JPH0445273Y2 - - Google Patents

Info

Publication number
JPH0445273Y2
JPH0445273Y2 JP1987155923U JP15592387U JPH0445273Y2 JP H0445273 Y2 JPH0445273 Y2 JP H0445273Y2 JP 1987155923 U JP1987155923 U JP 1987155923U JP 15592387 U JP15592387 U JP 15592387U JP H0445273 Y2 JPH0445273 Y2 JP H0445273Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
powder coating
coating film
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987155923U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160576U (enEXAMPLES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987155923U priority Critical patent/JPH0445273Y2/ja
Publication of JPH0160576U publication Critical patent/JPH0160576U/ja
Application granted granted Critical
Publication of JPH0445273Y2 publication Critical patent/JPH0445273Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP1987155923U 1987-10-12 1987-10-12 Expired JPH0445273Y2 (enEXAMPLES)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987155923U JPH0445273Y2 (enEXAMPLES) 1987-10-12 1987-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987155923U JPH0445273Y2 (enEXAMPLES) 1987-10-12 1987-10-12

Publications (2)

Publication Number Publication Date
JPH0160576U JPH0160576U (enEXAMPLES) 1989-04-17
JPH0445273Y2 true JPH0445273Y2 (enEXAMPLES) 1992-10-23

Family

ID=31433988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987155923U Expired JPH0445273Y2 (enEXAMPLES) 1987-10-12 1987-10-12

Country Status (1)

Country Link
JP (1) JPH0445273Y2 (enEXAMPLES)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6360597A (ja) * 1986-09-01 1988-03-16 富士通株式会社 電気部品の樹脂封止方法

Also Published As

Publication number Publication date
JPH0160576U (enEXAMPLES) 1989-04-17

Similar Documents

Publication Publication Date Title
CN101378630B (zh) 印刷电路板和电子设备的生产方法
JPS5921047A (ja) リ−ドレスチツプキヤリア
US6673690B2 (en) Method of mounting a passive component over an integrated circuit package substrate
JPS5835367B2 (ja) 回路素子基板及びその製造方法
JP2829567B2 (ja) チップマウント型ｌｅｄ
JPH0445273Y2 (enEXAMPLES)
JP4018936B2 (ja) 回路モジュールの製造方法
WO1987004008A1 (en) Lead finishing for a surface mount package
JPH0631137U (ja) 多連電子部品
JP7656826B2 (ja) 実装基板および実装基板の製造方法
JP2501668Y2 (ja) 表面実装用電気部品
JP3104527B2 (ja) 電子部品および電子部品の製造方法
JP3428075B2 (ja) ハイブリッド集積回路装置の構造
JPH03241813A (ja) チップ型電子部品の外装方法
JPS6020596A (ja) 混成集積回路の製造方法
JP3587329B2 (ja) プリント配線板、回路基板及び実装方法
JPS59182545A (ja) 混成集積回路
JPH0458189B2 (enEXAMPLES)
JP3086340B2 (ja) ヒートシンク付き電子部品のプリント基板への半田実装方法
JP2020205313A (ja) 電子部品および電子回路モジュールの製造方法
JP2000332396A (ja) 電子部品の取付構造
JPH01100993A (ja) 混成集積回路の製造方法
JPH0918123A (ja) プリント基板と電子部品の実装方法及び実装構造
JPS60115293A (ja) ハイブリッド集積回路装置の製造方法
JPH02181959A (ja) 混成集積回路