JPH046218Y2 - - Google Patents
Info
- Publication number
- JPH046218Y2 JPH046218Y2 JP1985013096U JP1309685U JPH046218Y2 JP H046218 Y2 JPH046218 Y2 JP H046218Y2 JP 1985013096 U JP1985013096 U JP 1985013096U JP 1309685 U JP1309685 U JP 1309685U JP H046218 Y2 JPH046218 Y2 JP H046218Y2
- Authority
- JP
- Japan
- Prior art keywords
- coating layer
- printed circuit
- surface coating
- circuit board
- curved portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002345 surface coating layer Substances 0.000 claims description 20
- 230000007261 regionalization Effects 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 7
- 239000011247 coating layer Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985013096U JPH046218Y2 (US08124630-20120228-C00152.png) | 1985-02-01 | 1985-02-01 | |
US06/821,606 US4716259A (en) | 1985-02-01 | 1986-01-23 | Both-side flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985013096U JPH046218Y2 (US08124630-20120228-C00152.png) | 1985-02-01 | 1985-02-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61129374U JPS61129374U (US08124630-20120228-C00152.png) | 1986-08-13 |
JPH046218Y2 true JPH046218Y2 (US08124630-20120228-C00152.png) | 1992-02-20 |
Family
ID=11823619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985013096U Expired JPH046218Y2 (US08124630-20120228-C00152.png) | 1985-02-01 | 1985-02-01 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4716259A (US08124630-20120228-C00152.png) |
JP (1) | JPH046218Y2 (US08124630-20120228-C00152.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018075267A (ja) * | 2016-11-11 | 2018-05-17 | 京楽産業.株式会社 | 遊技機 |
JP2018191659A (ja) * | 2017-05-12 | 2018-12-06 | 株式会社三共 | 遊技機 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH041750Y2 (US08124630-20120228-C00152.png) * | 1986-08-07 | 1992-01-21 | ||
US4990948A (en) * | 1986-12-27 | 1991-02-05 | Canon Kabushiki Kaisha | Flexible printed circuit board |
JPH02117196A (ja) * | 1988-10-26 | 1990-05-01 | Canon Inc | プリント基板 |
US5345205A (en) * | 1990-04-05 | 1994-09-06 | General Electric Company | Compact high density interconnected microwave system |
US5462838A (en) * | 1991-03-06 | 1995-10-31 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing a curved surface multi-layer wiring board |
US5449591A (en) * | 1991-03-06 | 1995-09-12 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing a curved surface multi-layer wiring board |
US5250758A (en) * | 1991-05-21 | 1993-10-05 | Elf Technologies, Inc. | Methods and systems of preparing extended length flexible harnesses |
US5198965A (en) * | 1991-12-18 | 1993-03-30 | International Business Machines Corporation | Free form packaging of specific functions within a computer system |
US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
US5383788A (en) * | 1993-05-20 | 1995-01-24 | W. L. Gore & Associates, Inc. | Electrical interconnect assembly |
US5496970A (en) * | 1993-05-20 | 1996-03-05 | W. L. Gore & Associates, Inc. | Planar cable array |
US5419038A (en) * | 1993-06-17 | 1995-05-30 | Fujitsu Limited | Method for fabricating thin-film interconnector |
US5541399A (en) * | 1994-09-30 | 1996-07-30 | Palomar Technologies Corporation | RF transponder with resonant crossover antenna coil |
ES2127125B1 (es) * | 1997-02-05 | 1999-11-16 | Mecanismos Aux Ind | Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos. |
FR2786951B1 (fr) * | 1998-12-02 | 2001-01-12 | Framatome Connectors Int | Disposition en sandwich coudee de rails conducteurs |
US6596184B1 (en) | 1999-02-15 | 2003-07-22 | International Business Machines Corporation | Non-homogeneous laminate materials for suspensions with conductor support blocks |
US6533950B1 (en) * | 1999-02-27 | 2003-03-18 | International Business Machines Corporation | Non-homogeneous laminate material for suspension with flexure motion limiter |
US6585902B1 (en) * | 1999-02-27 | 2003-07-01 | International Business Machines Corporation | Non-homogeneous laminate material for suspension with vibration dampening |
KR100733877B1 (ko) * | 2000-07-06 | 2007-07-02 | 엘지.필립스 엘시디 주식회사 | 가요성 인쇄회로 필름 |
JP2002220045A (ja) * | 2001-01-26 | 2002-08-06 | Honda Motor Co Ltd | 電動駐車ブレーキ装置 |
CN1765161B (zh) * | 2003-04-18 | 2011-06-22 | 揖斐电株式会社 | 刚挠性电路板 |
JP4151584B2 (ja) * | 2004-02-16 | 2008-09-17 | セイコーエプソン株式会社 | 光学装置、およびプロジェクタ |
JP4536430B2 (ja) * | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
JP4251129B2 (ja) | 2004-10-25 | 2009-04-08 | セイコーエプソン株式会社 | 実装構造体、電気光学装置及び電子機器 |
GB2421358B (en) * | 2004-12-16 | 2007-02-21 | Sendo Int Ltd | Wireless communication unit and flexible printed circuit board therefor |
TWI262461B (en) * | 2005-04-15 | 2006-09-21 | Au Optronics Corp | Double-sided display device |
DE102006033269B4 (de) * | 2006-07-18 | 2010-10-28 | Continental Automotive Gmbh | Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper |
DE102006033477B3 (de) * | 2006-07-19 | 2008-01-24 | Siemens Ag | Leiterträger und Anordnung mit Leiterträger |
JPWO2008149500A1 (ja) * | 2007-05-29 | 2010-08-19 | 住友ベークライト株式会社 | フレキシブル基板および開閉電子機器 |
US9402303B2 (en) * | 2013-06-03 | 2016-07-26 | Apple Inc. | Flexible printed circuit cables with slits |
KR20160110861A (ko) * | 2015-03-13 | 2016-09-22 | 삼성디스플레이 주식회사 | 연성 회로 기판 및 이를 포함하는 표시 장치 |
KR102465929B1 (ko) | 2016-02-19 | 2022-11-10 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 이를 포함하는 이동 단말기 |
JP7014367B2 (ja) * | 2016-11-18 | 2022-02-01 | 住友電工デバイス・イノベーション株式会社 | 光モジュール |
CN107864552B (zh) * | 2017-11-09 | 2019-12-06 | 京东方科技集团股份有限公司 | 柔性电路板及其组装方法以及显示装置 |
JP6962459B2 (ja) * | 2018-05-07 | 2021-11-05 | 株式会社村田製作所 | 多層基板及びその接続構造 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5913390A (ja) * | 1982-07-14 | 1984-01-24 | ソニー株式会社 | フレキシブル両面プリント基板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE538934A (US08124630-20120228-C00152.png) * | 1954-06-15 | |||
GB1241169A (en) * | 1967-09-21 | 1971-07-28 | Elliott Brothers London Ltd | Improvements relating to printed circuits |
DE2914336A1 (de) * | 1979-04-09 | 1980-11-06 | Telefonbau & Normalzeit Gmbh | Verfahren zur herstellung starr- flexibler leiterplatten |
JPS5665680U (US08124630-20120228-C00152.png) * | 1979-10-25 | 1981-06-01 | ||
JPS5748658A (en) * | 1980-09-08 | 1982-03-20 | Teikoku Hormone Mfg Co Ltd | Immunologic measuring method and reagent for measurement |
JPS57104563U (US08124630-20120228-C00152.png) * | 1980-12-18 | 1982-06-28 | ||
JPS58103182U (ja) * | 1981-12-29 | 1983-07-13 | 日産自動車株式会社 | フレキシブル・プリント基板 |
JPS605240A (ja) * | 1983-06-24 | 1985-01-11 | 日本セメント株式会社 | 脆性物体の破砕方法 |
-
1985
- 1985-02-01 JP JP1985013096U patent/JPH046218Y2/ja not_active Expired
-
1986
- 1986-01-23 US US06/821,606 patent/US4716259A/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5913390A (ja) * | 1982-07-14 | 1984-01-24 | ソニー株式会社 | フレキシブル両面プリント基板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018075267A (ja) * | 2016-11-11 | 2018-05-17 | 京楽産業.株式会社 | 遊技機 |
JP2018191659A (ja) * | 2017-05-12 | 2018-12-06 | 株式会社三共 | 遊技機 |
Also Published As
Publication number | Publication date |
---|---|
JPS61129374U (US08124630-20120228-C00152.png) | 1986-08-13 |
US4716259A (en) | 1987-12-29 |
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