JPH0466094B2 - - Google Patents
Info
- Publication number
- JPH0466094B2 JPH0466094B2 JP10531085A JP10531085A JPH0466094B2 JP H0466094 B2 JPH0466094 B2 JP H0466094B2 JP 10531085 A JP10531085 A JP 10531085A JP 10531085 A JP10531085 A JP 10531085A JP H0466094 B2 JPH0466094 B2 JP H0466094B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pattern
- mask
- section
- mask plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60105310A JPS61263124A (ja) | 1985-05-16 | 1985-05-16 | 半導体装置製造用のマスク板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60105310A JPS61263124A (ja) | 1985-05-16 | 1985-05-16 | 半導体装置製造用のマスク板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61263124A JPS61263124A (ja) | 1986-11-21 |
JPH0466094B2 true JPH0466094B2 (enrdf_load_stackoverflow) | 1992-10-22 |
Family
ID=14404129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60105310A Granted JPS61263124A (ja) | 1985-05-16 | 1985-05-16 | 半導体装置製造用のマスク板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61263124A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003022987A (ja) * | 2001-07-09 | 2003-01-24 | Sanyo Electric Co Ltd | 化合物半導体装置の製造方法 |
-
1985
- 1985-05-16 JP JP60105310A patent/JPS61263124A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61263124A (ja) | 1986-11-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2652015B2 (ja) | 半導体装置 | |
US5716889A (en) | Method of arranging alignment marks | |
US5943587A (en) | Method for making offset alignment marks | |
JPH0466094B2 (enrdf_load_stackoverflow) | ||
US7601485B2 (en) | Exposure method | |
JPS62155532A (ja) | 半導体ウエ−ハの位置合せマ−クの形成方法 | |
JPH0393251A (ja) | 半導体装置およびその製造方法 | |
KR100261164B1 (ko) | 오버레이 측정 타겟 및 이의 제조방법 | |
JPH02278781A (ja) | 半導体レーザダイオード | |
JPS6151845A (ja) | 半導体装置の切断方法 | |
JPH0645690A (ja) | 半導体レーザの製造方法 | |
JP2001035776A (ja) | 半導体装置の製造方法及びレチクル | |
JPS6118955A (ja) | レテイクルマスク | |
JPH01287937A (ja) | フィルムキャリアテープ | |
JPS61263117A (ja) | 半導体装置製造用のマスク板 | |
KR0149189B1 (ko) | 웨이퍼와 마스크의 자동정렬방법 | |
JPH039327Y2 (enrdf_load_stackoverflow) | ||
JPH11195667A (ja) | ボンディング用パッド及びホトマスクのアライメント方法 | |
KR0186077B1 (ko) | 반도체 웨이퍼의 주변노광용 마스크 및 이를 이용한 주변노광방법 | |
JPH021106A (ja) | パターン形成方法 | |
JPS58207621A (ja) | 半導体ウエ−ハ | |
JPS60239086A (ja) | 半導体レーザ装置 | |
JPH0498881A (ja) | Ledヘッド | |
JPH02276237A (ja) | 荷電ビームレジストの積層方法 | |
JPS6325920A (ja) | 露光方法および装置 |