JPH044742B2 - - Google Patents

Info

Publication number
JPH044742B2
JPH044742B2 JP60097509A JP9750985A JPH044742B2 JP H044742 B2 JPH044742 B2 JP H044742B2 JP 60097509 A JP60097509 A JP 60097509A JP 9750985 A JP9750985 A JP 9750985A JP H044742 B2 JPH044742 B2 JP H044742B2
Authority
JP
Japan
Prior art keywords
bonded
wafer
semiconductor substrate
manufacturing
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60097509A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61256621A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60097509A priority Critical patent/JPS61256621A/ja
Publication of JPS61256621A publication Critical patent/JPS61256621A/ja
Publication of JPH044742B2 publication Critical patent/JPH044742B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P90/1914—

Landscapes

  • Recrystallisation Techniques (AREA)
JP60097509A 1985-05-08 1985-05-08 接着型半導体基板の製造方法 Granted JPS61256621A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60097509A JPS61256621A (ja) 1985-05-08 1985-05-08 接着型半導体基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60097509A JPS61256621A (ja) 1985-05-08 1985-05-08 接着型半導体基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61256621A JPS61256621A (ja) 1986-11-14
JPH044742B2 true JPH044742B2 (Direct) 1992-01-29

Family

ID=14194225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60097509A Granted JPS61256621A (ja) 1985-05-08 1985-05-08 接着型半導体基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61256621A (Direct)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345435A (ja) * 2000-03-29 2001-12-14 Shin Etsu Handotai Co Ltd シリコンウェーハ及び貼り合わせウェーハの製造方法、並びにその貼り合わせウェーハ

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2535957B2 (ja) * 1987-09-29 1996-09-18 ソニー株式会社 半導体基板
JP2604488B2 (ja) * 1989-06-21 1997-04-30 富士通株式会社 接合ウエハおよびその製造方法
JP2010105141A (ja) * 2008-10-31 2010-05-13 Naoetsu Electronics Co Ltd 半導体接合ウエーハの製造方法
US20120028555A1 (en) 2010-07-30 2012-02-02 Memc Electronic Materials, Inc. Grinding Tool For Trapezoid Grinding Of A Wafer
US8310031B2 (en) 2010-07-30 2012-11-13 Memc Electronic Materials, Inc. Semiconductor and solar wafers
US20120028439A1 (en) 2010-07-30 2012-02-02 Memc Electronic Materials, Inc. Semiconductor And Solar Wafers And Method For Processing Same
JP2013115307A (ja) * 2011-11-30 2013-06-10 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物複合基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345435A (ja) * 2000-03-29 2001-12-14 Shin Etsu Handotai Co Ltd シリコンウェーハ及び貼り合わせウェーハの製造方法、並びにその貼り合わせウェーハ

Also Published As

Publication number Publication date
JPS61256621A (ja) 1986-11-14

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