JPS549577A - Semiconductor - Google Patents

Semiconductor

Info

Publication number
JPS549577A
JPS549577A JP7449977A JP7449977A JPS549577A JP S549577 A JPS549577 A JP S549577A JP 7449977 A JP7449977 A JP 7449977A JP 7449977 A JP7449977 A JP 7449977A JP S549577 A JPS549577 A JP S549577A
Authority
JP
Japan
Prior art keywords
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7449977A
Other languages
Japanese (ja)
Inventor
Nobuhito Yamazaki
Yoshihiro Kazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP7449977A priority Critical patent/JPS549577A/en
Publication of JPS549577A publication Critical patent/JPS549577A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
JP7449977A 1977-06-24 1977-06-24 Semiconductor Pending JPS549577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7449977A JPS549577A (en) 1977-06-24 1977-06-24 Semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7449977A JPS549577A (en) 1977-06-24 1977-06-24 Semiconductor

Publications (1)

Publication Number Publication Date
JPS549577A true JPS549577A (en) 1979-01-24

Family

ID=13549051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7449977A Pending JPS549577A (en) 1977-06-24 1977-06-24 Semiconductor

Country Status (1)

Country Link
JP (1) JPS549577A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152137A (en) * 1981-03-13 1982-09-20 Hitachi Ltd Semiconductor package and manufacture thereof
JPS5924570A (en) * 1982-07-30 1984-02-08 Sintokogio Ltd Secondary cooling line of casting mold charged already with molten metal
JPS60261144A (en) * 1984-06-07 1985-12-24 Shinko Electric Ind Co Ltd Semiconductor device
JPS636146U (en) * 1986-06-27 1988-01-16
JPS63170065U (en) * 1987-04-17 1988-11-04

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152137A (en) * 1981-03-13 1982-09-20 Hitachi Ltd Semiconductor package and manufacture thereof
JPS5924570A (en) * 1982-07-30 1984-02-08 Sintokogio Ltd Secondary cooling line of casting mold charged already with molten metal
JPH0130590B2 (en) * 1982-07-30 1989-06-21 Sintokogio Ltd
JPS60261144A (en) * 1984-06-07 1985-12-24 Shinko Electric Ind Co Ltd Semiconductor device
JPH0426215B2 (en) * 1984-06-07 1992-05-06 Shinko Elec Ind
JPS636146U (en) * 1986-06-27 1988-01-16
JPH054923Y2 (en) * 1986-06-27 1993-02-08
JPS63170065U (en) * 1987-04-17 1988-11-04

Similar Documents

Publication Publication Date Title
JPS5460581A (en) Semiconductor
JPS5410672A (en) Semiconductor
JPS53136963A (en) Semiconductor
JPS5396683A (en) Semiconductor
JPS5452994A (en) Semiconductor
JPS53124982A (en) Semiconductor
JPS5419688A (en) Semiconductor
JPS5448490A (en) Semiconductor
JPS5410673A (en) Semiconductor
JPS53135584A (en) Semiconductor
JPS5397384A (en) Semiconductor
JPS53145581A (en) Semiconductor
JPS53112683A (en) Semiconductor
JPS5387184A (en) Semiconductor
JPS5438780A (en) Semiconductor
JPS5477076A (en) Semiconductor
JPS549577A (en) Semiconductor
JPS53115180A (en) Semiconductor
JPS5421168A (en) Semiconductor
JPS53105979A (en) Semiconductor
JPS53129987A (en) Semiconductor
JPS53105978A (en) Semiconductor
JPS542051A (en) Semiconductor
JPS5413280A (en) Semiconductor
JPS5457879A (en) Semiconductor