JPH0472389B2 - - Google Patents

Info

Publication number
JPH0472389B2
JPH0472389B2 JP59215235A JP21523584A JPH0472389B2 JP H0472389 B2 JPH0472389 B2 JP H0472389B2 JP 59215235 A JP59215235 A JP 59215235A JP 21523584 A JP21523584 A JP 21523584A JP H0472389 B2 JPH0472389 B2 JP H0472389B2
Authority
JP
Japan
Prior art keywords
strip
strips
resin
lead frame
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59215235A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6194349A (ja
Inventor
Sadao Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59215235A priority Critical patent/JPS6194349A/ja
Publication of JPS6194349A publication Critical patent/JPS6194349A/ja
Publication of JPH0472389B2 publication Critical patent/JPH0472389B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/048—
    • H10W72/0198—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59215235A 1984-10-16 1984-10-16 樹脂封止形半導体装置の製造方法及びその製造方法に使用するリ−ドフレ−ム Granted JPS6194349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59215235A JPS6194349A (ja) 1984-10-16 1984-10-16 樹脂封止形半導体装置の製造方法及びその製造方法に使用するリ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59215235A JPS6194349A (ja) 1984-10-16 1984-10-16 樹脂封止形半導体装置の製造方法及びその製造方法に使用するリ−ドフレ−ム

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP1150428A Division JPH06103728B2 (ja) 1989-06-15 1989-06-15 樹脂封止形半導体装置の製造方法
JP1150427A Division JPH0736430B2 (ja) 1989-06-15 1989-06-15 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6194349A JPS6194349A (ja) 1986-05-13
JPH0472389B2 true JPH0472389B2 (enExample) 1992-11-18

Family

ID=16668951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59215235A Granted JPS6194349A (ja) 1984-10-16 1984-10-16 樹脂封止形半導体装置の製造方法及びその製造方法に使用するリ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS6194349A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736430B2 (ja) * 1989-06-15 1995-04-19 サンケン電気株式会社 樹脂封止形半導体装置の製造方法
NL9100470A (nl) * 1991-03-15 1992-10-01 Asm Fico Tooling Werkwijze en inrichting voor het uit op een leadframe opgenomen geintegreerde schakelingen vervaardigen van een enkelvoudig produkt.

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178352A (en) * 1981-04-28 1982-11-02 Matsushita Electronics Corp Manufacture of resin sealing type semiconductor device and lead frame employed thereon

Also Published As

Publication number Publication date
JPS6194349A (ja) 1986-05-13

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