JPH0420700B2 - - Google Patents

Info

Publication number
JPH0420700B2
JPH0420700B2 JP59037182A JP3718284A JPH0420700B2 JP H0420700 B2 JPH0420700 B2 JP H0420700B2 JP 59037182 A JP59037182 A JP 59037182A JP 3718284 A JP3718284 A JP 3718284A JP H0420700 B2 JPH0420700 B2 JP H0420700B2
Authority
JP
Japan
Prior art keywords
solder
temperature
circuit board
substrate
microprocessor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59037182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59193759A (ja
Inventor
Raan Aamin
Eichi Daun Uiriamu
Doroin Maaseru
Jei Rutsudojiitsukutsu Masuyuu
Efu Basuzaado Jon
Daburyu Utsudogeito Rarufu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrovert Ltd
Original Assignee
Electrovert Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovert Ltd filed Critical Electrovert Ltd
Publication of JPS59193759A publication Critical patent/JPS59193759A/ja
Publication of JPH0420700B2 publication Critical patent/JPH0420700B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP59037182A 1983-02-28 1984-02-28 プリヒ−タおよびそれを用いた自動半田付け装置 Granted JPS59193759A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/470,494 US4632291A (en) 1983-02-28 1983-02-28 Automatic wave soldering machine
US470494 1983-02-28

Publications (2)

Publication Number Publication Date
JPS59193759A JPS59193759A (ja) 1984-11-02
JPH0420700B2 true JPH0420700B2 (enExample) 1992-04-06

Family

ID=23867844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59037182A Granted JPS59193759A (ja) 1983-02-28 1984-02-28 プリヒ−タおよびそれを用いた自動半田付け装置

Country Status (5)

Country Link
US (1) US4632291A (enExample)
EP (2) EP0118091B1 (enExample)
JP (1) JPS59193759A (enExample)
CA (1) CA1217571A (enExample)
DE (1) DE3482434D1 (enExample)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
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US4775776A (en) * 1983-02-28 1988-10-04 Electrovert Limited Multi stage heater
FR2572972B1 (fr) * 1984-11-15 1987-02-13 Outillages Scient Lab Machine de soudage.
FR2572970B1 (fr) * 1984-11-15 1987-02-13 Outillages Scient Lab Dispositif chauffant de generation d'une vague de soudure pour machine de soudage a la vague
JPS6240967A (ja) * 1985-08-19 1987-02-21 Tamura Kaken Kk はんだ付け方法
FR2587257A1 (fr) * 1985-09-16 1987-03-20 Outillages Scient Lab Unite de buse pour machine de soudure a la vague
US4725716A (en) * 1986-02-10 1988-02-16 Northern Telecom Limited Infrared apparatus for infrared soldering components on circuit boards
US4717064A (en) * 1986-08-15 1988-01-05 Unisys Corporation Wave solder finger shield apparatus
EP0280022A1 (de) * 1987-01-28 1988-08-31 Epm Ag Verfahren und Anlage zum Löten von bestückten Leiterplatten
JP2501334B2 (ja) * 1987-06-19 1996-05-29 松下電工株式会社 リフロ−炉
DE3809156A1 (de) * 1988-03-18 1989-09-28 Ernst Hohnerlein Verfahren und vorrichtung zum auftragen eines flussmittels
US4889273A (en) * 1988-06-16 1989-12-26 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
US4890781A (en) * 1988-08-04 1990-01-02 Texas Instruments Incorporated Automated flow solder machine
EP0364962A1 (de) * 1988-10-19 1990-04-25 Siemens Nixdorf Informationssysteme Aktiengesellschaft Anordnung zur Temperaturüberwachung beim Schwallöten von Flachbaugruppen
FR2641931A1 (fr) * 1989-01-17 1990-07-20 Orega Electro Mecanique Dispositif de soudage a la vague pour cartes de circuits imprimes
US5023848A (en) * 1989-05-15 1991-06-11 Highes Aircraft Company Solder wave dwell timer
US4981248A (en) * 1989-06-20 1991-01-01 Digital Equipment Corporation Electronically controlled wave solder mask shield
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering
US5150520A (en) * 1989-12-14 1992-09-29 The Allen Group Inc. Heat exchanger and method of assembly thereof
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
US5176312A (en) * 1991-08-12 1993-01-05 Brian Lowenthal Selective flow soldering apparatus
WO1993008949A1 (fr) * 1991-10-28 1993-05-13 Jacqueline Brizais Installation de soudage a la vague
FR2682903B1 (fr) * 1991-10-28 1994-01-21 Jacqueline Brizais Dispositif de controle de hauteur de vague dans une installation de soudage a la vague.
US5335843A (en) * 1993-10-13 1994-08-09 William Sund Soldering process and apparatus
US5601364A (en) * 1994-06-14 1997-02-11 Georgia Tech Research Corporation Method and apparatus for measuring thermal warpage
US5533663A (en) * 1994-11-21 1996-07-09 At&T Corp. Solder wave measurement device
US5538175A (en) * 1994-11-21 1996-07-23 At&T Corp. Adjustment of a solder wave process in real-time
US5767424A (en) * 1996-12-23 1998-06-16 Electronic Controls Design, Inc. Wave solder analyzer
DE19704764A1 (de) * 1997-02-08 1998-08-20 Bosch Gmbh Robert Vorrichtung und Verfahren zum Messen und/oder Regeln der Struktur einer Lötwelle
US6085960A (en) * 1997-03-04 2000-07-11 Samsung Electronics Co., Ltd. Apparatus for measuring the height of a solder wave
US6119915A (en) * 1997-05-07 2000-09-19 Mcms, Inc. Alignment fixture for solder-wave machines
DE29722696U1 (de) * 1997-12-22 1998-02-19 Siemens AG, 80333 München Vorrichtung zur Ausgabe eines Lötschwalls
US6471111B1 (en) * 1998-01-20 2002-10-29 Allen D. Hertz Method and apparatus for acoustic pressure assisted wave soldering
US6168065B1 (en) * 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
CA2375664C (en) 1999-06-02 2008-02-19 Speedline Technologies, Inc. Closed loop solder wave height control system
US6367677B1 (en) 1999-09-28 2002-04-09 Hill-Rom Services, Inc. Wave solder apparatus and method
JP3441067B2 (ja) * 2000-08-03 2003-08-25 株式会社大進工業研究所 ろう付装置
US6805282B2 (en) 2000-09-26 2004-10-19 Matsushita Electric Industrial Co., Ltd. Flow soldering process and apparatus
US6948650B2 (en) 2001-01-12 2005-09-27 Speedline Technologies, Inc. Dross removal and solder reclamation improvements
US6666370B2 (en) 2002-01-18 2003-12-23 Speedline Technologies, Inc. Solder-dross mixture separation method and apparatus
GB2373860B (en) * 2001-03-28 2004-12-15 Reflowtech Internat Ltd Monitoring system
JP3740041B2 (ja) 2001-08-31 2006-01-25 千住金属工業株式会社 プリント基板の部分はんだ付け方法
DE20116522U1 (de) 2001-10-09 2001-12-06 SEHO Systemtechnik GmbH, 97892 Kreuzwertheim Vorrichtung zum Verlöten von Leiterplatten
TW489694U (en) * 2001-10-24 2002-06-01 Asustek Comp Inc Device for increasing the height of tin wave of molten tin solder in tin tank
US7501601B2 (en) * 2003-09-03 2009-03-10 Xenetech U.S.A., Inc. Automated laser engraver
US7631796B2 (en) 2007-12-04 2009-12-15 Sony Corporation Selective soldering system
US7648056B1 (en) 2008-07-03 2010-01-19 Sony Corporation Selective soldering bath
TWI435674B (zh) * 2011-01-28 2014-04-21 Wistron Corp 焊接插件式元件於電路板之方法及焊接系統
KR102034820B1 (ko) * 2012-11-30 2019-11-08 삼성전자주식회사 반도체 칩 실장장치 및 이를 이용한 반도체 칩의 실장방법
JP6200182B2 (ja) * 2013-03-29 2017-09-20 株式会社デンソー 基板加熱装置及びはんだ付装置
DE102014110720A1 (de) * 2014-07-29 2016-02-04 Illinois Tool Works Inc. Lötmodul
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
US9370838B2 (en) 2014-08-21 2016-06-21 Illinois Tool Works Inc. Wave soldering nozzle system and method of wave soldering
CN107470731A (zh) * 2016-06-07 2017-12-15 苏州亿带亿路电子科技有限公司 Pcb板焊接设备
JP6849471B2 (ja) * 2017-02-15 2021-03-24 株式会社デンソーテン 圧送圧力調整装置および圧送圧力調整方法
US20190366460A1 (en) * 2018-06-01 2019-12-05 Progress Y&Y Corp. Soldering apparatus and solder nozzle module thereof
CN112296468A (zh) * 2020-10-22 2021-02-02 朱言文 一种微电子元器件的热连接保护装置
CN115570226A (zh) * 2021-07-05 2023-01-06 杭州晶志康电子科技有限公司 一种波峰焊温度调节系统及其调节方法
CN119747780A (zh) * 2024-12-30 2025-04-04 东莞顺达诚自动化科技有限公司 一种带上下预热的焊接机及电路板焊接方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3421888A (en) 1966-08-12 1969-01-14 Calumet & Hecla Corp Copper alloy
CA1002391A (en) * 1974-10-07 1976-12-28 Electrovert Ltd. - Electrovert Ltee Wave-soldering of printed circuits
GB1592368A (en) * 1976-10-18 1981-07-08 Texas Instruments Inc Automated manipulative operation system
US4180199A (en) * 1978-02-27 1979-12-25 Hollis Engineering, Inc. Mass soldering control system
US4196839A (en) * 1978-06-29 1980-04-08 International Telephone And Telegraph Corporation Methods of fabricating printed circuit boards
DE2842372A1 (de) * 1978-09-28 1980-04-10 Siemens Ag Speicherprogrammierbare steuerung
CH639580A5 (de) * 1979-01-23 1983-11-30 Karl Flury Loetanlage zum loeten von leiterplatten und verfahren zu deren betrieb.
JPS595494Y2 (ja) * 1979-10-04 1984-02-18 権士 近藤 プリント基板予備加熱装置
JPS6051940B2 (ja) * 1981-06-16 1985-11-16 松下電器産業株式会社 プリント基板半田付装置
US4446358A (en) * 1981-12-15 1984-05-01 Cooper Industries, Inc. Preheater for use in mass soldering apparatus
US4530457A (en) * 1982-01-12 1985-07-23 Electrovert Ltd. Wave-soldering of printed circuit boards
EP0119272B1 (en) * 1982-09-22 1989-05-03 Matsushita Electric Industrial Co., Ltd. Method and device for soldering printed board
US4566624A (en) * 1983-12-16 1986-01-28 Hollis Automation, Inc. Mass wave soldering system
JPS6224859A (ja) * 1985-07-24 1987-02-02 Kenji Kondo はんだ付け装置

Also Published As

Publication number Publication date
EP0118091B1 (en) 1990-06-06
JPS59193759A (ja) 1984-11-02
US4632291A (en) 1986-12-30
EP0269822A1 (en) 1988-06-08
CA1217571A (en) 1987-02-03
EP0118091A1 (en) 1984-09-12
DE3482434D1 (de) 1990-07-12

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