JPH0447469B2 - - Google Patents
Info
- Publication number
- JPH0447469B2 JPH0447469B2 JP61072734A JP7273486A JPH0447469B2 JP H0447469 B2 JPH0447469 B2 JP H0447469B2 JP 61072734 A JP61072734 A JP 61072734A JP 7273486 A JP7273486 A JP 7273486A JP H0447469 B2 JPH0447469 B2 JP H0447469B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- insulating layer
- substrate
- lighting device
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61072734A JPS62229987A (ja) | 1986-03-31 | 1986-03-31 | 照明装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61072734A JPS62229987A (ja) | 1986-03-31 | 1986-03-31 | 照明装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62229987A JPS62229987A (ja) | 1987-10-08 |
| JPH0447469B2 true JPH0447469B2 (it) | 1992-08-04 |
Family
ID=13497883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61072734A Granted JPS62229987A (ja) | 1986-03-31 | 1986-03-31 | 照明装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62229987A (it) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0744029Y2 (ja) * | 1990-12-28 | 1995-10-09 | 株式会社小糸製作所 | Ｌｅｄモジュール |
| SE517916C2 (sv) * | 1999-12-17 | 2002-08-06 | Ericsson Telefon Ab L M | Chipsbärare, system och förfarande vid tillverkning av chipsbärare |
| GB2361581A (en) * | 2000-04-20 | 2001-10-24 | Lite On Electronics Inc | A light emitting diode device |
| JP2006295084A (ja) * | 2005-04-14 | 2006-10-26 | Citizen Electronics Co Ltd | 発光ダイオードのパッケージ構造 |
| JP4753419B2 (ja) * | 2005-08-05 | 2011-08-24 | パナソニック株式会社 | 発光モジュール |
| JP4730708B2 (ja) * | 2006-05-15 | 2011-07-20 | 岩崎電気株式会社 | Ｌｅｄ照射装置 |
| TW200824142A (en) * | 2006-11-22 | 2008-06-01 | Lighthouse Technology Co Ltd | High power diode holder and thereof package is described |
| JP2008244350A (ja) * | 2007-03-28 | 2008-10-09 | ▲せん▼宗文 | 多粒の表面粘着型発光ダイオードの製造方法とその構造 |
| JP2016195177A (ja) * | 2015-03-31 | 2016-11-17 | Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 | 光照射モジュール |
| JP6409845B2 (ja) * | 2016-10-06 | 2018-10-24 | 日立化成株式会社 | 光半導体素子搭載用基板および光半導体装置 |
| JP6740997B2 (ja) * | 2017-12-27 | 2020-08-19 | 日立化成株式会社 | 光半導体素子搭載用基板および光半導体装置 |
-
1986
- 1986-03-31 JP JP61072734A patent/JPS62229987A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62229987A (ja) | 1987-10-08 |
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