JPS61251142A - Ｌｓｉ実装構造 - Google Patents

Ｌｓｉ実装構造

Info

Publication number
JPS61251142A
JPS61251142A JP60093361A JP9336185A JPS61251142A JP S61251142 A JPS61251142 A JP S61251142A JP 60093361 A JP60093361 A JP 60093361A JP 9336185 A JP9336185 A JP 9336185A JP S61251142 A JPS61251142 A JP S61251142A
Authority
JP
Japan
Prior art keywords
dielectric constant
lsi
multilayer
flexible printed
connection parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60093361A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445988B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Katsumi Harada
原田　勝美
Yoshie Kaido
海藤　義衛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60093361A priority Critical patent/JPS61251142A/ja
Publication of JPS61251142A publication Critical patent/JPS61251142A/ja
Publication of JPH0445988B2 publication Critical patent/JPH0445988B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60093361A 1985-04-30 1985-04-30 Ｌｓｉ実装構造 Granted JPS61251142A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60093361A JPS61251142A (ja) 1985-04-30 1985-04-30 Ｌｓｉ実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60093361A JPS61251142A (ja) 1985-04-30 1985-04-30 Ｌｓｉ実装構造

Publications (2)

Publication Number Publication Date
JPS61251142A true JPS61251142A (ja) 1986-11-08
JPH0445988B2 JPH0445988B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-07-28

Family

ID=14080145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60093361A Granted JPS61251142A (ja) 1985-04-30 1985-04-30 Ｌｓｉ実装構造

Country Status (1)

Country Link
JP (1) JPS61251142A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH023263A (ja) * 1988-06-20 1990-01-08 Nec Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH023263A (ja) * 1988-06-20 1990-01-08 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPH0445988B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-07-28

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