JPH0445983B2 - - Google Patents
Info
- Publication number
- JPH0445983B2 JPH0445983B2 JP13009383A JP13009383A JPH0445983B2 JP H0445983 B2 JPH0445983 B2 JP H0445983B2 JP 13009383 A JP13009383 A JP 13009383A JP 13009383 A JP13009383 A JP 13009383A JP H0445983 B2 JPH0445983 B2 JP H0445983B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- frame
- leads
- lead frame
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 description 14
- 238000009713 electroplating Methods 0.000 description 8
- 238000005219 brazing Methods 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13009383A JPS6021551A (ja) | 1983-07-15 | 1983-07-15 | 半導体パッケ−ジのリ−ド付方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13009383A JPS6021551A (ja) | 1983-07-15 | 1983-07-15 | 半導体パッケ−ジのリ−ド付方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6021551A JPS6021551A (ja) | 1985-02-02 |
| JPH0445983B2 true JPH0445983B2 (enrdf_load_stackoverflow) | 1992-07-28 |
Family
ID=15025795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13009383A Granted JPS6021551A (ja) | 1983-07-15 | 1983-07-15 | 半導体パッケ−ジのリ−ド付方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021551A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013200240A (ja) * | 2012-03-26 | 2013-10-03 | Panasonic Corp | 角速度センサおよびその製造方法 |
-
1983
- 1983-07-15 JP JP13009383A patent/JPS6021551A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6021551A (ja) | 1985-02-02 |