JPH04280654A - 集積回路を有する基板上への金属容器の組立て法 - Google Patents

集積回路を有する基板上への金属容器の組立て法

Info

Publication number
JPH04280654A
JPH04280654A JP3290921A JP29092191A JPH04280654A JP H04280654 A JPH04280654 A JP H04280654A JP 3290921 A JP3290921 A JP 3290921A JP 29092191 A JP29092191 A JP 29092191A JP H04280654 A JPH04280654 A JP H04280654A
Authority
JP
Japan
Prior art keywords
layer
dielectric paste
metal
mixture
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3290921A
Other languages
English (en)
Japanese (ja)
Inventor
Reynal Florence De
フローランス　　ド　　ルイナル
Dominique Coujard
ドミニク　　ゴジャール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of JPH04280654A publication Critical patent/JPH04280654A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Products (AREA)
JP3290921A 1990-10-12 1991-10-09 集積回路を有する基板上への金属容器の組立て法 Withdrawn JPH04280654A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9012607A FR2667981A1 (fr) 1990-10-12 1990-10-12 Procede d'assemblage de deux couches constituees de materiaux differents et son application a l'encapsulation hermetique de circuits hybrides.
FR9012607 1990-10-12

Publications (1)

Publication Number Publication Date
JPH04280654A true JPH04280654A (ja) 1992-10-06

Family

ID=9401166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3290921A Withdrawn JPH04280654A (ja) 1990-10-12 1991-10-09 集積回路を有する基板上への金属容器の組立て法

Country Status (4)

Country Link
US (1) US5201456A (enExample)
EP (1) EP0481846A1 (enExample)
JP (1) JPH04280654A (enExample)
FR (1) FR2667981A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2758630B1 (fr) 1997-01-21 1999-04-09 Thomson Tubes Electroniques Procede de scellement etanche d'un detecteur de rayonnement a l'etat solide et detecteur obtenu par ce procede
US6136128A (en) * 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6342407B1 (en) 2000-12-07 2002-01-29 International Business Machines Corporation Low stress hermetic seal
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
BR112019021056B1 (pt) 2017-04-06 2022-11-22 Sustain Holdings, Llc Usos de uma composição que compreende um peptídeo mimético de colágeno para o tratamento ou a prevenção de uma doença, distúrbio ou ferida ocular
EP3958889B1 (en) 2019-04-22 2025-01-08 Sustain Holdings, LLC Collagen mimetic peptide compositions for treating a posterior segment ocular disease or disorder involving the retina, retinal blood vessels, retinal nerves or optic nerve

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3020182A (en) * 1958-09-26 1962-02-06 Gen Electric Ceramic-to-metal seal and method of making the same
GB1431919A (en) * 1973-08-15 1976-04-14 Atomic Energy Authority Uk Microcircuit packages
GB1468973A (en) * 1975-07-18 1977-03-30 Atomic Energy Authority Uk Microcircuit packages
US4338380A (en) * 1976-04-05 1982-07-06 Brunswick Corporation Method of attaching ceramics to metals for high temperature operation and laminated composite
JPS60110156A (ja) * 1983-11-21 1985-06-15 Hitachi Ltd 固体撮像素子の製造方法
DE3587085T2 (de) * 1984-09-19 1993-09-16 Olin Corp Hermetisch verschlossenes halbleitergehaeuse.
JPS61193473A (ja) * 1985-02-21 1986-08-27 Fujitsu Ltd 積層回路基板のピンリ−ド
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
JPS62241356A (ja) * 1986-04-14 1987-10-22 Hitachi Ltd 半導体パツケ−ジ

Also Published As

Publication number Publication date
FR2667981A1 (fr) 1992-04-17
US5201456A (en) 1993-04-13
EP0481846A1 (fr) 1992-04-22
FR2667981B1 (enExample) 1997-02-28

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990107