JPH0466094B2 - - Google Patents
Info
- Publication number
- JPH0466094B2 JPH0466094B2 JP10531085A JP10531085A JPH0466094B2 JP H0466094 B2 JPH0466094 B2 JP H0466094B2 JP 10531085 A JP10531085 A JP 10531085A JP 10531085 A JP10531085 A JP 10531085A JP H0466094 B2 JPH0466094 B2 JP H0466094B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pattern
- mask
- section
- mask plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10P95/00—
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60105310A JPS61263124A (ja) | 1985-05-16 | 1985-05-16 | 半導体装置製造用のマスク板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60105310A JPS61263124A (ja) | 1985-05-16 | 1985-05-16 | 半導体装置製造用のマスク板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61263124A JPS61263124A (ja) | 1986-11-21 |
| JPH0466094B2 true JPH0466094B2 (enExample) | 1992-10-22 |
Family
ID=14404129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60105310A Granted JPS61263124A (ja) | 1985-05-16 | 1985-05-16 | 半導体装置製造用のマスク板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61263124A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003022987A (ja) * | 2001-07-09 | 2003-01-24 | Sanyo Electric Co Ltd | 化合物半導体装置の製造方法 |
-
1985
- 1985-05-16 JP JP60105310A patent/JPS61263124A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61263124A (ja) | 1986-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2652015B2 (ja) | 半導体装置 | |
| JPH0329310A (ja) | 半導体ウェハ | |
| JPH0466094B2 (enExample) | ||
| US7601485B2 (en) | Exposure method | |
| JPH05326696A (ja) | 半導体ウエハー | |
| JPH0393251A (ja) | 半導体装置およびその製造方法 | |
| KR100261164B1 (ko) | 오버레이 측정 타겟 및 이의 제조방법 | |
| JPS6151845A (ja) | 半導体装置の切断方法 | |
| JPH0645690A (ja) | 半導体レーザの製造方法 | |
| JP2001035776A (ja) | 半導体装置の製造方法及びレチクル | |
| JPS6118955A (ja) | レテイクルマスク | |
| JPH11195667A (ja) | ボンディング用パッド及びホトマスクのアライメント方法 | |
| JPS61263117A (ja) | 半導体装置製造用のマスク板 | |
| KR0149189B1 (ko) | 웨이퍼와 마스크의 자동정렬방법 | |
| JPH039327Y2 (enExample) | ||
| JPS59144126A (ja) | 半導体装置の製造方法 | |
| KR0186077B1 (ko) | 반도체 웨이퍼의 주변노광용 마스크 및 이를 이용한 주변노광방법 | |
| JPH021106A (ja) | パターン形成方法 | |
| JPS62113424A (ja) | 半導体装置製造用基板 | |
| JPS60239086A (ja) | 半導体レーザ装置 | |
| JPS63136543A (ja) | 半導体装置 | |
| JPH0498881A (ja) | Ledヘッド | |
| KR20080021392A (ko) | 식별부를 갖는 반도체 웨이퍼 | |
| JPS6074519A (ja) | 電子ビ−ム露光における試料の位置合せ方法 | |
| JPS6325920A (ja) | 露光方法および装置 |