JPH0469822B2 - - Google Patents

Info

Publication number
JPH0469822B2
JPH0469822B2 JP62048880A JP4888087A JPH0469822B2 JP H0469822 B2 JPH0469822 B2 JP H0469822B2 JP 62048880 A JP62048880 A JP 62048880A JP 4888087 A JP4888087 A JP 4888087A JP H0469822 B2 JPH0469822 B2 JP H0469822B2
Authority
JP
Japan
Prior art keywords
die pad
resin
lead
lead frame
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62048880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63216365A (ja
Inventor
Yukinori Sakumoto
Atsushi Koshimura
Hiroshi Matsushita
Masaki Tsushima
Mitsuharu Shimizu
Hideo Ariga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Tomoegawa Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd, Tomoegawa Paper Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP4888087A priority Critical patent/JPS63216365A/ja
Publication of JPS63216365A publication Critical patent/JPS63216365A/ja
Publication of JPH0469822B2 publication Critical patent/JPH0469822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4888087A 1987-03-05 1987-03-05 半導体装置 Granted JPS63216365A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4888087A JPS63216365A (ja) 1987-03-05 1987-03-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4888087A JPS63216365A (ja) 1987-03-05 1987-03-05 半導体装置

Publications (2)

Publication Number Publication Date
JPS63216365A JPS63216365A (ja) 1988-09-08
JPH0469822B2 true JPH0469822B2 (enrdf_load_stackoverflow) 1992-11-09

Family

ID=12815599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4888087A Granted JPS63216365A (ja) 1987-03-05 1987-03-05 半導体装置

Country Status (1)

Country Link
JP (1) JPS63216365A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920020687A (ko) * 1991-04-16 1992-11-21 김광호 반도체 패키지
JP3281994B2 (ja) * 1993-06-10 2002-05-13 日本テキサス・インスツルメンツ株式会社 樹脂封止型半導体装置
EP0642160A1 (en) * 1993-09-07 1995-03-08 Motorola, Inc. Semiconductor device with improved support means

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5453363U (enrdf_load_stackoverflow) * 1977-09-22 1979-04-13
JPS6068639A (ja) * 1983-08-31 1985-04-19 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS63216365A (ja) 1988-09-08

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