JPH0445988B2 - - Google Patents
Info
- Publication number
- JPH0445988B2 JPH0445988B2 JP60093361A JP9336185A JPH0445988B2 JP H0445988 B2 JPH0445988 B2 JP H0445988B2 JP 60093361 A JP60093361 A JP 60093361A JP 9336185 A JP9336185 A JP 9336185A JP H0445988 B2 JPH0445988 B2 JP H0445988B2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric constant
- multilayer
- flexible printed
- lsi
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 10
- 239000004642 Polyimide Substances 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60093361A JPS61251142A (ja) | 1985-04-30 | 1985-04-30 | Ｌｓｉ実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60093361A JPS61251142A (ja) | 1985-04-30 | 1985-04-30 | Ｌｓｉ実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61251142A JPS61251142A (ja) | 1986-11-08 |
| JPH0445988B2 true JPH0445988B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-07-28 |
Family
ID=14080145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60093361A Granted JPS61251142A (ja) | 1985-04-30 | 1985-04-30 | Ｌｓｉ実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61251142A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2638089B2 (ja) * | 1988-06-20 | 1997-08-06 | 日本電気株式会社 | 半導体装置 |
-
1985
- 1985-04-30 JP JP60093361A patent/JPS61251142A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61251142A (ja) | 1986-11-08 |