JPH04313215A - ベーク処理方法 - Google Patents

ベーク処理方法

Info

Publication number
JPH04313215A
JPH04313215A JP7876791A JP7876791A JPH04313215A JP H04313215 A JPH04313215 A JP H04313215A JP 7876791 A JP7876791 A JP 7876791A JP 7876791 A JP7876791 A JP 7876791A JP H04313215 A JPH04313215 A JP H04313215A
Authority
JP
Japan
Prior art keywords
baking
pressure
resist film
semiconductor wafer
hot plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7876791A
Other languages
English (en)
Japanese (ja)
Inventor
Shigeo Uotani
魚谷　重雄
Hidekazu Ishikawa
英一 石川
Toshifumi Suganaga
利文 菅長
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7876791A priority Critical patent/JPH04313215A/ja
Priority to DE19924200038 priority patent/DE4200038C2/de
Publication of JPH04313215A publication Critical patent/JPH04313215A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP7876791A 1991-04-11 1991-04-11 ベーク処理方法 Pending JPH04313215A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP7876791A JPH04313215A (ja) 1991-04-11 1991-04-11 ベーク処理方法
DE19924200038 DE4200038C2 (de) 1991-04-11 1992-01-02 Verfahren zum Aushärten einer entwickelten Photolackschicht

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7876791A JPH04313215A (ja) 1991-04-11 1991-04-11 ベーク処理方法

Publications (1)

Publication Number Publication Date
JPH04313215A true JPH04313215A (ja) 1992-11-05

Family

ID=13671056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7876791A Pending JPH04313215A (ja) 1991-04-11 1991-04-11 ベーク処理方法

Country Status (2)

Country Link
JP (1) JPH04313215A (de)
DE (1) DE4200038C2 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200423A (ja) * 2008-02-25 2009-09-03 Asahi Glass Co Ltd Ｅｕｖリソグラフィ用反射型マスクの製造方法
JP2010103480A (ja) * 2008-09-25 2010-05-06 Tokyo Electron Ltd 減圧乾燥装置及び減圧乾燥方法
CN106353975A (zh) * 2016-11-25 2017-01-25 天津津芯微电子科技有限公司 Ldi曝光设备以及系统
CN106773535A (zh) * 2016-12-12 2017-05-31 中国科学院光电技术研究所 一种高精度光刻胶面形控制方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427113A (ja) * 1990-04-23 1992-01-30 Tadahiro Omi レジスト処理装置、レジスト処理方法及びレジストパターン
SG105487A1 (en) 2000-03-30 2004-08-27 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202912A (ja) * 1987-02-18 1988-08-22 Nec Kyushu Ltd 半導体基板焼しめ装置
JPS63260028A (ja) * 1986-11-19 1988-10-27 Tokyo Ohka Kogyo Co Ltd ホトレジストの熱安定化装置
JPH0382112A (ja) * 1989-08-25 1991-04-08 Hitachi Ltd 荷電粒子線描画方法および装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740547B2 (ja) * 1987-03-24 1995-05-01 ウシオ電機株式会社 レジスト処理方法
DE3837648A1 (de) * 1988-11-05 1990-05-10 Basf Ag Vorrichtung zur auswaschung von photopolymeren druckplatten mittels loesungsmitteln, trocknung der druckplatten und rueckgewinnung der loesungsmittel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63260028A (ja) * 1986-11-19 1988-10-27 Tokyo Ohka Kogyo Co Ltd ホトレジストの熱安定化装置
JPS63202912A (ja) * 1987-02-18 1988-08-22 Nec Kyushu Ltd 半導体基板焼しめ装置
JPH0382112A (ja) * 1989-08-25 1991-04-08 Hitachi Ltd 荷電粒子線描画方法および装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200423A (ja) * 2008-02-25 2009-09-03 Asahi Glass Co Ltd Ｅｕｖリソグラフィ用反射型マスクの製造方法
JP2010103480A (ja) * 2008-09-25 2010-05-06 Tokyo Electron Ltd 減圧乾燥装置及び減圧乾燥方法
CN106353975A (zh) * 2016-11-25 2017-01-25 天津津芯微电子科技有限公司 Ldi曝光设备以及系统
CN106773535A (zh) * 2016-12-12 2017-05-31 中国科学院光电技术研究所 一种高精度光刻胶面形控制方法

Also Published As

Publication number Publication date
DE4200038A1 (de) 1992-10-22
DE4200038C2 (de) 1998-07-09

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