JPS6021551A - 半導体パッケ−ジのリ−ド付方法 - Google Patents

半導体パッケ−ジのリ−ド付方法

Info

Publication number
JPS6021551A
JPS6021551A JP13009383A JP13009383A JPS6021551A JP S6021551 A JPS6021551 A JP S6021551A JP 13009383 A JP13009383 A JP 13009383A JP 13009383 A JP13009383 A JP 13009383A JP S6021551 A JPS6021551 A JP S6021551A
Authority
JP
Japan
Prior art keywords
lead
frame
substrate
leads
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13009383A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445983B2 (enrdf_load_stackoverflow
Inventor
Masao Sekihashi
関端　正雄
Masakatsu Ishida
石田　正勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13009383A priority Critical patent/JPS6021551A/ja
Publication of JPS6021551A publication Critical patent/JPS6021551A/ja
Publication of JPH0445983B2 publication Critical patent/JPH0445983B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP13009383A 1983-07-15 1983-07-15 半導体パッケ−ジのリ−ド付方法 Granted JPS6021551A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13009383A JPS6021551A (ja) 1983-07-15 1983-07-15 半導体パッケ−ジのリ−ド付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13009383A JPS6021551A (ja) 1983-07-15 1983-07-15 半導体パッケ−ジのリ−ド付方法

Publications (2)

Publication Number Publication Date
JPS6021551A true JPS6021551A (ja) 1985-02-02
JPH0445983B2 JPH0445983B2 (enrdf_load_stackoverflow) 1992-07-28

Family

ID=15025795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13009383A Granted JPS6021551A (ja) 1983-07-15 1983-07-15 半導体パッケ−ジのリ−ド付方法

Country Status (1)

Country Link
JP (1) JPS6021551A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013200240A (ja) * 2012-03-26 2013-10-03 Panasonic Corp 角速度センサおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013200240A (ja) * 2012-03-26 2013-10-03 Panasonic Corp 角速度センサおよびその製造方法

Also Published As

Publication number Publication date
JPH0445983B2 (enrdf_load_stackoverflow) 1992-07-28

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