JPH0443437B2 - - Google Patents
Info
- Publication number
- JPH0443437B2 JPH0443437B2 JP25158483A JP25158483A JPH0443437B2 JP H0443437 B2 JPH0443437 B2 JP H0443437B2 JP 25158483 A JP25158483 A JP 25158483A JP 25158483 A JP25158483 A JP 25158483A JP H0443437 B2 JPH0443437 B2 JP H0443437B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- type electronic
- electronic component
- lead pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000006071 cream Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- -1 coils Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25158483A JPS60140786A (ja) | 1983-12-27 | 1983-12-27 | チツプ型電子部品の実装構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25158483A JPS60140786A (ja) | 1983-12-27 | 1983-12-27 | チツプ型電子部品の実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60140786A JPS60140786A (ja) | 1985-07-25 |
JPH0443437B2 true JPH0443437B2 (zh) | 1992-07-16 |
Family
ID=17224984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25158483A Granted JPS60140786A (ja) | 1983-12-27 | 1983-12-27 | チツプ型電子部品の実装構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60140786A (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6232682A (ja) * | 1985-08-03 | 1987-02-12 | 株式会社 ニフコ | 三次元回路構造体における集積密度向上方法 |
JP2006210779A (ja) * | 2005-01-31 | 2006-08-10 | Victor Co Of Japan Ltd | 基板組立体 |
JP2020155512A (ja) * | 2019-03-19 | 2020-09-24 | 日本電気株式会社 | インターポーザ、接合構造体、および実装方法 |
-
1983
- 1983-12-27 JP JP25158483A patent/JPS60140786A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60140786A (ja) | 1985-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |