GB1431919A - Microcircuit packages - Google Patents

Microcircuit packages

Info

Publication number
GB1431919A
GB1431919A GB3860973A GB3860973A GB1431919A GB 1431919 A GB1431919 A GB 1431919A GB 3860973 A GB3860973 A GB 3860973A GB 3860973 A GB3860973 A GB 3860973A GB 1431919 A GB1431919 A GB 1431919A
Authority
GB
United Kingdom
Prior art keywords
solder
lid
paste
track
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3860973A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UK Atomic Energy Authority
Original Assignee
UK Atomic Energy Authority
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UK Atomic Energy Authority filed Critical UK Atomic Energy Authority
Priority to GB3860973A priority Critical patent/GB1431919A/en
Publication of GB1431919A publication Critical patent/GB1431919A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

1431919 Printed circuit assemblies UNITED KINGDOM ATOMIC ENERGY AUTHORITY 15 Aug 1974 [15 Aug 1973] 38609/73 Heading H1R In a microcircuit package an alumina substrate 1 has printed circuitry and interconnecting circuit members formed therein with inserted non-printed semiconductor chip components and with laterally extending connector pads 4; the whole enclosed by a solder bonded lid. The seal is formed by screen printing a track 5 round the circuitry overlying the pads 4 from a vitreous paste, drying, and firing; screen printing an overlay of solderable metal over the track 5 from metallized paste, drying, and firing to form a continuous solder track 7; and then positioning a solder preform thereon; solder coating the rim 3 of metal lid 2, positioning the rim on the preform, heating to flow the solder, and cooling. The enclosure may be evacuated and sealed or filled with inert gas through an orifice of the lid. The vitreous paste may be a mixture of a powdered refractory oxide, e.g. alumina or titania with a powdered borosilicate or lead glaze in a pine oil medium. The lid may be of Mo or Fe-Ni-Co alloy of similar coefficient of thermal expansion to the substrate, and nickel or copper plated to comprise bonding. Metallizing pastes may be e.g. Pt/Au, Pd/Au, Pd/Ag, Ag/Cu 2 D alloys, or Ag paste; and the solders may be various alloys of Sn, Pb, Bi, In, Cd, Ag, Au, Sb fluxed with rosin.
GB3860973A 1973-08-15 1973-08-15 Microcircuit packages Expired GB1431919A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3860973A GB1431919A (en) 1973-08-15 1973-08-15 Microcircuit packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3860973A GB1431919A (en) 1973-08-15 1973-08-15 Microcircuit packages

Publications (1)

Publication Number Publication Date
GB1431919A true GB1431919A (en) 1976-04-14

Family

ID=10404559

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3860973A Expired GB1431919A (en) 1973-08-15 1973-08-15 Microcircuit packages

Country Status (1)

Country Link
GB (1) GB1431919A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103025A1 (en) * 1982-03-02 1984-03-21 Mitsubishi Materials Corporation Pb ALLOY SOLDER FOR SEMICONDUCTOR DEVICE
FR2667981A1 (en) * 1990-10-12 1992-04-17 Thomson Csf METHOD OF ASSEMBLING TWO LAYERS CONSISTING OF DIFFERENT MATERIALS AND ITS APPLICATION TO HERMETIC ENCAPSULATION OF HYBRID CIRCUITS.
CN107108200A (en) * 2014-10-31 2017-08-29 通用电气公司 Lid and method for sealing non magnetic encapsulation
US10431509B2 (en) 2014-10-31 2019-10-01 General Electric Company Non-magnetic package and method of manufacture
CN115338500A (en) * 2022-09-16 2022-11-15 汕尾市栢林电子封装材料有限公司 Preparation method of prefabricated solder packaging assembly

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103025A1 (en) * 1982-03-02 1984-03-21 Mitsubishi Materials Corporation Pb ALLOY SOLDER FOR SEMICONDUCTOR DEVICE
EP0103025A4 (en) * 1982-03-02 1985-10-01 Mitsubishi Metal Corp Pb ALLOY SOLDER FOR SEMICONDUCTOR DEVICE.
DE3334291C2 (en) * 1982-03-02 1991-07-11 Mitsubishi Metal Corp Soft solder made of an alloy containing Pb for semiconductor devices
FR2667981A1 (en) * 1990-10-12 1992-04-17 Thomson Csf METHOD OF ASSEMBLING TWO LAYERS CONSISTING OF DIFFERENT MATERIALS AND ITS APPLICATION TO HERMETIC ENCAPSULATION OF HYBRID CIRCUITS.
EP0481846A1 (en) * 1990-10-12 1992-04-22 Thomson-Csf Assembly process of a metallic cover on a substrate comprising an integrated circuit
US5201456A (en) * 1990-10-12 1993-04-13 Thomson-Csf Process for assembly of a metal can on a substrate bearing an integrated circuit
CN107108200A (en) * 2014-10-31 2017-08-29 通用电气公司 Lid and method for sealing non magnetic encapsulation
US10196745B2 (en) * 2014-10-31 2019-02-05 General Electric Company Lid and method for sealing a non-magnetic package
US10208382B2 (en) * 2014-10-31 2019-02-19 General Electric Company Method for making a seam-sealable non-magnetic lid and package
US10431509B2 (en) 2014-10-31 2019-10-01 General Electric Company Non-magnetic package and method of manufacture
CN107108200B (en) * 2014-10-31 2019-12-13 通用电气公司 lid and method for sealing non-magnetic packages
US10804174B2 (en) 2014-10-31 2020-10-13 General Electric Company Non-magnetic package and method of manufacture
CN115338500A (en) * 2022-09-16 2022-11-15 汕尾市栢林电子封装材料有限公司 Preparation method of prefabricated solder packaging assembly
CN115338500B (en) * 2022-09-16 2023-08-15 汕尾市栢林电子封装材料有限公司 Preparation method of prefabricated solder packaging assembly

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee