JPH0464460B2 - - Google Patents
Info
- Publication number
- JPH0464460B2 JPH0464460B2 JP24553885A JP24553885A JPH0464460B2 JP H0464460 B2 JPH0464460 B2 JP H0464460B2 JP 24553885 A JP24553885 A JP 24553885A JP 24553885 A JP24553885 A JP 24553885A JP H0464460 B2 JPH0464460 B2 JP H0464460B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- semi
- substrate
- lead frame
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000002184 metal Substances 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 47
- 239000004065 semiconductor Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 37
- 229910000679 solder Inorganic materials 0.000 claims description 35
- 230000002950 deficient Effects 0.000 claims description 34
- 230000007246 mechanism Effects 0.000 claims description 24
- 238000002788 crimping Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 9
- 210000000078 claw Anatomy 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 239000011120 plywood Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims 1
- 239000011265 semifinished product Substances 0.000 description 31
- 239000000047 product Substances 0.000 description 26
- 238000003384 imaging method Methods 0.000 description 14
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24553885A JPS62104041A (ja) | 1985-10-30 | 1985-10-30 | ガラス封止形半導体装置の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24553885A JPS62104041A (ja) | 1985-10-30 | 1985-10-30 | ガラス封止形半導体装置の製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62104041A JPS62104041A (ja) | 1987-05-14 |
| JPH0464460B2 true JPH0464460B2 (ko) | 1992-10-15 |
Family
ID=17135185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24553885A Granted JPS62104041A (ja) | 1985-10-30 | 1985-10-30 | ガラス封止形半導体装置の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104041A (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102432018B1 (ko) * | 2020-03-13 | 2022-08-16 | 주식회사 파워로직스 | 보호회로모듈 제조장치 |
-
1985
- 1985-10-30 JP JP24553885A patent/JPS62104041A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62104041A (ja) | 1987-05-14 |
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