JPH041504B2 - - Google Patents
Info
- Publication number
- JPH041504B2 JPH041504B2 JP61117255A JP11725586A JPH041504B2 JP H041504 B2 JPH041504 B2 JP H041504B2 JP 61117255 A JP61117255 A JP 61117255A JP 11725586 A JP11725586 A JP 11725586A JP H041504 B2 JPH041504 B2 JP H041504B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tab
- free end
- leads
- dam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 37
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000000638 solvent extraction Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61117255A JPS61258462A (ja) | 1986-05-23 | 1986-05-23 | 電子部品の組立方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61117255A JPS61258462A (ja) | 1986-05-23 | 1986-05-23 | 電子部品の組立方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1146179A Division JPS55103789A (en) | 1979-02-05 | 1979-02-05 | Strucutre for mounting electronic part |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61258462A JPS61258462A (ja) | 1986-11-15 |
JPH041504B2 true JPH041504B2 (ro) | 1992-01-13 |
Family
ID=14707235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61117255A Granted JPS61258462A (ja) | 1986-05-23 | 1986-05-23 | 電子部品の組立方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61258462A (ro) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5141961A (en) * | 1974-10-07 | 1976-04-08 | Nippon Electric Co | Handotai shusekikairosochoriidofureemu |
JPS51115775A (en) * | 1975-04-04 | 1976-10-12 | Nec Corp | Semiconductor apparatus |
JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
JPS53141577A (en) * | 1977-05-17 | 1978-12-09 | Mitsubishi Electric Corp | Lead frame for integrated circuit |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5671897A (en) * | 1979-11-13 | 1981-06-15 | Sanyo Electric Co Ltd | Nonvolatile storage device |
JPS58215794A (ja) * | 1982-06-08 | 1983-12-15 | Toshiba Corp | 不揮発性メモリ装置 |
JPS59135600U (ja) * | 1983-02-25 | 1984-09-10 | 株式会社アドバンテスト | 書き換え可能な不揮発性メモリを有する電子機器 |
-
1986
- 1986-05-23 JP JP61117255A patent/JPS61258462A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5141961A (en) * | 1974-10-07 | 1976-04-08 | Nippon Electric Co | Handotai shusekikairosochoriidofureemu |
JPS51115775A (en) * | 1975-04-04 | 1976-10-12 | Nec Corp | Semiconductor apparatus |
JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
JPS53141577A (en) * | 1977-05-17 | 1978-12-09 | Mitsubishi Electric Corp | Lead frame for integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
JPS61258462A (ja) | 1986-11-15 |
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