JPS59172731A - リ−ドフレ−ム搬送装置 - Google Patents

リ−ドフレ−ム搬送装置

Info

Publication number
JPS59172731A
JPS59172731A JP4769283A JP4769283A JPS59172731A JP S59172731 A JPS59172731 A JP S59172731A JP 4769283 A JP4769283 A JP 4769283A JP 4769283 A JP4769283 A JP 4769283A JP S59172731 A JPS59172731 A JP S59172731A
Authority
JP
Japan
Prior art keywords
lead frame
guide rail
width
control device
drive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4769283A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439227B2 (enrdf_load_stackoverflow
Inventor
Hiroaki Kobayashi
弘明 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP4769283A priority Critical patent/JPS59172731A/ja
Publication of JPS59172731A publication Critical patent/JPS59172731A/ja
Publication of JPH0439227B2 publication Critical patent/JPH0439227B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Framework For Endless Conveyors (AREA)
  • Reciprocating Conveyors (AREA)
JP4769283A 1983-03-22 1983-03-22 リ−ドフレ−ム搬送装置 Granted JPS59172731A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4769283A JPS59172731A (ja) 1983-03-22 1983-03-22 リ−ドフレ−ム搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4769283A JPS59172731A (ja) 1983-03-22 1983-03-22 リ−ドフレ−ム搬送装置

Publications (2)

Publication Number Publication Date
JPS59172731A true JPS59172731A (ja) 1984-09-29
JPH0439227B2 JPH0439227B2 (enrdf_load_stackoverflow) 1992-06-26

Family

ID=12782336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4769283A Granted JPS59172731A (ja) 1983-03-22 1983-03-22 リ−ドフレ−ム搬送装置

Country Status (1)

Country Link
JP (1) JPS59172731A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6197835U (enrdf_load_stackoverflow) * 1984-11-30 1986-06-23
JPS61287236A (ja) * 1985-06-14 1986-12-17 Matsushita Electric Ind Co Ltd リ−ドフレ−ム用搬送装置
US4958722A (en) * 1988-08-25 1990-09-25 Kabushiki Kaisha Toshiba Transfer apparatus for lead frame
JPH0574821A (ja) * 1991-09-10 1993-03-26 Mitsubishi Electric Corp リードフレーム搬送装置
JPH06112234A (ja) * 1992-09-25 1994-04-22 Kaijo Corp 基板搬送路調整方法
JPH0823001A (ja) * 1994-06-15 1996-01-23 Ishii Kosaku Kenkyusho:Kk Ｉｃリードフレーム幅寄せ方法とその装置
EP1349199A1 (de) * 2002-03-28 2003-10-01 Esec Trading S.A. Einrichtung für die Montage von Halbleiterchips
US6898481B2 (en) 2002-03-28 2005-05-24 Esec Trading Sa Apparatus for mounting semiconductor chips
JP2009267414A (ja) * 2008-04-25 2009-11-12 Sts Semiconductor & Telecommunications Co Ltd 幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージ製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49103366A (enrdf_load_stackoverflow) * 1973-02-08 1974-09-30
JPS52116168A (en) * 1976-03-26 1977-09-29 Shinkawa Seisakusho Kk Apparatus for wireebonding
JPS5472845A (en) * 1977-11-18 1979-06-11 Seikosha Kk Supply*guide apparatus for sheet material
JPS55159206A (en) * 1979-05-29 1980-12-11 Mitsubishi Electric Corp Position control unit
JPS572327U (enrdf_load_stackoverflow) * 1980-06-06 1982-01-07
JPS57206095A (en) * 1981-06-12 1982-12-17 Hitachi Ltd Automatic size control type board conveying device
JPS58157620A (ja) * 1982-03-11 1983-09-19 Mitsubishi Electric Corp フレ−ム送り機構用レ−ル間隔変更装置
JPS59172299A (ja) * 1983-03-18 1984-09-28 松下電器産業株式会社 電子部品自動挿入機の基板幅寄せ装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49103366A (enrdf_load_stackoverflow) * 1973-02-08 1974-09-30
JPS52116168A (en) * 1976-03-26 1977-09-29 Shinkawa Seisakusho Kk Apparatus for wireebonding
JPS5472845A (en) * 1977-11-18 1979-06-11 Seikosha Kk Supply*guide apparatus for sheet material
JPS55159206A (en) * 1979-05-29 1980-12-11 Mitsubishi Electric Corp Position control unit
JPS572327U (enrdf_load_stackoverflow) * 1980-06-06 1982-01-07
JPS57206095A (en) * 1981-06-12 1982-12-17 Hitachi Ltd Automatic size control type board conveying device
JPS58157620A (ja) * 1982-03-11 1983-09-19 Mitsubishi Electric Corp フレ−ム送り機構用レ−ル間隔変更装置
JPS59172299A (ja) * 1983-03-18 1984-09-28 松下電器産業株式会社 電子部品自動挿入機の基板幅寄せ装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6197835U (enrdf_load_stackoverflow) * 1984-11-30 1986-06-23
JPS61287236A (ja) * 1985-06-14 1986-12-17 Matsushita Electric Ind Co Ltd リ−ドフレ−ム用搬送装置
US4958722A (en) * 1988-08-25 1990-09-25 Kabushiki Kaisha Toshiba Transfer apparatus for lead frame
JPH0574821A (ja) * 1991-09-10 1993-03-26 Mitsubishi Electric Corp リードフレーム搬送装置
JPH06112234A (ja) * 1992-09-25 1994-04-22 Kaijo Corp 基板搬送路調整方法
JPH0823001A (ja) * 1994-06-15 1996-01-23 Ishii Kosaku Kenkyusho:Kk Ｉｃリードフレーム幅寄せ方法とその装置
EP1349199A1 (de) * 2002-03-28 2003-10-01 Esec Trading S.A. Einrichtung für die Montage von Halbleiterchips
US6898481B2 (en) 2002-03-28 2005-05-24 Esec Trading Sa Apparatus for mounting semiconductor chips
JP2009267414A (ja) * 2008-04-25 2009-11-12 Sts Semiconductor & Telecommunications Co Ltd 幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージ製造方法

Also Published As

Publication number Publication date
JPH0439227B2 (enrdf_load_stackoverflow) 1992-06-26

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