987-07-02 | Bonding between silicon nitride ceramics and metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS649878A (fi) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05117842A (ja) * | 1991-10-25 | 1993-05-14 | Ulvac Japan Ltd | 金属とセラミツクスの接合法 |
| JP3495052B2 (ja) * | 1992-07-15 | 2004-02-09 | 株式会社東芝 | メタライズ体およびその製造方法 |
| EP1617966B1 (en) * | 2003-03-30 | 2011-06-29 | L-3 Communications Corporation | Method of diffusion bonding a microchannel plate to a dielectric insulator ; diffusion bonded microchannel plate body assembly |
| KR102496716B1 (ko) * | 2015-10-27 | 2023-02-07 | 주식회사 아모센스 | 세라믹 기판 제조 방법 |
| JP2020145335A (ja) * | 2019-03-07 | 2020-09-10 | 株式会社Ｆｊコンポジット | 回路基板の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6032648A (ja) * | 1983-08-02 | 1985-02-19 | 株式会社東芝 | セラミックスのメタライジング方法及びセラミックスのメタライジング用合金箔 |
| JPS60177635A (ja) * | 1984-02-24 | 1985-09-11 | Toshiba Corp | 良熱伝導性基板の製造方法 |
| JPS61215272A (ja) * | 1985-03-20 | 1986-09-25 | 株式会社東芝 | セラミツクス部材と金属部材との接合方法 |
| JPS63190773A (ja) * | 1987-02-02 | 1988-08-08 | 住友電気工業株式会社 | 接合強度の優れたセラミツクスと金属の接合体 |
-
1987
- 1987-07-02 JP JP62163988A patent/JPS649878A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6032648A (ja) * | 1983-08-02 | 1985-02-19 | 株式会社東芝 | セラミックスのメタライジング方法及びセラミックスのメタライジング用合金箔 |
| JPS60177635A (ja) * | 1984-02-24 | 1985-09-11 | Toshiba Corp | 良熱伝導性基板の製造方法 |
| JPS61215272A (ja) * | 1985-03-20 | 1986-09-25 | 株式会社東芝 | セラミツクス部材と金属部材との接合方法 |
| JPS63190773A (ja) * | 1987-02-02 | 1988-08-08 | 住友電気工業株式会社 | 接合強度の優れたセラミツクスと金属の接合体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS649878A (en) | 1989-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |