JPH0449252B2 - - Google Patents
Info
- Publication number
- JPH0449252B2 JPH0449252B2 JP21079485A JP21079485A JPH0449252B2 JP H0449252 B2 JPH0449252 B2 JP H0449252B2 JP 21079485 A JP21079485 A JP 21079485A JP 21079485 A JP21079485 A JP 21079485A JP H0449252 B2 JPH0449252 B2 JP H0449252B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- chuck
- charging
- lower mold
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000012778 molding material Substances 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21079485A JPS6270013A (ja) | 1985-09-24 | 1985-09-24 | 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21079485A JPS6270013A (ja) | 1985-09-24 | 1985-09-24 | 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6270013A JPS6270013A (ja) | 1987-03-31 |
| JPH0449252B2 true JPH0449252B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-08-11 |
Family
ID=16595240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21079485A Granted JPS6270013A (ja) | 1985-09-24 | 1985-09-24 | 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6270013A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2505051B2 (ja) * | 1990-02-01 | 1996-06-05 | 三菱電機株式会社 | 半導体素子用樹脂封止装置及び半導体装置の製造方法 |
| US5391346A (en) * | 1991-11-20 | 1995-02-21 | Rohm Co., Ltd. | Method for making molded photointerrupters |
| SG66304A1 (en) * | 1996-04-25 | 1999-07-20 | Fastech System S Pte Ltd | Injection moulding apparatus and method |
| DE19949851C2 (de) * | 1999-10-15 | 2001-09-13 | Hekuma Herbst Maschb Gmbh | Kunststoff-Spritzgießmaschine, Handlingsystem sowie Verfahren zum Überführen eines Gegenstandes |
| KR100481407B1 (ko) * | 2002-03-13 | 2005-04-07 | 한양로보틱스 주식회사 | 취출기의 인서트위치 계측장치 |
-
1985
- 1985-09-24 JP JP21079485A patent/JPS6270013A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6270013A (ja) | 1987-03-31 |