JPH0422340B2 - - Google Patents

Info

Publication number
JPH0422340B2
JPH0422340B2 JP59204729A JP20472984A JPH0422340B2 JP H0422340 B2 JPH0422340 B2 JP H0422340B2 JP 59204729 A JP59204729 A JP 59204729A JP 20472984 A JP20472984 A JP 20472984A JP H0422340 B2 JPH0422340 B2 JP H0422340B2
Authority
JP
Japan
Prior art keywords
lead frame
oxide film
heat sink
exposed portion
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59204729A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6182452A (ja
Inventor
Kazuhito Horikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Nippon Electric Co Ltd
Original Assignee
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Nippon Electric Co Ltd filed Critical Kansai Nippon Electric Co Ltd
Priority to JP59204729A priority Critical patent/JPS6182452A/ja
Publication of JPS6182452A publication Critical patent/JPS6182452A/ja
Publication of JPH0422340B2 publication Critical patent/JPH0422340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/045—Cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59204729A 1984-09-29 1984-09-29 電子部品の製造方法 Granted JPS6182452A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59204729A JPS6182452A (ja) 1984-09-29 1984-09-29 電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59204729A JPS6182452A (ja) 1984-09-29 1984-09-29 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS6182452A JPS6182452A (ja) 1986-04-26
JPH0422340B2 true JPH0422340B2 (enFirst) 1992-04-16

Family

ID=16495342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59204729A Granted JPS6182452A (ja) 1984-09-29 1984-09-29 電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS6182452A (enFirst)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015106570B4 (de) 2015-04-28 2016-12-15 AWS Schäfer Technologie GmbH Verfahren zum Induktionsbiegeumformen eines druckfesten Rohrs mit großer Wandstärke und großem Durchmesser

Also Published As

Publication number Publication date
JPS6182452A (ja) 1986-04-26

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