JPH0413424B2 - - Google Patents

Info

Publication number
JPH0413424B2
JPH0413424B2 JP58144945A JP14494583A JPH0413424B2 JP H0413424 B2 JPH0413424 B2 JP H0413424B2 JP 58144945 A JP58144945 A JP 58144945A JP 14494583 A JP14494583 A JP 14494583A JP H0413424 B2 JPH0413424 B2 JP H0413424B2
Authority
JP
Japan
Prior art keywords
vacuum chamber
gate
shutter
space
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58144945A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6037139A (ja
Inventor
Katsuyoshi Kudo
Shinichiro Matsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58144945A priority Critical patent/JPS6037139A/ja
Publication of JPS6037139A publication Critical patent/JPS6037139A/ja
Publication of JPH0413424B2 publication Critical patent/JPH0413424B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lift Valve (AREA)
  • Details Of Valves (AREA)
  • Physical Vapour Deposition (AREA)
  • Intermediate Stations On Conveyors (AREA)
JP58144945A 1983-08-10 1983-08-10 ウェ−ハ移送経路におけるゲ−トバルブ機構 Granted JPS6037139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58144945A JPS6037139A (ja) 1983-08-10 1983-08-10 ウェ−ハ移送経路におけるゲ−トバルブ機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58144945A JPS6037139A (ja) 1983-08-10 1983-08-10 ウェ−ハ移送経路におけるゲ−トバルブ機構

Publications (2)

Publication Number Publication Date
JPS6037139A JPS6037139A (ja) 1985-02-26
JPH0413424B2 true JPH0413424B2 (enExample) 1992-03-09

Family

ID=15373837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58144945A Granted JPS6037139A (ja) 1983-08-10 1983-08-10 ウェ−ハ移送経路におけるゲ−トバルブ機構

Country Status (1)

Country Link
JP (1) JPS6037139A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2714839B2 (ja) * 1989-01-19 1998-02-16 日本真空技術株式会社 真空バルブ
JP5113016B2 (ja) * 2008-04-07 2013-01-09 東京エレクトロン株式会社 基板処理装置
JP5806827B2 (ja) * 2011-03-18 2015-11-10 東京エレクトロン株式会社 ゲートバルブ装置及び基板処理装置並びにその基板処理方法
JP6412670B1 (ja) * 2018-04-13 2018-10-24 株式会社ブイテックス ゲートバルブ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526799U (enExample) * 1978-08-10 1980-02-21
JPS5848559Y2 (ja) * 1981-02-17 1983-11-05 杉山道生 工業用加熱炉の扉開閉装置

Also Published As

Publication number Publication date
JPS6037139A (ja) 1985-02-26

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