JPH0419707B2 - - Google Patents
Info
- Publication number
- JPH0419707B2 JPH0419707B2 JP56174307A JP17430781A JPH0419707B2 JP H0419707 B2 JPH0419707 B2 JP H0419707B2 JP 56174307 A JP56174307 A JP 56174307A JP 17430781 A JP17430781 A JP 17430781A JP H0419707 B2 JPH0419707 B2 JP H0419707B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- oxide film
- silicon
- silica
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 75
- 239000004065 semiconductor Substances 0.000 claims description 23
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 16
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 16
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 150000003377 silicon compounds Chemical class 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 description 31
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000010304 firing Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56174307A JPS5874043A (ja) | 1981-10-29 | 1981-10-29 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56174307A JPS5874043A (ja) | 1981-10-29 | 1981-10-29 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5874043A JPS5874043A (ja) | 1983-05-04 |
| JPH0419707B2 true JPH0419707B2 (ko) | 1992-03-31 |
Family
ID=15976364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56174307A Granted JPS5874043A (ja) | 1981-10-29 | 1981-10-29 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874043A (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60246652A (ja) * | 1984-05-22 | 1985-12-06 | Nec Corp | 平坦化導電体配線の形成方法 |
| JPH0770533B2 (ja) * | 1985-04-17 | 1995-07-31 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| JPS63207168A (ja) * | 1987-02-24 | 1988-08-26 | Seiko Epson Corp | Ｍｏｓ型半導体集積回路装置 |
| FR2625839B1 (fr) * | 1988-01-13 | 1991-04-26 | Sgs Thomson Microelectronics | Procede de passivation d'un circuit integre |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5133575A (ja) * | 1974-09-17 | 1976-03-22 | Nippon Telegraph & Telephone | Tasohaisenkozo |
| JPS5214365A (en) * | 1975-07-25 | 1977-02-03 | Hitachi Ltd | Process for formation of insulating membrane by spreading |
-
1981
- 1981-10-29 JP JP56174307A patent/JPS5874043A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5133575A (ja) * | 1974-09-17 | 1976-03-22 | Nippon Telegraph & Telephone | Tasohaisenkozo |
| JPS5214365A (en) * | 1975-07-25 | 1977-02-03 | Hitachi Ltd | Process for formation of insulating membrane by spreading |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5874043A (ja) | 1983-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3935083A (en) | Method of forming insulating film on interconnection layer | |
| JPH01225326A (ja) | 集積回路のパッシベーション方法 | |
| JPH01307247A (ja) | 半導体装置の製造方法 | |
| JPH063804B2 (ja) | 半導体装置製造方法 | |
| JPH0419707B2 (ko) | ||
| JPS63142A (ja) | 半導体装置の製造方法 | |
| JPH0555199A (ja) | 半導体装置 | |
| JPH06267943A (ja) | 半導体装置の製造方法 | |
| JPS58135645A (ja) | 半導体装置の製造方法 | |
| JPS6046036A (ja) | 半導体装置の製造方法 | |
| JPH05234991A (ja) | 半導体装置 | |
| JPH0117254B2 (ko) | ||
| JPS6227745B2 (ko) | ||
| JPS63160365A (ja) | 半導体装置用絶縁基板 | |
| JPH098137A (ja) | 半導体装置及びその製造方法 | |
| JPS646543B2 (ko) | ||
| JPH06349951A (ja) | 半導体装置の製造方法 | |
| JPH0555455A (ja) | 半導体装置の製造方法 | |
| JPH05267476A (ja) | 半導体装置の製造方法 | |
| JPS5852330B2 (ja) | 半導体装置の製造方法 | |
| JPS6248380B2 (ko) | ||
| JPS62174944A (ja) | 半導体装置の製造方法 | |
| JPS6230337A (ja) | 半導体集積回路装置 | |
| JPH01286444A (ja) | 半導体装置 | |
| JPS63226946A (ja) | 半導体装置 |