CA2211542C - Electrical feedthroughs for ceramic circuit board support substrates - Google Patents
Electrical feedthroughs for ceramic circuit board support substrates Download PDFInfo
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- CA2211542C CA2211542C CA002211542A CA2211542A CA2211542C CA 2211542 C CA2211542 C CA 2211542C CA 002211542 A CA002211542 A CA 002211542A CA 2211542 A CA2211542 A CA 2211542A CA 2211542 C CA2211542 C CA 2211542C
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Abstract
Electrical feedthroughs in printed circuit board support substrates (24) for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide (22) and one or more layers of glass (26, 28), and then filling the remainder of the feedthroughs with a conductive metal via fill ink (30). After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate (24).</SDOAB >
Description
ELECTRICAL FEEDTHROUGHS FOR CERAMIC CIRCUIT BOARD
SUPPORT SUBSTRATES
This invention relates to a method of making electrical feedthroughs in thermally conductive support substrates used to impart mechanical strength to ceramic multilayer printed circuit boards. More particularly, 1 0 this invention relates to a method of making electrical feedthroughs in ceramic multilayer printed circuit board support substrates that is compatible with mass production techniques.
Ceramic multilayer printed circuit boards have been used for many years for circuits for electrical apparatus, such as mainframe computers.
1 5 Such printed circuit boards are made by casting glass and/or ceramic powders together with an organic binder into tapes, called green tapes. A
metal circuit can be patterned onto the green tape by screen printing for example. Vias are formed in each green tape layer that are filled with a conductive material to connect the circuits of the various layers 2 0 electrically. The green tape layers are then aligned and stacked, pressed together, and fired to burn off organic residues and sinter the glass, thereby forming a fired ceramic multilayer circuit board.
Originally ceramics such as alumina were used to form the green tape layers, but these ceramics require high firing temperatures, up to 2 5 1500oC. This necessitated the use of refractory conductive metals, such as tungsten or molybdenum, to form the conductive circuit patterns because such metals could withstand high firing temperatures without melting.
More recently, lower temperature materials have been used, such as devitrifying glasses that can be fired at lower temperatures of 1000oC or 3 0 less. Multilayer circuit boards made of these glass or glass-ceramic materials can be used with lower melting point and higher conductivity metals, such as silver, gold or copper. However, these printed circuit boards have the disadvantage that they are not as strong as alumina circuit boards.
3 5 Thus still more recently, low firing temperature glasses have been deposited on support substrates made of metal or ceramic to which the glasses will adhere. The support substrate can be of a thermally conductive material such as nickel, kovar, a ferrous nickel/
w0 96/22881 PCT/US96/00316 cobalt/manganese alloy, Invar~, a ferronickel alloy, low carbon steel, or Cu/kovar/Cu, Cu/Mo/Cu or Cu/Invar~/Cu composites and the like, as well as thermally conductive ceramics such as aluminum nitride, silicon carbide, diamond and the like. These substrates impart added strength to the composite. A bonding glass, such as described in US Patent 5,277,724 to Prabhu, adheres the ceramic substrate formed from the green tape layers to the substrate. In addition, if chosen correctly, the bonding glass can reduce shrinkage of the green tape with respect to the metal substrate in at least the two lateral dimensions. Thus all of the shrinkage occurs in the 1 0 thickness dimension only. This in turn reduces problems of alignment of the circuit patterns in the ceramic layers and the via holes in the metal substrate after firing.
However, when it is desired to produce glass/ceramic multilayer ceramic circuit boards on both sides of the support substrate, the presence 1 5 of the thermally and electrically conductive metal or ceramic core material between two circuit boards can cause short circuits. Thus the multilayer circuits on one side of the support substrate have been connected to the multilayer circuits on the other side of the support substrate by means of circuit traces or lines that extend around the periphery of the circuit board 2 0 rather than through the support substrate. However, such peripheral traces are subject to damage or breakage during handling and assembly of the circuit boards into a module, for example, and in some cases the traces would have to be too long for an acceptable design. Such designs also increase wiring lengths and decrease interconnection density. Thus an 2 5 improved method of permitting electrical connection between two ceramic multilayer circuit boards on both sides of a support substrate would be highly desirable.
The present process for forming electrical feedthroughs in support substrates for double sided printed circuit board substrates comprises 3 0 providing dielectric insulation in the feedthroughs. Typically a via hole is opened in the support substrate core material, as by drilling, the substrate via hole is plated with nickel, one or more dielectric materials such as glass is deposited in the via hole. Lastly a conductive metal is deposited to fill the via hole inside the dielectric ring. The dielectric material and the center , 3 5 conductive metal must be able to withstand several firings at temperatures up to at least 900oC without melting or flowing.
The teachings of the invention can be readily understood by considering the following detailed description in conjunction with the accompanying drawing, in which:
Fig. 1 is a flow chart of the preferred process for filling via holes in a printed circuit board support substrate in accordance with the process of the invention.
Fig. 2 is a thermal coefficient of expansion plot of a glass suitable for use as a dielectric in the present process.
Fig. 3 is a differential thermal analysis (DTA) plot of a glass suitable for use as a dielectric in the present process.
Figs. 4A and 4B illustrate the steps of forming a glass dielectric layer 1 0 in a via hole.
Fig. 5 is a cross sectional partial view of a printed circuit board support substrate having a filled via hole filled in accordance with the method of the invention.
The preferred support substrate for use herein is a Cu/Mo/Cu metal 1 5 composite substrate commercially available from the Climax Metals Company, although other materials can be substituted, as described hereinabove.
Referring to Fig. 1, which is a flow chart of a suitable process for making the electrical feedthroughs in a printed circuit board support 2 0 substrate in accordance with the invention, in a first step of the present process, via openings can be formed in the support substrate using a laser or mechanical drilling equipment that can drill small diameter holes, e.g., about 13-40 mils in diameter or less. The mechanically drilled openings are then debarred, as by rubbing the edges with a soft stone, whereby via 2 5 openings having sharp corners are eliminated. The thicker the substrate material, the more difficulty may be encountered in drilling the openings.
Thirteen mil diameter holes can also be readily drilled using a Nd:YAG laser at 15-30 watts with 0.6 msec pulse lengths. A minimum hole diameter of 7 mils for a 20 mil thick support substrate can be made readily. If the 3 0 thickness of the support substrate is higher, the minimum hole diameter that can be made may be larger; for example, for a 40 mil thick support substrate, the minimum hole diameter that can be readily made is 8 mils.
The drilled holes are next debarred and nickel plated. This step seals the core material of the support substrate and can be accomplished by 3 S conventional nickel electroplating methods. The nickel is then oxidized, as by heating in air at temperatures about 820oC. The nickel oxide layer, which exhibits a resistance of 108 - 109 ohms, constitutes the first ring of dielectric material in the via hole.
WO 96!22881 PCT/US96/00316 An insulating dielectric layer, as of a glass, is then deposited in the via hole to form an annular ring. Since glass is a fragile material that can crack during multiple firings, it is preferred that two or more layers of glass be sequentially deposited in the openings so that if a defect, such as a pore, forms in one layer, it will not extend through the entire glass layer, to cause a shorted feedthrough.
The glasses suitable for use in the present invention, using Cu/Mo/Cu metal composite substrates, must have a thermal coefficient of expansion matched to the Cu/Mo/Cu substrate; must have good adhesion to nickel 1 0 oxide, must be able to wet nickel oxide; and must be able to be fired at temperatures required to form the desired ceramic multilayer circuit board.
One particular glass composition having the following composition in percent by weight is particularly useful with the above nickel plated Cu/Mo/Cu composite metal substrate;
1 5 Zn0 28.68 Mg0 5.92 Ba0 6.21 A1203 15.36 Si02 43.82 2 0 This glass has a thermal coefficient of expansion plot as shown in Fig. 2 and a DTA plot as shown in Fig. 3. This glass can be used as the dielectric insulator for the substrate via holes. The same glass can also be used later in the process as a constituent of the thick film conductor via fill ink required for filling the center of each via hole with conductive metal, as 2 5 further described below.
Another suitable glass composition for use with the preferred metal substrate has the following composition in percent by weight:
Mg0 29.0 A1203 22.0 3 0 . Si02 45.0 P205 1.5 B203 1.0 Zr02 1.5 A preferred method of applying the glass composition from a 3 5 standard glazing ink constituting the above glass is to apply vacuum after the screen printing to deposit one or more of the above glass layers. Such a glazing ink comprises the finely divided glass and an organic vehicle.
Suitable organic vehicles are solutions of resin binders, such as cellulose derivatives, synthetic resins such as polyacrylates, polymethacrylates, polyesters, polyolefins and the like, in a suitable solvent. The solvent can be pine oil, terpineol, butyl carbitol acetate, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate and the like. The vehicles generally contain from about 5 5 to 25 percent by weight of the resin binder.
Thus the glasses of the invention comprise those glasses having a thermal coefficient of expansion near that of the support substrate material, will wet nickel oxide and can be fired at a temperature up to about 1000oC. Suitable glasses of the invcention include a glass comprising zinc 1 0 oxide, about 28.68% by weight, magnesium oxide, about 5.92% by weight, barium oxide, about 6.21% by weight, aluminum oxide, about 15.36% by weight, and silicon oxide, about 43.82% by weight and a glass comprising magnesium oxide, about 29% by weight; aluminum oxide, about 22% by weight, silicon oxide, about 45% by weight and up to about 4% by weight of 1 5 phosphorus oxide, boron oxide and zirconium oxide.
Fig. 4A illustrates a printed glass layer 20 over a via hole 22 in a metal substrate 24.
A vacuum is applied after the printing, beneath the metal substrate 24 in the direction of the arrow 25, sufficient to bring the glass ink layer 2 0 into the via hole 22, thereby forming an annular ring of the glass ink inside the via hole 22. This glass layer is then dried. The deposition and vacuum pull can be repeated to form multiple glass dielectric layers in the via hole 22. If both sides of the metal substrate 24 are to be used, the above sequence of steps is repeated on the opposite side of the metal substrate 2 5 24.
The support substrate is then fired to sinter the glass powder and form a composite fired glass insulator layer in the opening.
A thick via fill ink containing a conductive metal powder is then applied to the metal substrate, also using conventional screen printing 3 0 techniques. For example, a suitable conductor thick film ink comprises a mixture of silver or other conductive metal powder, glass, and an organic vehicle as described above in proportions so as to form a print screenable thick film paste.
Thick film conductor via fill inks are made by mixing a finely divided 3 5 conductive metal powder, with a preselected glass powder and an organic vehicle. Suitable conductive powders include silver, gold, copper, their mixtures, and alloys thereof with palladium and platinum and the like, or nickel. The fired thick film conductive metal ink can comprise from about 50-90% by weight of metal and about 10-50% by weight of a glass.
The thick film conductor via fill ink composition is applied to the prepared printed circuit board support substrate so as to fill the glass insulated via holes and is then fired to remove organic materials and to S sinter the metal powder to obtain the conductive, insulated feedthroughs.
Fig. 5 is a cross sectional view of the metal substrate 24 having dielectric insulated electrical feedthroughs therein. The via hole 22 in the metal substrate 24 has a first layer 22 of nickel oxide dielectric, two dielectric glass layers 26, 28 and a conductive via fill layer 30 therein.
1 0 Sufficient conductive via fill ink is applied so that the remainder of the via hole 22 is completely filled at the end of the process.
The support substrate as prepared above, having conductive vias in via openings that are dielectrically insulated from the rest of the substrate, can then be used to prepare double sided multilayer printed circuit boards 1 5 from the substrates of the invention in conventional manner.
The above process can be used to make a reproducible support substrate having a plurality of electrical feedthroughs therein that will not form short circuits between circuitry on both sides of the substrate. The support substrate having electrical feedthroughs as prepared above can 2 0 withstand several firings at temperatures used in making ceramic multilayer printed circuit boards without undermining the structural and electrical integrity of the feedthroughs.
Although the present process and electrical feedthroughs have been described in terms of specific embodiments, one skilled in the art can readily 2 5 substitute other materials and reaction conditions for the glass layers and conductors described hereinabove. Thus the scope of the present invention is only meant to be limited by the appended claims.
SUPPORT SUBSTRATES
This invention relates to a method of making electrical feedthroughs in thermally conductive support substrates used to impart mechanical strength to ceramic multilayer printed circuit boards. More particularly, 1 0 this invention relates to a method of making electrical feedthroughs in ceramic multilayer printed circuit board support substrates that is compatible with mass production techniques.
Ceramic multilayer printed circuit boards have been used for many years for circuits for electrical apparatus, such as mainframe computers.
1 5 Such printed circuit boards are made by casting glass and/or ceramic powders together with an organic binder into tapes, called green tapes. A
metal circuit can be patterned onto the green tape by screen printing for example. Vias are formed in each green tape layer that are filled with a conductive material to connect the circuits of the various layers 2 0 electrically. The green tape layers are then aligned and stacked, pressed together, and fired to burn off organic residues and sinter the glass, thereby forming a fired ceramic multilayer circuit board.
Originally ceramics such as alumina were used to form the green tape layers, but these ceramics require high firing temperatures, up to 2 5 1500oC. This necessitated the use of refractory conductive metals, such as tungsten or molybdenum, to form the conductive circuit patterns because such metals could withstand high firing temperatures without melting.
More recently, lower temperature materials have been used, such as devitrifying glasses that can be fired at lower temperatures of 1000oC or 3 0 less. Multilayer circuit boards made of these glass or glass-ceramic materials can be used with lower melting point and higher conductivity metals, such as silver, gold or copper. However, these printed circuit boards have the disadvantage that they are not as strong as alumina circuit boards.
3 5 Thus still more recently, low firing temperature glasses have been deposited on support substrates made of metal or ceramic to which the glasses will adhere. The support substrate can be of a thermally conductive material such as nickel, kovar, a ferrous nickel/
w0 96/22881 PCT/US96/00316 cobalt/manganese alloy, Invar~, a ferronickel alloy, low carbon steel, or Cu/kovar/Cu, Cu/Mo/Cu or Cu/Invar~/Cu composites and the like, as well as thermally conductive ceramics such as aluminum nitride, silicon carbide, diamond and the like. These substrates impart added strength to the composite. A bonding glass, such as described in US Patent 5,277,724 to Prabhu, adheres the ceramic substrate formed from the green tape layers to the substrate. In addition, if chosen correctly, the bonding glass can reduce shrinkage of the green tape with respect to the metal substrate in at least the two lateral dimensions. Thus all of the shrinkage occurs in the 1 0 thickness dimension only. This in turn reduces problems of alignment of the circuit patterns in the ceramic layers and the via holes in the metal substrate after firing.
However, when it is desired to produce glass/ceramic multilayer ceramic circuit boards on both sides of the support substrate, the presence 1 5 of the thermally and electrically conductive metal or ceramic core material between two circuit boards can cause short circuits. Thus the multilayer circuits on one side of the support substrate have been connected to the multilayer circuits on the other side of the support substrate by means of circuit traces or lines that extend around the periphery of the circuit board 2 0 rather than through the support substrate. However, such peripheral traces are subject to damage or breakage during handling and assembly of the circuit boards into a module, for example, and in some cases the traces would have to be too long for an acceptable design. Such designs also increase wiring lengths and decrease interconnection density. Thus an 2 5 improved method of permitting electrical connection between two ceramic multilayer circuit boards on both sides of a support substrate would be highly desirable.
The present process for forming electrical feedthroughs in support substrates for double sided printed circuit board substrates comprises 3 0 providing dielectric insulation in the feedthroughs. Typically a via hole is opened in the support substrate core material, as by drilling, the substrate via hole is plated with nickel, one or more dielectric materials such as glass is deposited in the via hole. Lastly a conductive metal is deposited to fill the via hole inside the dielectric ring. The dielectric material and the center , 3 5 conductive metal must be able to withstand several firings at temperatures up to at least 900oC without melting or flowing.
The teachings of the invention can be readily understood by considering the following detailed description in conjunction with the accompanying drawing, in which:
Fig. 1 is a flow chart of the preferred process for filling via holes in a printed circuit board support substrate in accordance with the process of the invention.
Fig. 2 is a thermal coefficient of expansion plot of a glass suitable for use as a dielectric in the present process.
Fig. 3 is a differential thermal analysis (DTA) plot of a glass suitable for use as a dielectric in the present process.
Figs. 4A and 4B illustrate the steps of forming a glass dielectric layer 1 0 in a via hole.
Fig. 5 is a cross sectional partial view of a printed circuit board support substrate having a filled via hole filled in accordance with the method of the invention.
The preferred support substrate for use herein is a Cu/Mo/Cu metal 1 5 composite substrate commercially available from the Climax Metals Company, although other materials can be substituted, as described hereinabove.
Referring to Fig. 1, which is a flow chart of a suitable process for making the electrical feedthroughs in a printed circuit board support 2 0 substrate in accordance with the invention, in a first step of the present process, via openings can be formed in the support substrate using a laser or mechanical drilling equipment that can drill small diameter holes, e.g., about 13-40 mils in diameter or less. The mechanically drilled openings are then debarred, as by rubbing the edges with a soft stone, whereby via 2 5 openings having sharp corners are eliminated. The thicker the substrate material, the more difficulty may be encountered in drilling the openings.
Thirteen mil diameter holes can also be readily drilled using a Nd:YAG laser at 15-30 watts with 0.6 msec pulse lengths. A minimum hole diameter of 7 mils for a 20 mil thick support substrate can be made readily. If the 3 0 thickness of the support substrate is higher, the minimum hole diameter that can be made may be larger; for example, for a 40 mil thick support substrate, the minimum hole diameter that can be readily made is 8 mils.
The drilled holes are next debarred and nickel plated. This step seals the core material of the support substrate and can be accomplished by 3 S conventional nickel electroplating methods. The nickel is then oxidized, as by heating in air at temperatures about 820oC. The nickel oxide layer, which exhibits a resistance of 108 - 109 ohms, constitutes the first ring of dielectric material in the via hole.
WO 96!22881 PCT/US96/00316 An insulating dielectric layer, as of a glass, is then deposited in the via hole to form an annular ring. Since glass is a fragile material that can crack during multiple firings, it is preferred that two or more layers of glass be sequentially deposited in the openings so that if a defect, such as a pore, forms in one layer, it will not extend through the entire glass layer, to cause a shorted feedthrough.
The glasses suitable for use in the present invention, using Cu/Mo/Cu metal composite substrates, must have a thermal coefficient of expansion matched to the Cu/Mo/Cu substrate; must have good adhesion to nickel 1 0 oxide, must be able to wet nickel oxide; and must be able to be fired at temperatures required to form the desired ceramic multilayer circuit board.
One particular glass composition having the following composition in percent by weight is particularly useful with the above nickel plated Cu/Mo/Cu composite metal substrate;
1 5 Zn0 28.68 Mg0 5.92 Ba0 6.21 A1203 15.36 Si02 43.82 2 0 This glass has a thermal coefficient of expansion plot as shown in Fig. 2 and a DTA plot as shown in Fig. 3. This glass can be used as the dielectric insulator for the substrate via holes. The same glass can also be used later in the process as a constituent of the thick film conductor via fill ink required for filling the center of each via hole with conductive metal, as 2 5 further described below.
Another suitable glass composition for use with the preferred metal substrate has the following composition in percent by weight:
Mg0 29.0 A1203 22.0 3 0 . Si02 45.0 P205 1.5 B203 1.0 Zr02 1.5 A preferred method of applying the glass composition from a 3 5 standard glazing ink constituting the above glass is to apply vacuum after the screen printing to deposit one or more of the above glass layers. Such a glazing ink comprises the finely divided glass and an organic vehicle.
Suitable organic vehicles are solutions of resin binders, such as cellulose derivatives, synthetic resins such as polyacrylates, polymethacrylates, polyesters, polyolefins and the like, in a suitable solvent. The solvent can be pine oil, terpineol, butyl carbitol acetate, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate and the like. The vehicles generally contain from about 5 5 to 25 percent by weight of the resin binder.
Thus the glasses of the invention comprise those glasses having a thermal coefficient of expansion near that of the support substrate material, will wet nickel oxide and can be fired at a temperature up to about 1000oC. Suitable glasses of the invcention include a glass comprising zinc 1 0 oxide, about 28.68% by weight, magnesium oxide, about 5.92% by weight, barium oxide, about 6.21% by weight, aluminum oxide, about 15.36% by weight, and silicon oxide, about 43.82% by weight and a glass comprising magnesium oxide, about 29% by weight; aluminum oxide, about 22% by weight, silicon oxide, about 45% by weight and up to about 4% by weight of 1 5 phosphorus oxide, boron oxide and zirconium oxide.
Fig. 4A illustrates a printed glass layer 20 over a via hole 22 in a metal substrate 24.
A vacuum is applied after the printing, beneath the metal substrate 24 in the direction of the arrow 25, sufficient to bring the glass ink layer 2 0 into the via hole 22, thereby forming an annular ring of the glass ink inside the via hole 22. This glass layer is then dried. The deposition and vacuum pull can be repeated to form multiple glass dielectric layers in the via hole 22. If both sides of the metal substrate 24 are to be used, the above sequence of steps is repeated on the opposite side of the metal substrate 2 5 24.
The support substrate is then fired to sinter the glass powder and form a composite fired glass insulator layer in the opening.
A thick via fill ink containing a conductive metal powder is then applied to the metal substrate, also using conventional screen printing 3 0 techniques. For example, a suitable conductor thick film ink comprises a mixture of silver or other conductive metal powder, glass, and an organic vehicle as described above in proportions so as to form a print screenable thick film paste.
Thick film conductor via fill inks are made by mixing a finely divided 3 5 conductive metal powder, with a preselected glass powder and an organic vehicle. Suitable conductive powders include silver, gold, copper, their mixtures, and alloys thereof with palladium and platinum and the like, or nickel. The fired thick film conductive metal ink can comprise from about 50-90% by weight of metal and about 10-50% by weight of a glass.
The thick film conductor via fill ink composition is applied to the prepared printed circuit board support substrate so as to fill the glass insulated via holes and is then fired to remove organic materials and to S sinter the metal powder to obtain the conductive, insulated feedthroughs.
Fig. 5 is a cross sectional view of the metal substrate 24 having dielectric insulated electrical feedthroughs therein. The via hole 22 in the metal substrate 24 has a first layer 22 of nickel oxide dielectric, two dielectric glass layers 26, 28 and a conductive via fill layer 30 therein.
1 0 Sufficient conductive via fill ink is applied so that the remainder of the via hole 22 is completely filled at the end of the process.
The support substrate as prepared above, having conductive vias in via openings that are dielectrically insulated from the rest of the substrate, can then be used to prepare double sided multilayer printed circuit boards 1 5 from the substrates of the invention in conventional manner.
The above process can be used to make a reproducible support substrate having a plurality of electrical feedthroughs therein that will not form short circuits between circuitry on both sides of the substrate. The support substrate having electrical feedthroughs as prepared above can 2 0 withstand several firings at temperatures used in making ceramic multilayer printed circuit boards without undermining the structural and electrical integrity of the feedthroughs.
Although the present process and electrical feedthroughs have been described in terms of specific embodiments, one skilled in the art can readily 2 5 substitute other materials and reaction conditions for the glass layers and conductors described hereinabove. Thus the scope of the present invention is only meant to be limited by the appended claims.
Claims (11)
1. A fired printed circuit board support substrate made of a metal have a via that is lined with a first nickel layer, a second dielectric nickel oxide layer, a dielectric glass layer over the nickel oxide layer, the via being filled with a conductive material comprising a mixture of conductive metal and a glass, the glass layer acting to electrically isolate the conductive material from the metal substrate, the glass layer having a thermal coefficient of expansion matched to that of the metal substrate.
2. The substrate of claim 1 wherein the support substrate is made of a metal selected from the group consisting of a ferronickel alloy, Kovar, and composites of Cu/a ferronickel alloy/Cu, Cu/Mo/Cu and Cu/Kovar/Cu.
3. The substrate of claim 1 wherein the support substrate material comprises a nickel plated composite selected from the group consisting of copper/molybdenum/copper, copper/Kovar/copper, copper/a ferronickel alloy/copper, Invar and Kovar.
4. The substrate of any one of claims 1 to 3 wherein the dielectric glass layer is selected from the group consisting of: (a) a glass comprising about 28.68% by weight of zinc oxide, about 5.92% by weight of magnesium oxide, about 6.21%
by weight of barium oxide, about 15.36% by weight of aluminum oxide and about 43.82% by weight of silicon oxide; and (b) a glass comprising about 29% by weight of magnesium oxide, about 22% by weight of aluminum oxide, about 45%
be weight of silicon oxide and up to about 4% by weight of oxides of phosphorus, boron and zirconium.
by weight of barium oxide, about 15.36% by weight of aluminum oxide and about 43.82% by weight of silicon oxide; and (b) a glass comprising about 29% by weight of magnesium oxide, about 22% by weight of aluminum oxide, about 45%
be weight of silicon oxide and up to about 4% by weight of oxides of phosphorus, boron and zirconium.
5. The substrate of any one of claims 1 to 4 wherein the conductive material comprises a mixture of conductive metal powder and of a glass that fills the via.
6. The substrate of claim 5 wherein the glass of the conductive material is selected from the group consisting of: (a) a glass comprising about 28.68% by weight of zinc oxide, about 5.92% by weight of magnesium oxide, about 6.21% by weight of barium oxide, about 15.36% by weight of aluminum oxide and about 43.82%
by weight of silicon oxide; and (b) a glass comprising about 29% by weight of magnesium oxide, about 22% by weight of aluminum oxide, about 45% by weight of silicon oxide and up to about 4% by weight of oxides of phosphorus, boron and zirconium.
by weight of silicon oxide; and (b) a glass comprising about 29% by weight of magnesium oxide, about 22% by weight of aluminum oxide, about 45% by weight of silicon oxide and up to about 4% by weight of oxides of phosphorus, boron and zirconium.
7. The substrate of claim 5 or 6 wherein the conductive metal powder is selected from the group consisting of silver, copper and gold.
8. A process for making electrical feedthroughs in a printed board metal support substrate for use in making double sided ceramic multiplayer circuit boards comprising;
a) forming via holes in the substrate;
b) electroplating a nickel lining inside the via holes;
c) forming a nickel oxide layer by oxidizing a surface of the nickel lining;
d) forming an electrically insulating layer by partially filling said via holes with a dielectric glass that has a thermal coefficient of expansion matched to that of the metal support substrate;
e) filling the holes with a thick film of conductor ink of a conductive metal powder and a glass of paragraph d) in an organic vehicle, and f) firing the substrate to remove organic materials and to sinter the metal -and glass (powders) in the via holes.
a) forming via holes in the substrate;
b) electroplating a nickel lining inside the via holes;
c) forming a nickel oxide layer by oxidizing a surface of the nickel lining;
d) forming an electrically insulating layer by partially filling said via holes with a dielectric glass that has a thermal coefficient of expansion matched to that of the metal support substrate;
e) filling the holes with a thick film of conductor ink of a conductive metal powder and a glass of paragraph d) in an organic vehicle, and f) firing the substrate to remove organic materials and to sinter the metal -and glass (powders) in the via holes.
9. The process of claim 8 wherein the dielectric glass is selected from the group consisting of: (a) a glass comprising about 28.68% by weight of zinc oxide, about 5.92% by weight of magnesium oxide, about 6.21% by weight of barium oxide, about 15.36% by weight of aluminum oxide and about 43.82% by weight of silicon oxide; and (b) a glass comprising about 29% by weight of magnesium oxide, about 22% by weight of aluminum oxide, about 45% by weight of silicon oxide and up to about 4% by weight of oxides of phosphorus, boron and zirconium.
10. The process of claim 8 or 9 wherein the substrate is selected from the group consisting of Invar, Kovar, copper/Kovar/copper composite, copper/ferronickel alloy/copper composite, and copper/molybdenum/copper composite.
11. The process of any one of claims 8 to 10 wherein the dielectric gas layer wets the oxidized nickel lining and can be fired at a temperature up to about 1000°C.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/379,264 US5565262A (en) | 1995-01-27 | 1995-01-27 | Electrical feedthroughs for ceramic circuit board support substrates |
| US08/379,264 | 1995-01-27 | ||
| PCT/US1996/000316 WO1996022881A1 (en) | 1995-01-27 | 1996-01-29 | Electrical feedthroughs for ceramic circuit board support substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2211542A1 CA2211542A1 (en) | 1996-08-01 |
| CA2211542C true CA2211542C (en) | 2006-07-04 |
Family
ID=36648505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002211542A Expired - Fee Related CA2211542C (en) | 1995-01-27 | 1996-01-29 | Electrical feedthroughs for ceramic circuit board support substrates |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2211542C (en) |
-
1996
- 1996-01-29 CA CA002211542A patent/CA2211542C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CA2211542A1 (en) | 1996-08-01 |
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