JPH0439227B2 - - Google Patents

Info

Publication number
JPH0439227B2
JPH0439227B2 JP58047692A JP4769283A JPH0439227B2 JP H0439227 B2 JPH0439227 B2 JP H0439227B2 JP 58047692 A JP58047692 A JP 58047692A JP 4769283 A JP4769283 A JP 4769283A JP H0439227 B2 JPH0439227 B2 JP H0439227B2
Authority
JP
Japan
Prior art keywords
lead frame
guide rail
width
lead
guide rails
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58047692A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59172731A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4769283A priority Critical patent/JPS59172731A/ja
Publication of JPS59172731A publication Critical patent/JPS59172731A/ja
Publication of JPH0439227B2 publication Critical patent/JPH0439227B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Framework For Endless Conveyors (AREA)
  • Reciprocating Conveyors (AREA)
JP4769283A 1983-03-22 1983-03-22 リ−ドフレ−ム搬送装置 Granted JPS59172731A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4769283A JPS59172731A (ja) 1983-03-22 1983-03-22 リ−ドフレ−ム搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4769283A JPS59172731A (ja) 1983-03-22 1983-03-22 リ−ドフレ−ム搬送装置

Publications (2)

Publication Number Publication Date
JPS59172731A JPS59172731A (ja) 1984-09-29
JPH0439227B2 true JPH0439227B2 (enrdf_load_stackoverflow) 1992-06-26

Family

ID=12782336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4769283A Granted JPS59172731A (ja) 1983-03-22 1983-03-22 リ−ドフレ−ム搬送装置

Country Status (1)

Country Link
JP (1) JPS59172731A (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6197835U (enrdf_load_stackoverflow) * 1984-11-30 1986-06-23
JPH06105720B2 (ja) * 1985-06-14 1994-12-21 松下電器産業株式会社 リードフレーム用搬送装置
JPH0646645B2 (ja) * 1988-08-25 1994-06-15 株式会社東芝 リードフレーム搬送装置
JP2622213B2 (ja) * 1991-09-10 1997-06-18 三菱電機株式会社 リードフレーム搬送装置
JP2837782B2 (ja) * 1992-09-25 1998-12-16 株式会社カイジョー 基板搬送路調整方法
JP2798237B2 (ja) * 1994-06-15 1998-09-17 株式会社石井工作研究所 Ｉｃリードフレーム幅寄せ装置
DE10310262A1 (de) 2002-03-28 2003-10-23 Esec Trading Sa Einrichtung für die Montage von Halbleiterchips
EP1349199A1 (de) * 2002-03-28 2003-10-01 Esec Trading S.A. Einrichtung für die Montage von Halbleiterchips
KR100996264B1 (ko) * 2008-04-25 2010-11-23 에스티에스반도체통신 주식회사 광폭 리드 프레임을 위한 반도체 패키지 제조 장치 및 이를이용한 반도체 패키지 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49103366A (enrdf_load_stackoverflow) * 1973-02-08 1974-09-30
JPS52116168A (en) * 1976-03-26 1977-09-29 Shinkawa Seisakusho Kk Apparatus for wireebonding
JPS5472845A (en) * 1977-11-18 1979-06-11 Seikosha Kk Supply*guide apparatus for sheet material
JPS55159206A (en) * 1979-05-29 1980-12-11 Mitsubishi Electric Corp Position control unit
JPS572327U (enrdf_load_stackoverflow) * 1980-06-06 1982-01-07
JPS57206095A (en) * 1981-06-12 1982-12-17 Hitachi Ltd Automatic size control type board conveying device
JPS58157620A (ja) * 1982-03-11 1983-09-19 Mitsubishi Electric Corp フレ−ム送り機構用レ−ル間隔変更装置
JPS59172299A (ja) * 1983-03-18 1984-09-28 松下電器産業株式会社 電子部品自動挿入機の基板幅寄せ装置

Also Published As

Publication number Publication date
JPS59172731A (ja) 1984-09-29

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