JPH0426215B2 - - Google Patents

Info

Publication number
JPH0426215B2
JPH0426215B2 JP59117314A JP11731484A JPH0426215B2 JP H0426215 B2 JPH0426215 B2 JP H0426215B2 JP 59117314 A JP59117314 A JP 59117314A JP 11731484 A JP11731484 A JP 11731484A JP H0426215 B2 JPH0426215 B2 JP H0426215B2
Authority
JP
Japan
Prior art keywords
thin metal
wire
oxide film
semiconductor device
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59117314A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60261144A (ja
Inventor
Mitsuharu Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP59117314A priority Critical patent/JPS60261144A/ja
Publication of JPS60261144A publication Critical patent/JPS60261144A/ja
Publication of JPH0426215B2 publication Critical patent/JPH0426215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/075—
    • H10W72/522—
    • H10W72/543—
    • H10W72/5445—
    • H10W72/551—
    • H10W72/555—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP59117314A 1984-06-07 1984-06-07 半導体装置 Granted JPS60261144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59117314A JPS60261144A (ja) 1984-06-07 1984-06-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59117314A JPS60261144A (ja) 1984-06-07 1984-06-07 半導体装置

Publications (2)

Publication Number Publication Date
JPS60261144A JPS60261144A (ja) 1985-12-24
JPH0426215B2 true JPH0426215B2 (enExample) 1992-05-06

Family

ID=14708681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59117314A Granted JPS60261144A (ja) 1984-06-07 1984-06-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS60261144A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61174731A (ja) * 1985-01-30 1986-08-06 Toshiba Corp ワイヤボンデイング方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549577A (en) * 1977-06-24 1979-01-24 Shinkawa Seisakusho Kk Semiconductor
JPS5691306A (en) * 1979-12-21 1981-07-24 Nippon Electric Co Bonding wire
JPS5773934U (enExample) * 1980-10-22 1982-05-07

Also Published As

Publication number Publication date
JPS60261144A (ja) 1985-12-24

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