JPH0427182Y2 - - Google Patents

Info

Publication number
JPH0427182Y2
JPH0427182Y2 JP1986171576U JP17157686U JPH0427182Y2 JP H0427182 Y2 JPH0427182 Y2 JP H0427182Y2 JP 1986171576 U JP1986171576 U JP 1986171576U JP 17157686 U JP17157686 U JP 17157686U JP H0427182 Y2 JPH0427182 Y2 JP H0427182Y2
Authority
JP
Japan
Prior art keywords
hole
printed circuit
chip
resist layer
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986171576U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6377376U (US07714131-20100511-C00038.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986171576U priority Critical patent/JPH0427182Y2/ja
Publication of JPS6377376U publication Critical patent/JPS6377376U/ja
Application granted granted Critical
Publication of JPH0427182Y2 publication Critical patent/JPH0427182Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP1986171576U 1986-11-07 1986-11-07 Expired JPH0427182Y2 (US07714131-20100511-C00038.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986171576U JPH0427182Y2 (US07714131-20100511-C00038.png) 1986-11-07 1986-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986171576U JPH0427182Y2 (US07714131-20100511-C00038.png) 1986-11-07 1986-11-07

Publications (2)

Publication Number Publication Date
JPS6377376U JPS6377376U (US07714131-20100511-C00038.png) 1988-05-23
JPH0427182Y2 true JPH0427182Y2 (US07714131-20100511-C00038.png) 1992-06-30

Family

ID=31107330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986171576U Expired JPH0427182Y2 (US07714131-20100511-C00038.png) 1986-11-07 1986-11-07

Country Status (1)

Country Link
JP (1) JPH0427182Y2 (US07714131-20100511-C00038.png)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5617991U (US07714131-20100511-C00038.png) * 1979-07-20 1981-02-17
JPS60110196A (ja) * 1983-11-18 1985-06-15 松下電器産業株式会社 スルホ−ル印刷配線板
JPS61188994A (ja) * 1985-02-18 1986-08-22 富士ファコム制御株式会社 プリント板のマ−キング方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5617991U (US07714131-20100511-C00038.png) * 1979-07-20 1981-02-17
JPS60110196A (ja) * 1983-11-18 1985-06-15 松下電器産業株式会社 スルホ−ル印刷配線板
JPS61188994A (ja) * 1985-02-18 1986-08-22 富士ファコム制御株式会社 プリント板のマ−キング方法

Also Published As

Publication number Publication date
JPS6377376U (US07714131-20100511-C00038.png) 1988-05-23

Similar Documents

Publication Publication Date Title
US6673690B2 (en) Method of mounting a passive component over an integrated circuit package substrate
JPH0427182Y2 (US07714131-20100511-C00038.png)
JPH08181166A (ja) プリント配線板
JPH08213747A (ja) 表面実装部品の実装方法
JPS63268286A (ja) 面実装部品
JP3392337B2 (ja) はんだ印刷用マスクおよびその製造方法
JPS6197893A (ja) 半田印刷用マスク
JP2500232Y2 (ja) 混成集積回路装置
JPH06349969A (ja) 印刷基板および半導体実装基板
JPS6138944U (ja) 半導体装置
KR0175423B1 (ko) 플립 칩 랜드 인쇄 마스크
JPH0116039B2 (US07714131-20100511-C00038.png)
JP3051132B2 (ja) 電子部品の実装方法
JPS635817Y2 (US07714131-20100511-C00038.png)
JPH0276290A (ja) チップ部品の実装方法
JPH0555736A (ja) チツプ部品実装法
JPS5897893A (ja) プリント板へのチツプ部品の実装方法
JPH10322002A (ja) プリント基板
JPS58166070U (ja) プリント配線板
JPS63144596A (ja) 厚膜形成方法
JPS5929065U (ja) プリント基板
JPH01245588A (ja) 配線基板
JPS6367360B2 (US07714131-20100511-C00038.png)
JPH0456190A (ja) 表面実装プリント配線板の製造方法
JPH0525768U (ja) フラツクスのすいあがり防止構造