JPH0464833B2 - - Google Patents
Info
- Publication number
- JPH0464833B2 JPH0464833B2 JP1394684A JP1394684A JPH0464833B2 JP H0464833 B2 JPH0464833 B2 JP H0464833B2 JP 1394684 A JP1394684 A JP 1394684A JP 1394684 A JP1394684 A JP 1394684A JP H0464833 B2 JPH0464833 B2 JP H0464833B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- plating layer
- base
- abrasive grains
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000006061 abrasive grain Substances 0.000 claims description 56
- 238000007747 plating Methods 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000010953 base metal Substances 0.000 claims description 31
- 238000002844 melting Methods 0.000 claims description 24
- 230000008018 melting Effects 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000000155 melt Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 65
- 239000000463 material Substances 0.000 description 9
- 238000005219 brazing Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1394684A JPS60161070A (ja) | 1984-01-27 | 1984-01-27 | 電着砥石の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1394684A JPS60161070A (ja) | 1984-01-27 | 1984-01-27 | 電着砥石の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60161070A JPS60161070A (ja) | 1985-08-22 |
| JPH0464833B2 true JPH0464833B2 (fr) | 1992-10-16 |
Family
ID=11847367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1394684A Granted JPS60161070A (ja) | 1984-01-27 | 1984-01-27 | 電着砥石の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60161070A (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH072308B2 (ja) * | 1989-11-13 | 1995-01-18 | 株式会社永岡産業 | ダイヤモンド砥石の製造方法 |
| NL9401528A (nl) * | 1994-09-21 | 1996-05-01 | Sandro Giovanni Guiseppe Ferro | Schuurvoorwerp en werkwijze voor het maken daarvan |
| JPH08229828A (ja) * | 1994-11-16 | 1996-09-10 | Osaka Diamond Ind Co Ltd | 超砥粒工具及びその製造方法 |
| JP2969440B2 (ja) * | 1995-05-31 | 1999-11-02 | 大阪ダイヤモンド工業株式会社 | アルミニウム合金用の回転多刃工具 |
| JP7449829B2 (ja) * | 2020-09-09 | 2024-03-14 | 株式会社アマダ | 切削ブレード及び切削ブレードの製造方法 |
-
1984
- 1984-01-27 JP JP1394684A patent/JPS60161070A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60161070A (ja) | 1985-08-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |