JPH047115B2 - - Google Patents

Info

Publication number
JPH047115B2
JPH047115B2 JP60174046A JP17404685A JPH047115B2 JP H047115 B2 JPH047115 B2 JP H047115B2 JP 60174046 A JP60174046 A JP 60174046A JP 17404685 A JP17404685 A JP 17404685A JP H047115 B2 JPH047115 B2 JP H047115B2
Authority
JP
Japan
Prior art keywords
aromatic
metal
insulating layer
paper
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60174046A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6235593A (ja
Inventor
Shigeyoshi Hirata
Mitsuhiro Shimizu
Ryota Nishama
Shinichi Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Mitsubishi Paper Mills Ltd
Nippon Rika Kogyosho Co Ltd
Original Assignee
Mitsubishi Paper Mills Ltd
Nippon Rika Kogyosho Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Paper Mills Ltd, Nippon Rika Kogyosho Co Ltd, Toshiba Chemical Corp filed Critical Mitsubishi Paper Mills Ltd
Priority to JP17404685A priority Critical patent/JPS6235593A/ja
Publication of JPS6235593A publication Critical patent/JPS6235593A/ja
Publication of JPH047115B2 publication Critical patent/JPH047115B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Organic Insulating Materials (AREA)
JP17404685A 1985-08-09 1985-08-09 回路用金属基板 Granted JPS6235593A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17404685A JPS6235593A (ja) 1985-08-09 1985-08-09 回路用金属基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17404685A JPS6235593A (ja) 1985-08-09 1985-08-09 回路用金属基板

Publications (2)

Publication Number Publication Date
JPS6235593A JPS6235593A (ja) 1987-02-16
JPH047115B2 true JPH047115B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-02-07

Family

ID=15971672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17404685A Granted JPS6235593A (ja) 1985-08-09 1985-08-09 回路用金属基板

Country Status (1)

Country Link
JP (1) JPS6235593A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291085A (ja) * 1986-06-10 1987-12-17 ナイルス部品株式会社 放熱基板
JPH0828559B2 (ja) * 1987-04-23 1996-03-21 松下電器産業株式会社 印刷配線板
JPH0793478B2 (ja) * 1988-03-23 1995-10-09 松下電器産業株式会社 半導体チップ搭載用プリント回路板
JPH0793481B2 (ja) * 1988-03-23 1995-10-09 松下電器産業株式会社 金属ベース印刷配線板
JP2734866B2 (ja) * 1992-02-13 1998-04-02 株式会社丸和製作所 印刷配線付金属又はセラミックスの成形品及びその製造方法
JP4455806B2 (ja) * 2001-05-24 2010-04-21 日立化成工業株式会社 プリプレグ及び積層板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58197604A (ja) * 1982-05-12 1983-11-17 日立化成工業株式会社 複合シ−ト
JPS60145837A (ja) * 1984-01-06 1985-08-01 三菱電線工業株式会社 電気絶縁基板の製造法

Also Published As

Publication number Publication date
JPS6235593A (ja) 1987-02-16

Similar Documents

Publication Publication Date Title
KR100695022B1 (ko) 저유전율 수지와 파라배향 방향족 폴리아미드로 이루어진 복합 필름, 이의 프리프레그 및 이들의 용도
JPH0359105B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO2004102589A1 (ja) 絶縁材料、フィルム、回路基板及びこれらの製造方法
JP5849390B2 (ja) エポキシ樹脂前駆体組成物、プリプレグ、積層板、樹脂シート、プリント配線板および半導体装置
JP4572423B2 (ja) 銅張積層板の製造方法及びこれを用いたプリント配線板、多層プリント配線板
JPH047115B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2002187937A (ja) エポキシ樹脂組成物、プリプレグ及び金属箔張り積層板
JP2000301534A (ja) プリプレグ、金属張積層板及びこれらを用いた印刷配線板
JP4341086B2 (ja) 印刷配線板用プリプレグ
KR102712135B1 (ko) 프리프레그용 열경화성 수지 조성물, 프리프레그, 및 금속 박 적층 판
JP2904311B2 (ja) 印刷配線板用プリプレグ、樹脂ワニス及び樹脂組成物とそれらを用いて作製される印刷配線板用積層板
JP3001400B2 (ja) 高周波用プリント配線基板とその製造方法
JP2510065B2 (ja) 電子回路パッケ―ジの製造方法
JP4245197B2 (ja) 印刷配線板用プリプレグの製造方法及びこれを用いた金属張積層板
JPH1140909A (ja) 配線基板用プリプレグと銅貼り配線基板
JP3343330B2 (ja) 絶縁ワニスの製造方法及びこの方法によって得られた絶縁ワニス並びにこの絶縁ワニスを用いた多層プリント配線板
JPH041786B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2008111188A (ja) プリント配線板用の銅箔
JP2000238162A (ja) 積層板
JPH0219989B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2003008212A (ja) 配線回路付き樹脂材料及びそれらの製造方法と多層プリント配線板
JP2908546B2 (ja) 回路用金属基板
JPH08165333A (ja) プリプレグの製造方法
JPS6336934B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0564877B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)